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GB/T 36479-2018 English PDF

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GB/T 36479-2018: Integrated circuits -- Test methods for column grid array
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Basic data

Standard ID GB/T 36479-2018 (GB/T36479-2018)
Description (Translated English) Integrated circuits -- Test methods for column grid array
Sector / Industry National Standard (Recommended)
Classification of Chinese Standard L55
Classification of International Standard 31.200
Word Count Estimation 22,274
Date of Issue 2018-06-07
Date of Implementation 2019-01-01
Issuing agency(ies) State Administration for Market Regulation, China National Standardization Administration

GB/T 36479-2018: Integrated circuits -- Test methods for column grid array

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Integrated circuits--Test methods for column grid array ICS 31.200 L55 National Standards of People's Republic of China Integrated circuit solder column array test method Published on.2018-06-07 2019-01-01 Implementation National Market Supervision Administration China National Standardization Administration released Directory Preface I 1 Scope 1 2 Normative references 1 3 Terms and Definitions 1 4 General requirements 2 4.1 General Rule 2 4.2 Sample Processing 2 4.3 Device Orientation 2 4.4 Test Environment 3 4.5 Test result 3 5 Detailed Request 3 5.1 Welded pillar array coplanarity 3 5.2 Solder column array position 4 5.3 Weldability of Solder Post 6 5.4 Pullout 8 5.5 Welding shear 14 5.6 Post fatigue 18

Foreword

This standard was drafted in accordance with the rules given in GB/T 1.1-2009. Please note that some of the contents of this document may involve patents. The issuing agency of this document does not assume responsibility for identifying these patents. This standard was proposed by the Ministry of Industry and Information Technology of the People's Republic of China. This standard is under the jurisdiction of the National Semiconductor Device Standardization Technical Committee (SAC/TC78). This standard was drafted by the 58th Institute of China Electronics Technology Group Corporation and the China Electronics Standardization Institute. The main drafters of this standard. Lv Dong, Ding Rongzhen, Chen Bo, Lu Jian, Zhang Huibin, Li Wei, Yin Hang. Integrated circuit solder column array test method

1 Scope

This standard specifies the test method for the welding column array (CGA). This standard applies to integrated circuits (hereinafter referred to as devices) in the form of a CGA package. Solder posts include high-lead solder posts and micro Coil welding column, copper tape wound type, substrate-enhanced welding column, copper-plated welding column, etc.

2 Normative references

The following documents are indispensable for the application of this document. For dated references, only dated versions apply to this article Pieces. For undated references, the latest version (including all amendments) applies to this document. GB/T 9178 Integrated Circuit Terminology GB/T 14113 Semiconductor Integrated Circuit Package Terminology GJB548B-2005 Microelectronic Device Test Methods and Procedures

3 Terms and Definitions

The definitions of GB/T 9178, GB/T 14113 and the following terms and definitions apply to this document. 3.1 Welding column array columngridarray; CGA A slender pin is used as an external pin and is soldered to the substrate/ceramic pad in a longitudinal and horizontal manner at a certain pitch to realize the next level of the device The physical connection (including electrical connections) to the printed circuit board (PCB) when assembled. 3.2 Datum plane datumplane The plane formed by the apexes of the three welding pillars, the three welding pillars have the largest vertical distance from the top surface of the pillar, and the three vertices form three The angular projection contains the device's center of gravity. 3.3 Coplanarity deviation from coplanarity The difference between the highest apex of the weld and the lowest apex of the weld. 3.4 Location degree geometricdimensioning In the centrally symmetrical region of the theoretical position of the device's welding column, the center point of the welding column allows a different amount of change from the center of the theoretical position. 3.5 Pull force pul-offforce Applied to the force of the solder column that is axially perpendicular to the plane of the device's implant and leaves it away from the plane. 3.6 Fixing fixture clamping fixture The device holding the device fixed during the test.

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