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GB/T 26112-2010: Micro-electromechanical system technology -- General rules for the assessment of micro-mechanical parameters
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Micro-electromechanical system technology -- General rules for the assessment of micro-mechanical parameters
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GB/T 26112-2010
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Basic data | Standard ID | GB/T 26112-2010 (GB/T26112-2010) | | Description (Translated English) | Micro-electromechanical system technology -- General rules for the assessment of micro-mechanical parameters | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | L55 | | Classification of International Standard | 31.2 | | Word Count Estimation | 13,154 | | Date of Issue | 1/10/2011 | | Date of Implementation | 10/1/2011 | | Quoted Standard | GB/T 26111, | | Regulation (derived from) | Announcement of Newly Approved National Standards 2011 No. (No. 166 overall) 1 | | Issuing agency(ies) | General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China | | Summary | This Standard specifies the basic principles of assessment micromechanical amount of assessment factors, assessment procedures, evaluation methods and assessment rules. This Standard is applicable to enterprises, research institutions, seizure detection mechanism in MEMS technology and product research, design, production, testing and use. | GB/T 26112-2010: Micro-electromechanical system technology -- General rules for the assessment of micro-mechanical parameters
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Micro-electromechanical system technology. General rules for the assessment of micro-mechanical parameters
ICS 31.200
L55
National Standards of People's Republic of China
Micro-electromechanical systems (MEMS) technology
General assessment of the amount of micro-mechanical
Issued on. 2011-01-10
2011-10-01 implementation
Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China
Standardization Administration of China released
Foreword
This standard was drafted in accordance with GB/T 1.1-2009 given rules.
This standard by the National MEMS Technology Standardization Technical Committee (SAC/TC336) and focal points.
This standard was drafted. Tianjin University, the machine Productivity Promotion Center, Xi'an Jiaotong University, Dalian University of Technology, Taiyuan University of Technology, China
Former Institute of Technology.
The main drafters of this standard. Hu Xiaodong, Ding Hongyu, Liu Wei, Zhang Ping, Jing Wei Xuan, Jiang Zhuang De, Liu Chong, ROCKETS, Zhao Zexiang.
Micro-electromechanical systems (MEMS) technology
General assessment of the amount of micro-mechanical
1 Scope
This standard specifies the basic principles of micro-mechanical assessment of the amount of assessment factors, assessment procedures, evaluation methods and assessment rules.
This standard applies to enterprises, research institutions, testing organizations engaged in MEMS technology and product research, design, production, testing and use.
2 Normative references
The following documents for the application of this document is essential. For dated references, only the edition are not applicable to the present
file. For undated references, the latest edition (including any amendments) applies to this document.
GB/T 26111 micro-electromechanical systems (MEMS) technology terms
3 Terms and Definitions
GB/T 26111 and defined by the following terms and definitions apply to this document.
3.1
Micromechanical amount of micro-mechanicalparameters
It refers to all the micro-mechanical nature and status of the relevant physical quantities, including geometry, flow, temperature, acoustics, mechanical and physical exercise;
Since the geometry, flow, temperature, acoustic and other physical quantities for a special classification, it refers to the amount of micro-mechanical displacement, velocity, acceleration, vibration
Motion parameters and other characteristics, and characteristics associated with the movement of the mechanical parameters.
3.2
Microdisplacement Microscaledisplacement
Description of particle in the micron-scale changes in the physical location, its size is equal to a straight line from the starting point to the end point, the direction from the starting point
end.
Note 1. micro structure under the conditions subject to certain incentives will produce changes in the position, change in position, there are two typical forms of translation and rotation, corresponding bit line
Shift and angular displacement.
Note 2. If the micro-structure of the substrate as a reference plane, and the plane parallel to the reference plane displacement of plane displacement, otherwise known plane displacement.
3.3
Vibration vibration
Reciprocating movement of the object. In the direction of the reciprocating motion can be divided into line vibration and angular vibration. Evaluation of the vibration characteristics of microstructures main package
Comprising. vibration amplitude, resonance frequency, vibration mode, the quality factor.
3.4
Residual Stress residualstress
After the micro-machining process is completed, there is no external force, the internal micromechanical structure and balance remaining stress, called residual
Stress is the combined effects of stress and external stress and thermal stress.
3.5
Stress gradient stressgradient
Micromechanical structure due to residual non-uniform distribution of residual stress in the thickness direction, suspended micromechanical structures in the lower portion of the sacrificial layer after release
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