HOME   Cart(0)   Quotation   About-Us Policy PDFs Standard-List
www.ChineseStandard.net Database: 189760 (18 Oct 2025)

GB/T 35010.1-2018 English PDF

US$724.00 · In stock
Delivery: <= 5 days. True-PDF full-copy in English will be manually translated and delivered via email.
GB/T 35010.1-2018: Semiconductor die products -- Part 1: Requirements for procurement and use
Status: Valid
Standard IDContents [version]USDSTEP2[PDF] delivered inStandard Title (Description)StatusPDF
GB/T 35010.1-2018English724 Add to Cart 5 days [Need to translate] Semiconductor die products -- Part 1: Requirements for procurement and use Valid GB/T 35010.1-2018

PDF similar to GB/T 35010.1-2018


Standard similar to GB/T 35010.1-2018

GB/T 43770   GB/T 43978   SAMR 76   GB/T 35010.4   GB/T 35010.5   GB/T 35010.3   

Basic data

Standard ID GB/T 35010.1-2018 (GB/T35010.1-2018)
Description (Translated English) Semiconductor die products -- Part 1: Requirements for procurement and use
Sector / Industry National Standard (Recommended)
Classification of Chinese Standard L55
Classification of International Standard 31.200
Word Count Estimation 38,313
Date of Issue 2018-03-15
Date of Implementation 2018-08-01
Issuing agency(ies) State Administration for Market Regulation, China National Standardization Administration

GB/T 35010.1-2018: Semiconductor die products -- Part 1: Requirements for procurement and use

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Semiconductor die products--Part 1. Requirements for procurement and use ICS 31.200 L55 National Standards of People's Republic of China Semiconductor chip products Part 1. Purchase and use requirements Part 1.Requirementsforprocurementanduse (IEC 62258-1.2009, Semiconductor die products- Part 1.Procurementanduse,IDT) Published by.2018-03-15 2018-08-01 Implementation General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China China National Standardization Administration released Directory Preface III 1 Scope 1 2 Normative references 1 3 Terms and Definitions 2 3.1 Basic definition 2 3.2 General Terms 3 3.3 Semiconductor Manufacturing and Interconnection Terms 4 4 General requirements 5 5 Data Exchange 5 6 Device Requirements 6 6.1 Packet 6 6.2 Identity and Source ID 6 6.3 Function 6 6.4 Physical Characteristics 6 6.5 Ratings and Limitations 7 6.6 Connection 7 6.7 Document 7 6.8 Delivery Form 7 6.9 Simulation Modeling 8 7 Bare Die and Wafer Requirements with/Without Linking 8 7.1 Overview 8 7.2 Identity 8 7.3 Material 8 7.4 Geometry 9 7.5 Wafer Data 10 8 The smallest packaged chip (MPD) 10 8.1 Overview 10 8.2 The number of outlets 10 8.3 Outlet position 10 8.4 Lead shape and size 11 8.5 Device Size 11 8.6 fixed height 11 8.7 Packaging Materials 11 8.8 Humidity Sensitivity 11 8.9 Package Style Code 11 8.10 Outline Drawing 11 9 Quality, Test and Reliability 11 9.1 Overview 11 9.2 Factory Quality Level 11 9.3 Electrical Characteristics 12 9.4 Meets Standard 12 9.5 Auxiliary Device Screening 12 9.6 Product Status 12 9.7 Test Characteristics 12 9.8 Other Test Requirements 12 9.9 Reliability 12 10 Handling and Packaging 12 10.1 General Requirements for All Chips 12 10.2 Photolithography Version 13 10.3 Wafer Diagram 13 10.4 Special Project Requirements 14 11 Save 14 11.1 General Requirements 14 11.2 Storage Term and Conditions 14 11.3 Long-term storage 14 11.4 Storage period 14 12 Assembly 15 12.1 General Requirements 15 12.2 Bonding Methods and Materials 15 12.3 Bonding Methods and Materials 15 12.4 Bonding Limits 15 12.5 Process Limits 15 Appendix A (Informative) Technical Terms 16 Appendix B (Informative) Abbreviations 26 Reference 31

Foreword

GB/T 35010 "Semiconductor Chip Products" is divided into the following parts. --- Part 1. Procurement and use requirements; --- Part 2. Data exchange format; --- Part 3. Guidelines for handling, packaging and storage; --- Part 4. Chip user and supplier requirements; --- Part 5. Electrical Simulation Requirements; --- Part 6. Thermal Simulation Requirements; --- Part 7. XML format for data exchange; --- Part 8. EXPRESS format for data exchange. This part is the first part of GB/T 35010. This section uses the translation method equivalent to the use of IEC 62258-1.2009 "semiconductor chip products Part 1. procurement and use." The Chinese documents that have a consistent correspondence with the normatively quoted international documents in this section are as follows. ---GB/T 2900 (all parts) Electrical terminology [IEC 60050 (all parts)] --- GB/T 35010.2-2018 Semiconductor chip products Part 2. Data exchange format (IEC 62258-2.2011, IDT) ---GB/T 35010.4-2018 Semiconductor chip products Part 4. Chip user and supplier requirements (IEC /TR 62258-4.2012, IDT) --- GB/T 35010.5-2018 Semiconductor chip products - Part 5. Electrical simulation requirements (IEC 62258-5.2006, IDT) --- GB/T 35010.6-2018 Semiconductor chip products - Part 6. Thermal simulation requirements (IEC 62258-6.2006, IDT) ---GB/T 35010.7-2018 Semiconductor chip products Part 7. XML format for data exchange (IEC /T R62258- 7.2007, IDT) ---GB/T 35010.80.8-2018 Semiconductor chip products - Part 8. EXPRESS format for data exchange (IEC /TR 62258-8.2008,IDT) This section also made the following editorial changes. --- Taking into account the adaptation of China's standard system, the name will be changed to "Semiconductor chip products Part 1. Procurement and use requirements"; --- Appendix B. B.1 is the name of a foreign standard organization. It has nothing to do with this standard. It only retains the title. Please note that some of the contents of this document may involve patents. The issuing agency of this document does not assume responsibility for identifying these patents. This section was proposed by the Ministry of Industry and Information Technology of the People's Republic of China. This part is under the jurisdiction of the National Semiconductor Device Standardization Technical Committee (SAC/TC78). This section was drafted by. China Electronics Technology Group Corporation's fifty-fifth institute, China's electronic product reliability and environmental test study Institute of Electronic Technology Standards Institute of China. The main drafters of this section. Yu Yongzhou, Wu Weili, Shi Qian, Yin Hang, Li Yu, Lin Hao. Semiconductor chip products Part 1. Purchase and use requirements

1 Scope

This part of GB/T 35010 is used to guide the production, supply and use of semiconductor chip products. Semiconductor chip products include. ● Wafers; ● Single bare chip; ● Chips and wafers with interconnect structures; ● Small or partially packaged chips and wafers. This section defines the minimum requirements for the data required for this type of chip product and also contributes to the design and procurement of chip-containing component products. It contains The requirements for data are covered as follows. ● product identification; ● Product data; ● Chip mechanical information; ● Test, quality, assembly and reliability information; ● Process, transport, and store information. This section includes specific data used to describe the geometric, physical, and connection method data of the chip during R&D and manufacturing. Claim. Refer to Appendix A and Appendix B for related vocabularies and abbreviations.

2 Normative references

The following documents are indispensable for the application of this document. For dated references, only dated versions apply to this article Pieces. For undated references, the latest version (including all amendments) applies to this document. GB/T 25915.1-2010 Cleanrooms and related controlled environments - Part 1. Air cleanliness level (ISO 14644-1.1999, IDT) IEC 60050 (all parts) Electrotechnical terminology (International electrotechnicalvocabulary) IEC 60191 (all parts) Mechanical standardization of semiconductor devices (Mechanicalstandardizationofsemiconductor Devices) IEC 60191-4.1999 Mechanical standardization of semiconductor devices - Part 4. Semiconductor device package outline coding and classification (Mechanicalstandardizationofsemiconductordevices-Part 4.Codingsystemandclassificationinto Formsofpackageoutlinesforsemiconductordevicepackages) Amendment1(2001) Amenduent2(2002) IEC 61360-1 Standard data element types and related classification schemes for electrical components - Part 1. Definitions - Principles and methods (Standarddataelementtypeswithassociatedclassificationschemeforelectriccomponents-Part 1. Definitions-Principlesandmethods) IEC 62258-2 Semiconductor chip products Part 2. Data interchange formats (Semiconductor die products-Part 2. Exchangedataformats) IEC /T R62258-3 Semiconductor Chip Product Part 3. Guidelines for Handling, Packaging and Storage (Semiconductor dieprod- ucts-Part 3.Recommenduatinsforgoodpracticeinhandling,packingandstorage)

Tips & Frequently Asked Questions:

Question 1: How long will the true-PDF of GB/T 35010.1-2018_English be delivered?

Answer: Upon your order, we will start to translate GB/T 35010.1-2018_English as soon as possible, and keep you informed of the progress. The lead time is typically 3 ~ 5 working days. The lengthier the document the longer the lead time.

Question 2: Can I share the purchased PDF of GB/T 35010.1-2018_English with my colleagues?

Answer: Yes. The purchased PDF of GB/T 35010.1-2018_English will be deemed to be sold to your employer/organization who actually pays for it, including your colleagues and your employer's intranet.

Question 3: Does the price include tax/VAT?

Answer: Yes. Our tax invoice, downloaded/delivered in 9 seconds, includes all tax/VAT and complies with 100+ countries' tax regulations (tax exempted in 100+ countries) -- See Avoidance of Double Taxation Agreements (DTAs): List of DTAs signed between Singapore and 100+ countries

Question 4: Do you accept my currency other than USD?

Answer: Yes. If you need your currency to be printed on the invoice, please write an email to [email protected]. In 2 working-hours, we will create a special link for you to pay in any currencies. Otherwise, follow the normal steps: Add to Cart -- Checkout -- Select your currency to pay.