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GB/T 35010.5-2018: Semiconductor die products -- Part 5: Requirements for concerning electrical simulation
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| Standard ID | Contents [version] | USD | STEP2 | [PDF] delivered in | Standard Title (Description) | Status | PDF |
| GB/T 35010.5-2018 | English | 184 |
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Semiconductor die products -- Part 5: Requirements for concerning electrical simulation
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GB/T 35010.5-2018
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Basic data | Standard ID | GB/T 35010.5-2018 (GB/T35010.5-2018) | | Description (Translated English) | Semiconductor die products -- Part 5: Requirements for concerning electrical simulation | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | L55 | | Classification of International Standard | 31.200 | | Word Count Estimation | 10,153 | | Date of Issue | 2018-03-15 | | Date of Implementation | 2018-08-01 | | Issuing agency(ies) | State Administration for Market Regulation, China National Standardization Administration | GB/T 35010.5-2018: Semiconductor die products -- Part 5: Requirements for concerning electrical simulation
---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Semiconductor die products--Part 5. Requirements for bringing electrical simulation
ICS 31.200
L55
National Standards of People's Republic of China
Semiconductor chip products
Part 5. Electrical Simulation Requirements
Part 5.Requirementsfor termselectricalsimulation
(IEC 62258-5.2006, Semiconductor die products -
Part 5.Requirementsforinformationconcerningelectricalsimulation,IDT)
Published by.2018-03-15
2018-08-01 Implementation
General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China
China National Standardization Administration released
Foreword
GB/T 35010 "Semiconductor Chip Products" is divided into the following parts.
--- Part 1. Procurement and use requirements;
--- Part 2. Data exchange format;
--- Part 3. Guidelines for handling, packaging and storage;
--- Part 4. Chip user and supplier requirements;
--- Part 5. Electrical Simulation Requirements;
--- Part 6. Thermal Simulation Requirements;
--- Part 7. XML format for data exchange;
--- Part 8. EXPRESS format for data exchange.
This part is Part 5 of GB/T 35010.
This section was drafted in accordance with the rules given in GB/T 1.1-2009.
This section uses the translation method equivalent to using IEC 62258-5.2006 "semiconductor chip products Part 5. electrical simulation information requirements."
The Chinese documents that have a consistent correspondence with the normatively quoted international documents in this section are as follows.
--- GB/T 35010.1-2018 Semiconductor chip products Part 1. Procurement and use requirements (IEC 62258-1.2009,
IDT)
--- GB/T 35010.2-2018 Semiconductor chip products Part 2. Data exchange format (IEC 62258-2.2011, IDT)
This section made the following editorial changes.
--- Taking into account the adaptation of our standards system, the name will be changed to "Semiconductor chip products - Part 5. Electrical simulation requirements".
Please note that some of the contents of this document may involve patents. The issuing agency of this document does not assume responsibility for identifying these patents.
This section was proposed by the Ministry of Industry and Information Technology of the People's Republic of China.
This part is under the jurisdiction of the National Semiconductor Device Standardization Technical Committee (SAC/TC78).
This section was drafted by. Beijing University, China Electronics Technology Group Corporation 13th Research Institute, Beijing Bochuang Technology Co., Ltd.,
Harbin Institute of Technology.
The main drafters of this section. Zhang Wei, Zhang Yating, Feng Yanlu, Cui Bo, Chen Demin, Liu Wei.
Semiconductor chip products
Part 5. Electrical Simulation Requirements
1 Scope
This part of GB/T 35010 is used to guide the production, supply and use of semiconductor chip products. Semiconductor chip products include.
● Wafers;
● Single bare chip;
● Chips and wafers with interconnect structures;
● Smallest or partially packaged chips and wafers.
This section provides the required electrical simulation information to promote the electronic data, electronic systems electrical behavior and functional verification simulation model
usage of. The electronic system includes a semiconductor bare chip with or without an interconnect structure, and/or a minimally packaged semiconductor chip. This section is
In order to make all aspects of the chip product supply chain meet the requirements of IEC 62258-1 and IEC 62258-2.
2 Normative references
The following documents are indispensable for the application of this document. For dated references, only dated versions apply to this article
Pieces. For undated references, the latest version (including all amendments) applies to this document.
IEC 62258-1 Semiconductor chip products Part 1. Procurement and use (Semiconductor die products-Part 1.
Procurementanduse)
IEC 62258-2 Semiconductor chip products Part 2. Data interchange formats (Semiconductor die products-Part 2.
Exchangedataformats)
3 Terms and definitions
The terms and definitions defined in IEC 62258-1 apply to this document.
4 General
According to the provisions of IEC 62258-1, the supplier of chip products should provide a complete data package, which should contain the user's design,
Necessary and sufficient information needed at all stages of procurement, manufacturing, and testing.
At the same time, most of the information provided should meet the relevant standards and be disclosed in the public domain, and the information source can be in the form of manufacturer data tables.
The traceability of the form does not require the manufacturer to assume the obligation of information disclosure. Any information involving patent or business sensitive information, manufacturers can adopt
Take a non-disclosed form for protection.
The requirements and recommendations provided in this section apply to the electrical model that performs the following simulations.
● Analysis of signal propagation within the electronic system;
● Verification of the functionality of the electronic system;
● verification of timing requirements;
● Verify testability.
See Appendix A for additional information on the electrical simulation model.
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