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GB/T 35010.2-2018 English PDF

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GB/T 35010.2-2018: Semiconductor die products -- Part 2: Exchange data formats
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Standard ID GB/T 35010.2-2018 (GB/T35010.2-2018)
Description (Translated English) Semiconductor die products -- Part 2: Exchange data formats
Sector / Industry National Standard (Recommended)
Classification of Chinese Standard L55
Classification of International Standard 31.200
Word Count Estimation 66,688
Date of Issue 2018-03-15
Date of Implementation 2018-08-01
Issuing agency(ies) State Administration for Market Regulation, China National Standardization Administration

GB/T 35010.2-2018: Semiconductor die products -- Part 2: Exchange data formats

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Semiconductor die products--Part 2. Exchange data formats ICS 31.200 L55 National Standards of People's Republic of China Semiconductor chip products Part 2. Data exchange format (IEC 62258-2.2011, IDT) Published on.2018-03-15 2018-08-01 implementation General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China China National Standardization Administration issued

Content

Foreword III 1 Scope 1 2 Normative references 1 3 Terms and Definitions 1 4 Requirements 1 5 Device Data Exchange Format (DDX) File Purpose and Usage 2 6 DDX file format and format rules 2 6.1 Data validity 2 6.2 character set 2 6.3 Grammar Rules 3 7 DDX file content 3 7.1 DDX file content rules 3 7.2 DDXDEVICE block syntax 5 7.3 DDX Data Syntax 6 8 DEVICE block parameter definition 6 8.0 General Usage Guide 6 8.1 Block Data 7 8.2 Device Data 8 8.3 Geometric data 11 8.4 Leading data 16 8.5 Material Data 24 8.6 Electrical and thermal rating data 26 8.7 Simulation Data 27 8.8 Operation, packaging, storage and equipment data 28 8.9 Wafer Characterization Data 29 8.10 Characteristic data of the bump terminal 32 8.11 Characteristic Data for Minimal Packaged Device (MPD) 34 8.12 Quality, Reliability and Test Data 35 8.13 Other data 36 8.14 Control data 36 Appendix A (informative) DDXDEVICE block instance 40 Appendix B (informative) Groups and replacements 43 Appendix C (informative) A typical CAD view of a DDX file block example given in Appendix A 46 Appendix D (informative) Simulation Features 47 Appendix E (informative) Graphical application of TERMINAL and TERMINAL_TYPE in CAD/CAM systems 49 Appendix F (informative appendix) and GB/T 17564.4-2009 comparison search 51 Appendix G (informative) Parameter VERSION and NAME comments 54 Appendix H (informative) Notes to parameter WAFER 55 Appendix I (informative) Additional notes 57 Appendix J (informative) Version 58 of DDX Appendix K (informative) Analytical Control 61 Figure 1 Relationship between geometric center and geometric origin 12 Figure C.1 CAD representation of the DDX instance in Appendix A 46 Figure E.1 highlighting the directional characteristics of MX and MY 50 Figure E.2 Directional characteristics of the protruding rotation angle 50 Figure H.1 illustrates the parameter WAFER 56 Table 1 Terminal shape type 17 Table 2 Terminal shape coordinates 18 Table 3 Terminal input/output type 20 Table 4 substrate connection parameters 25 Table B.1 7400 Device Gate Attribute Table 45 Table F.1 Parameter list 51 Table J.1 Parameter Version Table 58

Foreword

GB/T 35010 "Semiconductor Chip Products" is divided into the following sections. --- Part 1. Requirements for procurement and use; --- Part 2. Data exchange format; --- Part 3. Guide to handling, packaging and storage; --- Part 4. Chip user and supplier requirements; --- Part 5. Electrical simulation requirements; --- Part 6. Thermal simulation requirements; --- Part 7. XML format for data exchange; --- Part 8. EXPRESS format for data exchange. This part is the second part of GB/T 35010. This standard was drafted in accordance with the rules given in GB/T 1.1-2009. This section uses the translation method equivalent to IEC 62258-2.2011 "Semiconductor chip products Part 2. Data exchange format." The documents of our country that have a consistent correspondence with the international documents referenced in this part are as follows. --- GB/T 35010.1-2018 Semiconductor chip products - Part 1. Requirements for procurement and use (IEC 62258-1.2009, IDT) Please note that some of the contents of this document may involve patents. The issuing organization of this document is not responsible for identifying these patents. This part was proposed by the Ministry of Industry and Information Technology of the People's Republic of China. This part is under the jurisdiction of the National Semiconductor Device Standardization Technical Committee (SAC/TC78). This section drafted by. China Electronics Technology Group Corporation No. 58 Research Institute, China Electronics Technology Standardization Institute, China Electronic Technology Group 55 Research Institute, Tsinghua University, Huatian Technology (Kunshan) Electronics Co., Ltd. The main drafters of this section. Zhang Huibin, Lu Jian, Zhao Hua, Wang Fei, Chen Dawei. Semiconductor chip products Part 2. Data exchange format

1 Scope

This part of GB/T 35010 specifies the data format that can be used for data exchange. This format should be used in other parts of GB/T 35010. At the same time, all the parameters used are defined according to the guidelines and methods of GB/T 17564.4-2009. This section presents a device number According to the conversion (DDX) format, the main purpose is to promote the full transmission of geometric data between chip manufacturers and CAD/CAE users, and provide Formal information models that allow data to be converted to other formats, such as GB/T 16656.21-2008 and XML The STEP physical file format. Exceeding the scope of this section, in order to allow the use of the data conversion format, the format was specifically given Great flexibility. This section is used to guide the production, supply and use of semiconductor chip products. Among them, semiconductor chip products include. ● Wafer; ● a single bare chip; ● chips and wafers with interconnect structures; ● Minimal or partially packaged chips and wafers. The version of the DDX data format in this section is 1.3.0.

2 Normative references

The following documents are indispensable for the application of this document. For dated references, only dated versions apply to this article. Pieces. For undated references, the latest edition (including all amendments) applies to this document. GB/T 7408-2005 Data element and exchange format information exchange date and time representation (ISO 8601.2000, IDT) GB/T 16656.21-2008 Industrial automation systems and integrated products - Data presentation and exchange - Part 21 Pure text encoding of the exchange file structure (ISO 10303-21.2001, IDT) GB/T 17564.4-2009 Standard data element types and related classification modes for electronic components - Part 4. IEC standard number According to the element type and component category benchmark set (IEC 61360-4.2005, IDT) IEC 62258-1 Semiconductor Chip Products Part 1. Procurement and Use (Semiconductordieproducts-Part 1. Procurementanduse) SJ/Z9047-1987 Information processing information exchange is used in string form numerical representation (idtISO 6093.1985) IPC/JEDECJ-STD-033B.2007 Processing, packaging, and navigation of surface mount devices sensitive to the combined effects of moisture and soldering heat Handling, packing, shippinganduseofmoisture/Reflowsensitivesurfacemountdevices

3 Terms and definitions

The terms and definitions defined in IEC 62258-1 apply to this document.

4 requirements

The parameter variable specifically refers to the GB/T 17564.4-2009 data element type (DET) encoding, which is defined in GB/T 17564.4- 2009 embodiment. 5 Device Data Exchange Format (DDX) file purpose and usage 5.1 In order to facilitate the conversion of data between the device vendor and the terminal CAD/CAE system user through the electronic medium, the data grid should be used. The file is device data exchange (DDX). In order to allow for enhancements and extensions for future use, this data file format is intentionally reserved. Flexibility. 5.2 It is strongly recommended that the device data exchange file use the 3-letter DDX as the file extension. Here, the device data exchange format should be called For DDX files. 5.3 Data transferred from the device vendor to the user shall be contained in a separate computer-readable DDX file, and this file shall be The content should at least meet a geometric CAD/CAE software design system. The original text in this document should be readable for simplicity The person is checking. 5.4 DDX files and its data should be independent of the computer and operating system. 5.5 DDX file content should contain mechanical and interconnection information, but can also contain electronic and functional data. 5.6 DDX files may contain data for one or more devices and shall be used as a repository file for the CAD/CAE software design system. A DDX file can contain one or more sets of data for the same device type, each with a different transfer mode, such as bump chips, bare chips, and cores. Chip-level packaging. 5.7 DDX files should be able to be generated simply or automatically, for example via an ASCII text editor or spreadsheet software. 5.8 DDX files should be able to reference some external files, such as simulation and thermal model files. 5.9 All data should be defined in a way that can be converted to and from other exchange formats, such as chips such as GDSII and CIF. Geometric data. In order to support the simple conversion of some DIE (Chip Information Exchange) data files, compatibility with existing DIE data is required. May be close. 5.10 The parameter definition shall be consistent with GB/T 17564.4-2009 (see Chapter 5 of IEC 62258-1).

6 DDX file format and format rules

Note 1. The 1.2.1 version of DDX included in ES59008-6-1 replaces version 1.0.0. Note 2. Version 1.3.0 of DDX included in IEC 62258-2.2005 replaces version 1.2.1. See the DDX version in Chapter 1 of this section. 6.1 Data validity 6.1.1 All data that does not follow the data syntax rules (see 7.3) should be treated as comments and will therefore be ignored. 6.1.2 All mandatory data should be defined before use. Undefined data should indicate an error and the display data is not available. 6.1.3 Mathematical operations, calculations or formulas shall not be allowed to appear inside digital data. 6.2 character set 6.2.1 The DDX file should be an ASCII-compatible text file with an appropriate line terminator. Line terminator System decision. DOS/Windows generally uses the carriage return/line feed "CR/LF" as the terminator (ASCII0Dh/0Ah), however UNIX The system generally only needs the newline character "LF" (ASCII0x0A), and the carriage return symbol "CR" (ASCII0x0D) is the default and will not be displayed. 6.2.2 The fields allowed for ASCII characters are 0x00~0x7F, and the remaining parts from 0x80~0xFF should be ignored. 6.2.3 All text data should be case-independent. 6.2.4 Space characters (ASCII20h) and tabs (ASCII09h) should be treated as delimiters. Multiple spaces and tabs are considered syntactically. Make a separate separator. 6.3 Grammar rules 6.3.1 All data lines shall be terminated with a semicolon ";". 6.3.2 The comma "," shall be used as the data separator. 6.3.3 with the symbol " In a separate file. Each DEVICE block is unique and should contain only data about one device and has specific Device format. All data within each DEVICE block shall be considered local and unique only within the current block (see 6.3.4). 7.1.2 Parameter Type There are two types of parameters for data, structure, and variables, and these parameters should only appear inside the DEVICE block. ● A structure determines a collection or a collection of data with different data types; ● A variable is equivalent to one or more data of a single data type. 7.1.3 Data Type The data types are as follows. 7.1.3.1 Text string data All ASCII characters from 20h to 7Fh are allowed in text data, while characters of ASCII80h and above should be ignored. In order to be able to print underlined or underlined characters, special printing or display control characters can be considered. It is recommended to place text string data In pairs of double quotes, see 6.3.7. 7.1.3.2 Text Name Data All names should be unique and should consist of only the following character sets from ASCII. A~Z a~z 0~9 $ - % When text name data is used as the constituent file name, it is recommended to limit the file name to 8 characters and the file extension limit Within 3 characters, the two are separated by a separator ".", which is consistent with the general operating system. It is recommended to place the text name data in In pairs of double quotes, see 6.3.7. It is worth noting that all text name data is case-independent, and no space characters are allowed in a text name. 7.1.3.3 Real data The real data representation shall be consistent with SJ/Z9047-1987 and shall consist of the following characters. 0~9 - .Ee Values can be positive or negative, expressed in engineering or scientific notation, but should not contain orders of magnitude. E.g. 90008, 9000.80, 9.0008E5, -5207, -5.207E3, 0.102, 102E-3 Note that the comma "," here is used as the data separator, so the decimal point "." should not be used instead. 7.1.3.4 Integer data The integer data value should be consistent with SJ/Z9047-1987, and only characters 0~9 are allowed. Integers should have no positive or negative points and should not be included Contains orders of magnitude. In combination with the actual situation, the integer should be limited to 16 bits, for example, only 0~65536 and the integer values including 0 and 65536 are connected. Accepted. 7.1.3.5 Date data The date data value should be consistent with GB/T 7408-2005 and can include time information. E.g. "YYYY-MM-DD", "YYYYMMDD", "YYYY-MM-DDTHH.MM.SS". 7.1.4 Forward reference To allow one-way parsing, all variable identifiers or variable names should not be referenced before they are defined. 7.1.5 units All units shall be in the International System of Units except for the geometric units of micrometers (10-6 m), inches and mils (10-3 in). In a separate In the DEVICE block, there should be only one order of magnitude. It is worth noting that inches and mils are not recommended units, they are only Some continuation of idioms appears. 7.1.6 Coordinate data In all coordinate data, the X coordinate should be before the Y coordinate, and the Y coordinate should be before the Z coordinate (for example, X, Y or X, Y, Z). The X coordinate should be the horizontal axis (the number increases from left to right), the Y coordinate should be the vertical axis (the number increases from bottom to top), and the Z coordinate should be deep Degree axis (numbers increase from near to far). 7.1.7 Reserved words All parameter names should be treated as reserved, no variable identifiers or scalar names should be allowed to have the same name. But this restriction is in the band Invalid text data with quotes or double quotes (see 7.1.3.1 and 7.1.3.2). 7.2 DDXDEVICE block syntax DEVICEdevice_namedevice_form { Device related data A DDX file can contain one or more DEVICE blocks, and all data for a particular device should be embedded in the relevant block (see 6.1.1). And 7.1.1). A DEVICE block begins with the DEVICE keyword and the leading braces "{" (shown above) with the corresponding back braces "}" End. Data not included in the DEVICE block structure should be treated as a comment, allowing future verification information, file creation date and history to be added in the future. Data, etc., this information is in the DDX file and therefore does not affect the actual device data. Device_name represents the name of the device that should be referenced, and device_form represents the mechanical form of the device to which the block data belongs. The variable device_form represents the type of device being referenced, including. ● bare chip; ● bump chip; ● There are lead frame chips; ● The smallest packaged device (or MPD). More device_form types can be added later, see GB/T 17564.4-2009, AAD004-001, "Chip Types" for more details. coding". Only one DEVICE block with device_name of type device_form should appear in a DDX file, but duplicate Device_name or device_form is allowed. An example of a typical DDX file convention for a DEVICE block. DEVICEname1bare_die{ relevantdataforDEVICE "name1" asabaredie. DEVICEname1bumped_die{ relevantdataforDEVICE "name1" asabumpeddie. DEVICEname2mpd{ relevantdataforDEVICE "name2" asaminimalypackagedDEVICE. DEVICEname2bare_die{ relevantdataforDEVICE "name2" asabaredie. DEVICEname1mpd{ relevantdataforDEVICE "name1" asaminimalypackagedDEVICE. DEVICEname3bare_die{ relevantdataforDEVICE "name3" asabaredie. In the above example, there are three occurrences of the DEVICE block of the device "name1", and two types of DEVICE blocks of the device "name2" appear. Situation, but each shows a different device_form. The order of the DEVICE blocks is not relevant. 7.3 DDX data syntax Property=value[,value]; \u003cproperty\u003e [equateseparator] \u003cvalue/variable{separator\u003cvalue/variable\u003e } >[dataterminator][line Terminator] \u003cproperty\u003e ..= Parametername [space] ..= {spacecharacter(20h)ortabcharacter(09h)}0 [equateseparator] ..= [space]{equal=}[space] [separator] ..= [space]{comma,}[space] [dataterminator] ..= [space]{semicolon;} [lineterminator] ..= CRorCR/LF} Example. Thickness = 100.0; Thickness=470; Geometric_units=micron; Geometricunits = micron; GeometricUnits= “milimetres”; Terminal_type= T1,Circle,220; Terminal_Type= T2, Rectangle,.200, 250; TerminalType= T2, O, (200, 250); TERMINALTYPE = T2, O,.200, 250; As shown above, terminal_type, Terminal_Type, TerminalType and TERMINALTYPE will all reference the same parameter. Number name.

8 DEVICE block parameter definition

8.0 General Usage Guide 8.0.1 Device Form Guide When the device_form of a parameter is unique, the prefix of this parameter is as follows, as defined in the DEVICE block. 8.0.1.1 The DIE_ data parameter refers to the bare chip or bump chip form. 8.0.1.2 The BUMP_ data parameter refers only to bumped chips. 8.0.1.3 MPD_ Data parameters refer to the smallest packaged device, such as CSP. 8.0.1.4 WAFER_ Data parameters refer to wafer level chip device delivery. 8.0.1.5 The LEAD_ data parameter refers to a chip device with a lead frame. 8.0.2 Data Parameter Terms In the directory of data parameters (see 8.1), the relevant terms are as follows. 8.0.2.1 Parameter name, used as a statement in the DDX file. 8.0.2.2 Parameter type indicating a variable or structure data type. 8.0.2.3 Parameter function determines its usage and meaning. 8.0.2.4 Parameter value indicating the required data type. 8.0.2.5 Any parameter restrictions indicating any restrictions within the DEVICE block. 8.0.2.6 Parameter dependencies, emphasizing the parameters that need to be defined before the call. 8.0.2.7 One or more practical examples. 8.0.2.8 Other relevant notes. Appendix F provides a brief parameter table, Appendix A provides a complete DDXDEVICE block working example, and attached The required image output is provided in Record C. All parameters shall be consistent with the GB/T 17564.4-2009 Data Element Type (DET) code, which is coded in GB/T 17564.4- Defined in.2009. See Appendix F as a search form. 8.0.3 Terms and conventions An electrical connection point is called a terminal. This can be a bonding area of a bare chip, or equivalent to the need to interconnect media The desired landing point or connection coverage area. The general rule of the chip is that the top left corner of the chip has a start number labeled 1, and other references The output or pin number is incremented in a counterclockwise direction. The X-axis coordinates represent the length of the horizontal plane and increase from left to right in positive numbers. Y-axis coordinates represent the horizontal plane width, with a positive number Forms are incremented in a way that is far from the user's perspective. The Z-axis coordinates represent the vertical height and are incremented from bottom to top in positive numbers (for observers) Direction). As a point of reference, all chip components, including bumped chips, are typically viewed from above the active area. 8.0.4 Description of general rules 8.0.4.1 All valid data shall be included in the DEVICE block (see 7.1.1). 8.0.4.2 Any local or unique parameters, such as names, should be defined prior to use. 8.0.4.3 All parameters shall be consistent with the GB/T 17564.4-2009DET code, which is coded in GB/T 17564.4-2009 Definition (see 5.8 and Appendix F). 8.0.4.4 The unit of measure GEOMETRIC_UNITS shall be defined before any geometric variables are defined. 8.0.4.5 Geometric origin GEOMETRIC_ORIGIN and geometric perspective GEOMETRIC_VIEW should be before any geometric coordinates are defined Define first. 8.0.4.6 The TERMINAL_COUNT parameter shall be defined before any TERMINAL parameters are called, and the TERMINAL parameter The number should not exceed the value of TERMINAL_COUNT. 8.0.4.7 The TERMINAL_TYPE_COUNT parameter shall be defined before any TERMINAL_TYPE parameter is called, and The number of TERMINAL_TYPE parameters should not exceed the value of the parameter TERMINAL_TYPE_COUNT. 8.1 block data 8.1.1 DEVICE_NAME parameter It is defined in the DEVICE block header by the device_name parameter. Parameter name device_name Parameter type variable, see 7.2 About DEVICE block content The parameter function defines the device manufacturer's type number or reference name Parameter value text name data, such as 7.1.3.2 Example. SN74LS04 See 7.1.7, 7.2 and Appendix G for reference. 8.1.2 DEVICE_FORM parameter The device type is defined by the device_form parameter in the DEVICE block header statement. Parameter name device_form Parameter type variable, see 7.2 About DEVICE block content Parameter function defines the physical form of the device Parameter value text string data, such as 7.1.3.1 Examples. bare_die, bumped_die, MPD. References 7.2 and Appendix G 8.1.3 BLOCK_VISION parameter Parameter name BLOCK_VERSION Parameter type variable The parameter function specifies the version number or release number of the DEVICE block. Parameter value text string data, such as 7.1.3.1 Restricted in one.

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