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GB/T 42706.1-2023: Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General
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Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General
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GB/T 42706.1-2023
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Basic data | Standard ID | GB/T 42706.1-2023 (GB/T42706.1-2023) | | Description (Translated English) | Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | L55 | | Classification of International Standard | 31.020 | | Word Count Estimation | 32,315 | | Date of Issue | 2023-05-23 | | Date of Implementation | 2023-09-01 | | Issuing agency(ies) | State Administration for Market Regulation, China National Standardization Administration | GB/T 42706.1-2023: Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General
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ICS31:020
CCSL55
National Standards of People's Republic of China
GB/T 42706:1-2023/IEC 62435-1:2017
Long-term storage of electronic components and semiconductor devices
Part 1: General
Part 1:General
(IEC 62435-1:2017, IDT)
Released on 2023-05-23
2023-09-01 Implementation
State Administration for Market Regulation
Released by the National Standardization Management Committee
table of contents
Preface III
Introduction IV
1 Scope 1
2 Normative references 1
3 Terms, Definitions and Abbreviations 1
3:1 Terms and Definitions 1
3:2 Abbreviations 2
4 Purpose of long-term storage 2
4:1 General 2
4:2 Storage decision basis 2
4:3 Causes and methods 4
4:4 Market situation 4
4:5 Risk Control and Insurance 5
4:6 Delayed phase-out 5
5 Logistics 5
5:1 Purchasing Requirements 5
5:2 Basic storage unit 6
5:3 Inventory Management 6
5:4 Redundancy 6
5:5 Storage scheme 6
5:6 Outbound 7
5:7 Periodic Inspection of Components 7
6 Precautions for storage after device assembly 8
7 operation 8
8 visual inspection 8
9 Inventory Control Process 8
10 Transport 9
11 Lead Plating 9
12 sets of distribution and batch management9
13 confirm 9
14 Unplanned storage and storage types 9
14:1 Storage type 9
14:2 Unplanned storage9
15 Storage items other than components 10
15:1 Related data 10
15:2 Device 10
16 storage facilities 10
16:1 Comprehensive cost 10
16:2 Physical protection and security10
16:3 Location and surroundings 10
17 program file 10
17:1 General 10
17:2 Supply chain 11
17:3 Restart the production chain 11
18 Environmental Laws 11
Appendix A (Informative) Project Management Checklist Example 12
Appendix B (Normative) Long-term Storage Checklist Example 14
Appendix C (Informative) Component List Example 15
C:1 Components list 15
C:2 Data description 16
Appendix D (informative) Periodic inspection and delivery inspection example 17
Appendix E (Informative) Factors Affecting the Storage Volume of Components 19
Reference 20
foreword
This document is in accordance with the provisions of GB/T 1:1-2020 "Guidelines for Standardization Work Part 1: Structure and Drafting Rules for Standardization Documents"
drafting:
This document is part 1 of GB/T 42706 "Long-term Storage of Electronic Components and Semiconductor Devices": GB/T 42706 has been issued
the following sections:
--- Part 1: General;
--- Part 2: Degradation mechanism;
--- Part 5: Chips and wafers:
This document is equivalent to IEC 62435-1:2017 "Long-term storage of electronic components and semiconductor devices - Part 1: General rules":
The following minimal editorial changes have been made to this document:
a) "VP" in Table D:1 is changed to "V";
b) "Reference", "Text" and "Auditresponse" in Table B:1 do not match the content of the table header, have no specific meaning, and have been deleted;
c) Adjusted some references:
Please note that some contents of this document may refer to patents: The issuing agency of this document assumes no responsibility for identifying patents:
This document is proposed by the Ministry of Industry and Information Technology of the People's Republic of China:
This document is under the jurisdiction of the National Semiconductor Device Standardization Technical Committee (SAC/TC78):
This document is drafted by: The Thirteenth Research Institute of China Electronics Technology Group Corporation, Guangdong Tiange Acoustic Technology Co:, Ltd:, Industry and Information Technology
The Fifth Research Institute of Electronics of the Ministry of Chemical Industry, the Military Representative Office of the Military Representative Bureau of the Ministry of Equipment Development in Wuhan, Zhuhai Zicheng Electronic Technology Co:, Ltd:,
Huizhou Techuang Electronic Technology Co:, Ltd:, Qingdao Jinhuiyuan Electronics Co:, Ltd:, Shenzhen Lishengmei Semiconductor Co:, Ltd:, Jiangxi
Sujiejie Microelectronics Co:, Ltd:, Ningbo Jiangfeng Electronic Materials Co:, Ltd:, Foshan Yifeng Electric Industrial Co:, Ltd:, Hebei North
Core Semiconductor Technology Co:, Ltd:, Shenzhen Hexin Valley Microelectronics Co:, Ltd:, Tailong (Fujian) Commercial Lighting Co:, Ltd:, Foshan Weiaoyun
Biotechnology Co:, Ltd:, Guangdong Powell Electronic Technology Co:, Ltd:
The main drafters of this document: Zhang Xin, Huang Xiaogang, Yang Shaohua, Qiu Yu, Jin Lihua, Shi Dongsheng, Yan Meng, Liu Wei, Huang Xian, Chen Jinxing, Li Depeng,
Lin Xinchun, Huang Jian, Bian Yijun, Wu Weibin, Xian Qing, Zhang Kui, Shen Ye, Hu Zhixing, Liu Xiaozhu, Yin Lijing, Wang Zhao:
Introduction
This document describes an implementation method for long-term storage: Long-term storage refers to electronic components that are expected to be stored for more than 12 months
storage:
In recent years, the elimination of electronic components, especially integrated circuits, has become more and more serious: With the development of science and technology, and used in aviation, railway or energy
Compared with industrial equipment in the source field, the life cycle of components is very short: Therefore, systematic storage of components is the solution to the elimination problem:
main method:
Long-term storage requires good implementation of storage procedures, especially the storage environment: It is recommended that all transportation, maintenance and
care, storage and testing operations:
This document proposes a method to delay obsolescence to the greatest extent, but it does not guarantee that the components and parts will be in good working condition after storage:
operating status:
Because some systems are very old, some as long as 40 years or more, how to perform repairs and obtain spare parts has become a problem for users:
and maintenance organizations need to solve the problem: For example, some components required to service these systems cannot be recovered from the original
Spare parts obtained from suppliers or used for assembly are produced at the beginning of production but require long-term storage: The purpose of this document is to
It is to provide guidance for long-term storage of components:
GB/T 42706 "Long-term storage of electronic components and semiconductor devices" aims to ensure that after long-term storage of components, there is sufficient
reliability: Encourage users to ask suppliers to provide technical parameters of related products to demonstrate the storage process that meets user needs: These labels
The standard aims to provide relevant guidance for electronic components that require long-term storage:
GB/T 42706 "Long-term storage of electronic components and semiconductor devices" is divided into 9 parts: Part 1~Part 4 applies to
All long-term storage, and contains general requirements and guidance: Parts 5 to 9 apply to the storage of several specific product types: exist
While meeting the general requirements of Parts 1 to 4, the requirements for specific product types must also be met:
Beginning with Part 5, it deals with electronic components that require different storage conditions:
GB/T 42706 "Long-term Storage of Electronic Components and Semiconductor Devices" corresponds to the IEC 62435 series of standards and is proposed to consist of 9 parts
composition:
--- Part 1: General: The purpose is to specify the relevant terms, definitions and principles of long-term storage, and to provide effective long-term storage of components:
Storage concepts, good working practices and general methods:
--- Part 2: Degradation mechanism: The purpose is to specify the degradation mechanisms and
Mode of degradation, and guidance on test methods for assessing general degradation mechanisms:
--- Part 3: Data: The purpose is to specify the requirements for all aspects of data storage during the long-term storage of electronic components, and to maintain traceability:
traceability or data link integrity:
--- Part 4: Storage: The purpose is to specify the long-term storage method of electronic components, as well as related recommended conditions, including transportation, control
control and storage facilities:
--- Part 5: Chips and wafers: The purpose is to specify single chips, parts of wafers or entire wafers, as well as metallized structures (introduced
storage conditions and rules for chips, as well as general-purpose and special-purpose packaging products containing chips or wafers
Provide operational guidance:
--- Part 6: Packaged or coated components: The purpose is to specify the long-term storage methods and recommended conditions for packaged or coated components, including
including transport, containment, and storage facility security:
--- Part 7: MEMS: The purpose is to specify the matters needing attention and basic requirements for long-term storage of MEMS:
--- Part 8: Passive electronic devices: The purpose is to specify matters needing attention and basic requirements for long-term storage of passive electronic device products:
This requirement:
--- Part 9: Special circumstances: The purpose is to specify storage methods for special devices, including all types of silicon devices and semiconductors
device:
Long-term storage of electronic components and semiconductor devices
Part 1: General
1 Scope
This document defines terms, definitions and principles related to the long-term storage of semiconductor devices: Long-term storage as a strategy to delay obsolescence,
It refers to the storage where the product is expected to be stored for more than 12 months: This document provides concepts, good work
Habits and general methods:
2 Normative references
The contents of the following documents constitute the essential provisions of this document through normative references in the text: Among them, dated references
For documents, only the version corresponding to the date is applicable to this document; for undated reference documents, the latest version (including all amendments) is applicable to
this document:
IEC 60749-20-1 Mechanical and climatic test methods for semiconductor devices Part 20-1: Sensitivity to the combined effects of moisture and soldering heat
Note: GB/T 4937:201-2018 Mechanical and climatic test methods for semiconductor devices Part 20-1: Tables sensitive to the combined effects of humidity and soldering heat
Handling, packaging, marking and transportation of surface mount devices (IEC 60749-20-1:2009, IDT)
3 Terms, Definitions and Abbreviations
3:1 Terms and Definitions
The following terms and definitions apply to this document:
3:1:1
storage environment storage environment
The storage area where the temperature, humidity, atmospheric environment and other conditions are controlled according to the requirements of the product:
3:1:2
Long-term storage long-termstorage; LTS
In order to prolong the life cycle of products and meet the needs of later use, planned component storage is carried out:
Note: The storage duration is adjusted according to the shape and structure of the components (for example, packaging materials, shape, etc:) and storage conditions: In general, long-term storage
for more than 12 months:
3:1:3
Electronic deviceelectronicdevice
Encapsulated electrical, electronic, electromechanical components, or electronic products assembled using these components:
3:1:4
moisture barrier bag; MBB
Storage bags with a flexible laminated vapor barrier film to limit the transmission of water vapor:
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