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Std ID |
Description (Standard Title) |
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GB/T 4379-1984
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The family and products of cm8080/cm8085 microprocessor components for semiconductor integrated circuits
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GB/T 4855-1984
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Families and products of linear amplifier for semiconductor integrated circuits
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GB/T 3835-1983
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Families and products of interface circuits for semiconductor integrated circuits
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GB/T 3433-1982
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Families and products of HTL circuits for semiconductor integrated circuits
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GB/T 3437-1982
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Families and products of MOS memory for semiconductor integrated circuits
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GB/T 3438-1982
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Families and products of bipolar memory for semiconductor integrated circuits
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GB/T 45720-2025
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Semiconductor devices - Time dependent dielectric breakdown (TDDB) test for gate dielectric films
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GB/T 46280.1-2025
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Specification for chiplet interconnection interface - Part 1: General principles
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GB/T 46280.2-2025
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Specification for chiplet interconnection interface - Part 2: Protocol layer technical requirements
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GB/T 46280.3-2025
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Specification for chiplet interconnection interface - Part 3: Datalink layer technical requirements
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GB/T 46280.4-2025
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Specification for chiplet interconnection interface - Part 4: Physical layer technical requirements based on 2D package
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GB/T 46280.5-2025
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Specification for chiplet interconnection interface - Part 5: Physical layer technical requirements based on 2.5D package
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GB/T 43939-2024
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General test methods for servo circuits of quartz flexible accelerometers for space applications
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GB/T 43940-2024
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4 Mb/s digital time division command/response multiplex-data bus test plan
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GB/T 43931-2024
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General specification for microwave integrated circuit chip for aerospace
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GB/T 44775-2024
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Integrated circuit 3D packaging - Requirement for die stack process and evaluation
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GB/T 44791-2024
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Integrated circuit 3D packaging - Requirement for bumping-wafer-thining process and evaluation
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GB/T 44796-2024
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Integrated circuit 3D packaging - Requirement for bumping-wafer-sawing process and evaluation
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GB/T 15879.604-2023
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Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
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GB/T 42706.1-2023
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Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General
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GB/T 42972-2023
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Microwave circuits - Test methods for detector
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GB/T 43027-2023
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Measuring methods of converter modules for high voltage input power supplies
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GB/T 43040-2023
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Semiconductor integrated circuits - Test method of AC/DC converters
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GB/T 43061-2023
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Semiconductor integrated circuits - Test methods of PWM controller
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GB/T 43063-2023
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Integrated circuit - Test method for CMOS image sensors
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GB/T 43536.1-2023
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Three dimensional integrated circuit - Part 1: Terminologies and definitions
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GB/T 43538-2023
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Quality and technical requirements for metal packages used for integrated circuits
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GB/T 41852-2022
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Semiconductor devices-Micro-electromechanical devices - Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
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GB/T 41853-2022
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Semiconductor devices - Micro-electromechanical devices - Wafer to wafer bonding strength measurement
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GB/T 7092-2021
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Outline dimensions of semiconductor integrated circuits
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GB/T 38446-2020
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Micro-electromechanical system technology - Test methods for tensile property measurement of strip thin films
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GB/T 38447-2020
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Micro-electromechanical system technology - Fatigue testing method of MEMS structure using resonant vibration
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GB/T 38762.1-2020
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Geometrical product specifications (GPS) - Dimensional tolerancing - Part 1: Linear sizes
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GB/T 38762.2-2020
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Geometrical product specifications (GPS) - Dimensional tolerancing - Part 2: Dimensions other than linear or angular sizes
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GB/T 38762.3-2020
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Geometrical product specifications (GPS) - Dimensional tolerancing - Part 3: Angular sizes
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GB/T 15879.4-2019
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Mechanical standardization of semiconductor devices -- Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
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GB/T 38341-2019
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Micro-electromechanical system technology - The reliability test methods of MEMS in integrated environments
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GB/T 35005-2018
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Test methods for flip chip integrated circuits
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GB/T 35010.1-2018
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Semiconductor die products -- Part 1: Requirements for procurement and use
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GB/T 35010.2-2018
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Semiconductor die products -- Part 2: Exchange data formats
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GB/T 35010.3-2018
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Semiconductor die products -- Part 3: Guide for handling, packing and storage
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GB/T 35010.4-2018
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Semiconductor die products -- Part 4: Requirements for die users and suppliers
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GB/T 35010.5-2018
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Semiconductor die products -- Part 5: Requirements for concerning electrical simulation
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GB/T 35010.6-2018
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Semiconductor die products -- Part 6: Requirements for concerning thermal simulation
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GB/T 35010.7-2018
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Semiconductor die products -- Part 7: XML schema for data exchange
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GB/T 35010.8-2018
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Semiconductor die products -- Part 8: EXPRESS model schema for data exchange
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GB/T 35086-2018
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General specification for MEMS electric field sensor
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GB/T 36479-2018
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Integrated circuits -- Test methods for column grid array
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GB/T 15879.5-2018
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Mechanical standardization of semiconductor devices -- Part 5: Recommendations applying to tape automated bonding (TAB) of integrated circuits
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GB/T 36614-2018
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Integrated circuits -- Memory devices pin configuration
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GB/T 33922-2017
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Wafer level test methods for MEMS piezoresistive pressure-sensitive die performances
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GB/T 33929-2017
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Test methods of the performance for MEMS high g accelerometer
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GB/T 34893-2017
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Micro-electromechanical system technology -- Measuring method for in-plane length measurements of MEMS microstructures using an optical interferometer
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GB/T 34894-2017
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Micro-electromechanical system technology -- Measuring method for strain gradient measurements of MEMS microstructures using an optical interferometer
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GB/T 34898-2017
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Micro electromechanical system technology -- Test method for the nonlinear vibration of the MEMS resonant sensitive element
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GB/T 34899-2017
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Micro-electromechanical system technology -- Measuring method of microstructure surface stress based on Raman spectroscopy
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GB/T 34900-2017
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Micro-electromechanical system technology -- Measuring method for residual strain measurements of MEMS microstructures using an optical interferometer
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GB/T 32814-2016
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Silicon-based MEMS fabrication technology -- Specification for criterion of the SOI wafer based MEMS process
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GB/T 32815-2016
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Silicon-based MEMS fabrication technology -- Specification for criterion of the bulk silicon piezo resistance process
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GB/T 32816-2016
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Silicon-based MEMS fabrication technology -- Specification for criterion of the combination of the deep etching and bonding process
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GB/T 32817-2016
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Semiconductor devices -- Micro-electromechanical devices -- Generic specification for MEMS
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GB/T 20296-2012
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Mnemonics and symbols for integrated circuits
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GB/T 28274-2012
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Silicon-based MEMS fabrication technology -- The basic regulation of layout design
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GB/T 28275-2012
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Silicon-based MEMS fabrication technology -- Specification for KOH etch process
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GB/T 28276-2012
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Silicon-based MEMS fabrication technology -- Specification for dissolved wafer process
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GB/T 28277-2012
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Silicon-based MEMS fabrication technology -- Measurement method of cutting and pull-press strength of micro bonding area
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GB/T 26111-2010
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Micro-electromechanical system technology -- Terms
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GB/T 26112-2010
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Micro-electromechanical system technology -- General rules for the assessment of micro-mechanical parameters
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GB/T 26113-2010
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Micro-electromechanical system technology -- General rules for the assessment of micro-geometrical parameters
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GB/T 20296-2006
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Integrated circuit memory method and symbols
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GB/T 19248-2003
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Test method for measuring the resistance of package leads
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GB/T 17574-1998
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Semiconductor devices. Integrated circuits. Part 2: Digital integrated circuits
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GB/T 16464-1996
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Semiconductor devices. Integrated circuits. Part 1: General
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GB/T 16523-1996
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Specification for round quartz photomask substrates
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GB/T 16524-1996
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Specification for registration marks for photomasks
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GB/T 16525-1996
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Specification of leadframes for plastic leaded chip carrier packages
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GB/T 16526-1996
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Test method of measuring the lead-to-lead and loading capacitance of package leads
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GB/T 8976-1996
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Generic specification for film integrated circuits and hybrid film integrated circuits
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GB/T 15431-1995
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Generic specification for microcircuit modules
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GB/T 15876-1995
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Specification of leadframes for plastic quad flat package
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GB/T 15877-1995
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Specification of DIP leadframes produced by etching
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GB/T 15878-1995
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Specification of leadframes for small outline package
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GB/T 15879-1995
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Mechanical standardization of semiconductor devices. Part 5: Recommendations applying to tape automated bonding (TAB) of integrated circuits
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GB/T 15138-1994
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Case outlines for film integrated circuits and hybrid integrated circuits
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GB/T 14028-1992
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General principles of measuring methods of analogue switches for semiconductor integrated circuits
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GB/T 14030-1992
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General principles of measuring methods of timer circuits for semiconductor integrated circuits
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GB/T 14031-1992
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General principles of measuring methods of analogue phase-loop for semiconductor integrated circuits
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GB/T 14032-1992
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General principles of measuring methods of digital phase-locked loop for semiconductor integrated circuits
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GB/T 12750-1991
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Sectional specification for semiconductor integrated circuits, excluding hybrid circuits
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GB/T 12842-1991
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Terminology for film integrated circuits and hybrid film integrated circuits
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GB/T 13062-1991
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Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedure
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GB/T 3430-1989
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The rule of type designation for semiconductor integrated circuits
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GB/T 9178-1988
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Terminology for integrated circuits
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GB/T 18904.5-2003
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Semiconductor devices -- Part 12-5: Optoelectronic devices Blank detail specification for pin-photodiodes with/without pigtail for fibre optic systems or subsystems
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GB/T 18904.3-2002
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Semiconductor devices -- Part 12-3: Optoelectronic devices -- Blank detail specification for light-emitting diodes -- Display application
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GB/T 18904.4-2002
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Semiconductor devices -- Part 12-4: Optoelectronic devices -- Blank detail specification for pin-FET modules with/without pigtail for fiber optic systems or sub-systems
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GB/T 18910.103-2025
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Liquid crystal display devices - Part 10-3: Environmental, endurance and mechanical test methods - Glass strength and reliability
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GB/T 18910.64-2025
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Liquid crystal display devices - Part 6-4: Test methods - Liquid crystal displaymodules with dynamic backlight units
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GB/T 43590.506-2025
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Laser display devices - Part 5-6: Measuring methods for optical performance of projection screens
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GB/T 43590.507-2025
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Laser display devices - Part 5-7: Measuring methods of image quality affected by speckle for scanning laser displays
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