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GB/T 35005-2018 English PDF

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GB/T 35005-2018: Test methods for flip chip integrated circuits
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Basic data

Standard ID GB/T 35005-2018 (GB/T35005-2018)
Description (Translated English) Test methods for flip chip integrated circuits
Sector / Industry National Standard (Recommended)
Classification of Chinese Standard L55
Classification of International Standard 31.200
Word Count Estimation 18,199
Date of Issue 2018-03-15
Date of Implementation 2018-08-01
Issuing agency(ies) State Administration for Market Regulation, China National Standardization Administration

GB/T 35005-2018: Test methods for flip chip integrated circuits

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Test methods for flip chip integrated circuits ICS 31.200 L55 National Standards of People's Republic of China Integrated circuit flip chip test method Published by.2018-03-15 2018-08-01 Implementation General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China China National Standardization Administration released Directory Preface I 1 Scope 1 2 Normative references 1 3 Terms and Definitions 1 4 Test method 2 4.1 Chip Bump Coplanarity Detection 2 4.2 Bump Shear Test 4 4.3 Flip Chip Shear Test 7 4.4 Flip-chip pull-off test 10 4.5 X-ray inspection 13 4.6 Ultrasound Testing 14

Foreword

This standard was drafted in accordance with the rules given in GB/T 1.1-2009. Please note that some of the contents of this document may involve patents. The issuing agency of this document does not assume responsibility for identifying these patents. This standard was proposed by the Ministry of Industry and Information Technology of the People's Republic of China. This standard is under the jurisdiction of the National Semiconductor Device Standardization Technical Committee (SAC/TC78). This standard was drafted by. The 1972 Research Institute of the Ninth Institute of China Aerospace Science and Technology Corporation. The main drafters of this standard. Lin Pengrong, Xie Dong, Huang Yingzhuo, Jiang Xueming, Wen Huidong, Lu Xiaorui, Yao Quanbin, Lian Binhao, Lin Jianjing, He Wei, Gao Shuo, Zhang Wei. Integrated circuit flip chip test method

1 Scope

This standard specifies the bump coplanarity, bump shear force, chip shear pull-off force, solder joint defect, bottom Part of the relevant physical test methods such as filling defects. This standard applies to flip-chip monolithic integrated circuits in ceramic packages or plastic packages.

2 Normative references

The following documents are indispensable for the application of this document. For dated references, only dated versions apply to this article Pieces. For undated references, the latest version (including all amendments) applies to this document. GJB548B-2009 Microelectronic Device Test Methods and Procedures

3 Terms and definitions

The following terms and definitions apply to this document. 3.1 Bump bump Printed solder, chemical plating, vapor-deposited solder, electroplated solder, solder head solder, or placement of solder balls Spherical or square solder joints. 3.2 Under bump metallization layer underbumpmetalization; UBM In order to achieve effective interconnection between the solder and the pad, a metal transition layer is deposited on the pad surface. 3.3 Flip-chip flipchip Flip chip with bumps and a process technology that directly interconnects the substrate with solder. 3.4 Datum plane seatingplane The plane formed by the apexes of the three solder balls has the largest vertical distance from the spherical surface, and the triangle formed by these three vertices should contain The center of gravity of the device. 3.5 Coplanar deviation from coplanarity The distance between each bump on the chip and the established reference plane. 3.6 Pull force pulforce Applied to the force of the chip perpendicular to the surface of the device and away from the surface. 3.7 Fixing fixture clamping fixture Fix the fixture of the device during bump shear, chip shear, chip pull test.

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