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GB/T 43931-2024: General specification for microwave integrated circuit chip for aerospace
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| Standard ID | Contents [version] | USD | STEP2 | [PDF] delivered in | Standard Title (Description) | Status | PDF |
| GB/T 43931-2024 | English | 539 |
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General specification for microwave integrated circuit chip for aerospace
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GB/T 43931-2024
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Basic data | Standard ID | GB/T 43931-2024 (GB/T43931-2024) | | Description (Translated English) | General specification for microwave integrated circuit chip for aerospace | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | L55 | | Classification of International Standard | 31.200 | | Word Count Estimation | 26,287 | | Date of Issue | 2024-06-29 | | Date of Implementation | 2024-10-01 | | Issuing agency(ies) | State Administration for Market Regulation, China National Standardization Administration | GB/T 43931-2024: General specification for microwave integrated circuit chip for aerospace---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
ICS 31.200
CCSL55
National Standards of People's Republic of China
General specification for microwave integrated circuit chips for aerospace use
Released on 2024-06-29
2024-10-01 Implementation
State Administration for Market Regulation
The National Standardization Administration issued
Table of Contents
Preface III
1 Scope 1
2 Normative references 1
3 Terms, definitions and abbreviations 1
3.1 Terms and Definitions 1
3.2 Abbreviations 1
4 Technical Requirements 2
4.1 General requirements 2
4.2 Chip Classification 2
4.3 Design, structure, materials and technology 2
4.4 Production process control 5
4.5 Electrical properties 5
4.6 Logo 5
4.7 Quality Assurance Requirements 5
4.8 ESDS 6
4.9 Radiation resistance level 6
4.10 Evaluation of Chip Hydrogen Tolerance 7
4.11 Wafer Quality Control 7
4.12 Traceability requirements 9
5 Quality Assurance Regulations 9
5.1 Inspection categories 9
5.2 Destructive and non-destructive tests 9
5.3 Environmental conditions for testing and inspection 9
5.4 Batch composition 9
5.5 Resubmission of unqualified batches 10
5.6 Samples for identification and quality consistency testing 10
5.7 Unqualified 10
5.8 Contractor screening 10
5.9 Failure 11
5.10 Identification and testing 11
5.11 Quality consistency inspection 12
5.12 Inspection Records 14
5.13 User acceptance 14
6 Delivery Preparation16
6.1 Packaging requirements 16
6.2 Storage requirements 17
6.3 Transport requirements 17
6.4 Documents to be provided upon delivery 17
7 Explanation 17
7.1 Intended use 17
7.2 Contents of ordering documents 17
7.3 Chip Usage Instructions 18
Appendix A (Normative) Wafer Batch Acceptance Requirements 19
Foreword
This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for standardization work Part 1.Structure and drafting rules for standardization documents"
Drafting.
Please note that some of the contents of this document may involve patents. The issuing organization of this document does not assume the responsibility for identifying patents.
This document was proposed and coordinated by the National Technical Committee for Standardization of Aerospace Technology and Its Applications (SAC/TC425).
This document was drafted by. China Electronics Technology Group Corporation No. 13 Research Institute, Xi'an Space Radio Technology Research Institute, China Electronics Science and Technology Group Corporation
The 55th Institute of Technology Group Corporation, Shanghai Precision Metrology and Testing Institute, and Guangzhou Tianji Electronic Technology Co., Ltd.
The main drafters of this document are. Lin Liyan, Fan Hailing, Wang Guoquan, Han Dong, Cui Bo, He Ting, Chen Zhe, Song Xiang, and Yang Junfeng.
General specification for microwave integrated circuit chips for aerospace use
1 Scope
This document specifies the technical requirements, quality assurance regulations and delivery preparation for microwave integrated circuit chips for aerospace use.
This document applies to the design, production and product quality assurance of aerospace microwave integrated circuit chips (hereinafter referred to as "chips").
2 Normative references
The contents of the following documents constitute the essential clauses of this document through normative references in this document.
For referenced documents without a date, only the version corresponding to that date applies to this document; for referenced documents without a date, the latest version (including all amendments) applies to
This document.
GB/T 2828.1-2012 Sampling procedures for inspection by attributes Part 1.Sampling for batch inspection based on acceptance quality limit (AQL)
plan
GB/T 2900 (all parts) Electrical terminology
GB/T 4937.17-2018 Mechanical and climatic test methods for semiconductor devices Part 17.Neutron irradiation
GB/T 4937.18-2018 Mechanical and climatic test methods for semiconductor devices Part 18.Ionizing radiation (total dose)
GB/T 4937.19-2018 Mechanical and climatic test methods for semiconductor devices Part 19.Die shear strength
GB/T 4937.22-2018 Mechanical and climatic test methods for semiconductor devices Part 22.Bond strength
GB/T 4937.23-2023 Mechanical and climatic test methods for semiconductor devices Part 23.High temperature operating life
GB/T 4937.26-2023 Mechanical and climatic test methods for semiconductor devices Part 26.Electrostatic discharge (ESD) sensitivity
Test Human Body Model (HBM)
GB/T 19403.1-2003 Semiconductor device integrated circuits Part 11.Part 1.Visual inspection of semiconductor integrated circuits
(excluding hybrid circuits)
GB/T 35010.1-2018 Semiconductor chip products Part 1.Procurement and use requirements
IEC 60749-6.2017 Semiconductor devices mechanical and climatic test methods Part 6.High temperature storage (Semiconductorde-
IEC 60749-25.2003 Mechanical and climatic test methods for semiconductor devices Part 25.Temperature cycling (Semiconductor
IEC 60749-36.2003 Mechanical and climatic test methods for semiconductor devices Part 36.Steady-state accelerated
3 Terms, definitions and abbreviations
3.1 Terms and Definitions
The terms and definitions defined in GB/T 2900 (all parts) and GB/T 35010.1-2018 apply to this document.
3.2 Abbreviations
The following abbreviations apply to this document.
DRC. Design Rule Check
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