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GB/T 35010.7-2018: Semiconductor die products -- Part 7: XML schema for data exchange
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| GB/T 35010.7-2018 | English | 644 |
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Semiconductor die products -- Part 7: XML schema for data exchange
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GB/T 35010.7-2018
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Basic data | Standard ID | GB/T 35010.7-2018 (GB/T35010.7-2018) | | Description (Translated English) | Semiconductor die products -- Part 7: XML schema for data exchange | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | L55 | | Classification of International Standard | 31.200 | | Word Count Estimation | 34,346 | | Date of Issue | 2018-03-15 | | Date of Implementation | 2018-08-01 | | Issuing agency(ies) | State Administration for Market Regulation, China National Standardization Administration | GB/T 35010.7-2018: Semiconductor die products -- Part 7: XML schema for data exchange---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Semiconductor die products--Part 7. XML schema for data exchange
ICS 31.200
L55
National Standards of People's Republic of China
Semiconductor chip products
Part 7. XML format for data exchange
(IEC /T R62258-7.2007, IDT)
Published by.2018-03-15
2018-08-01 Implementation
General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China
China National Standardization Administration released
Directory
Preface III
1 Scope 1
2 Normative references 1
3 Terms and Definitions 1
4 General 1
5 Data Exchange 2
Appendix A (Normative) XML Format 3
Appendix B (Informative) XML Example 19
Foreword
GB/T 35010 "Semiconductor Chip Products" is divided into the following parts.
--- Part 1. Procurement and use requirements;
--- Part 2. Data exchange format;
--- Part 3. Guidelines for handling, packaging, and storage;
--- Part 4. Chip user and supplier information table;
--- Part 5. Electrical Simulation Requirements;
--- Part 6. Thermal Simulation Requirements;
--- Part 7. XML format for data exchange;
--- Part 8. EXPRESS format for data exchange.
This part is Part 7 of GB/T 35010.
This section was drafted in accordance with the rules given in GB/T 1.1-2009.
This section uses the translation method equivalent to the use of IEC /T R62258-7.2007 "semiconductor chip product part 7. data exchange
XML format.
The Chinese documents that have a consistent correspondence with the normatively quoted international documents in this section are as follows.
---GB/T 2900 (all parts) Electrical terminology [IEC 60050 (all parts)]
--- GB/T 35010.1-2018 Semiconductor chip products - Part 1. Procurement and use (IEC 62258-1.2009, IDT)
--- GB/T 35010.2-2018 Semiconductor chip products Part 2. Data exchange format (IEC 62258-2.2011, IDT)
---GB/T 35010.4-2018 Semiconductor chip products Part 4. Chip user and supplier requirements (IEC /TR
62258-4.2012, IDT)
--- GB/T 35010.5-2018 Semiconductor chip products - Part 5. Electrical simulation requirements (IEC 62258-5.2006, IDT)
--- GB/T 35010.6-2018 Semiconductor chip products - Part 6. Thermal simulation requirements (IEC 62258-6.2006, IDT)
This section made the following editorial changes.
--- Deleted the third paragraph of Chapter 5 of IEC /T R62258-7.2007 on the electronic text of IEC /T R62258-7.2007
Take the method and use the required content;
--- Deleted references.
Please note that some of the contents of this document may involve patents. The issuing agency of this document does not assume responsibility for identifying these patents.
This section was proposed by the Ministry of Industry and Information Technology of the People's Republic of China.
This part is under the jurisdiction of the National Semiconductor Device Standardization Technical Committee (SAC/TC78).
This section was drafted by. China Electronics Technology Group Corporation No. 58 Research Institute, Peking University, Tsinghua University, Harbin Institute of Technology, China Microelectronics
Electronic Co., Ltd.
The main drafters of this section. Zhang Huibin, Lu Jian, Zhao Hua, Wang Fei, Wang Yating, Wang Ziqiang, Zhang Wei, Chen Yang
Semiconductor chip products
Part 7. XML format for data exchange
1 Scope
This part of GB/T 35010 is used to guide the production, supply and use of semiconductor chip products. One of the semiconductor chip products includes.
--- Wafers;
---Single bare chip;
--- Chips and wafers with interconnect structures;
--- Minimal or partially packaged chips and wafers.
This section specifies an XML format that defines the elements required for data exchange to meet IEC 62258-1, IEC 62258-
5. Implementation requirements of IEC 62258-6, supplementing the exchange structure defined in IEC 62258-2. This section is also complementary and compatible
Questionnaire in IEC /T R62258-4.
2 Normative references
The following documents are indispensable for the application of this document. For dated references, only dated versions apply to this article
Pieces. For undated references, the latest version (including all amendments) applies to this document.
IEC 60050 (all parts) Electrical vocabulary (International Electrotechnical Vocabulary)
IEC 62258-1 Semiconductor chip products Part 1. Procurement and use requirements (Semiconductor die products-Part
1.Requirementsforprocurementanduse)
IEC 62258-2 Semiconductor chip products Part 2. Data interchange formats (Semiconductor die products-Part 2.
Exchangedataformats)
IEC /TR62258-4 Semiconductor chip products Part 4. Chip user and supplier requirements (Semiconductordie
products-Part 4.Questionnairefordieusersandsuppliers)
IEC 62258-5 Semiconductor chip products - Part 5. Electrical simulation requirements (Semiconductordieproducts-Part 5.
Requirementsforinformationconcerningelectricalsimulation)
IEC 62258-6 Semiconductor chip products Part 6. Thermal simulation requirements (Semiconductor die products-Part 6. Re-
Quirementsforinformationconcerningthermalsimulation)
3 Terms and definitions
The terms and definitions defined by IEC 60050 (all parts) and IEC 62258-1 apply to this document.
4 General
The format in this section is consistent with Extensible Markup Language (XML).
This section requires chip device suppliers to provide users with the necessary and sufficient stages for the design, procurement, manufacturing, and testing of chip devices.
Information. The format in Appendix A defines an exchange mechanism that builds information for statements in the XML language. This is also for
To achieve the purpose of compliance with this section.
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