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GB/T 38446-2020 English PDF

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GB/T 38446-2020: Micro-electromechanical system technology - Test methods for tensile property measurement of strip thin films
Status: Valid

Standard ID	Contents [version]	USD	STEP2	[PDF] delivered in	Standard Title (Description)	Status	PDF
GB/T 38446-2020	English	259	Add to Cart	3 days [Need to translate]	Micro-electromechanical system technology - Test methods for tensile property measurement of strip thin films	Valid	GB/T 38446-2020

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Basic data

Standard ID	GB/T 38446-2020 (GB/T38446-2020)
Description (Translated English)	Micro-electromechanical system technology - Test methods for tensile property measurement of strip thin films
Sector / Industry	National Standard (Recommended)
Classification of Chinese Standard	L55
Classification of International Standard	31.200
Word Count Estimation	14,146
Date of Issue	2020-03-06
Date of Implementation	2020-10-01
Issuing agency(ies)	State Administration for Market Regulation, China National Standardization Administration

GB/T 38446-2020: Micro-electromechanical system technology - Test methods for tensile property measurement of strip thin films

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Micro-electromechanical system technology--Test methods for tensile property measurement of strip thin films ICS 31.200 L55 National Standards of People's Republic of China Microelectromechanical system (MEMS) technology Test method for tensile properties of ribbon film Released on 2020-03-06 2020-10-01 implementation State Administration of Market Supervision and Administration Issued by the National Standardization Management Committee

Foreword I 1 Scope 1 2 Normative references 1 3 Terms and definitions 1 4 Test method 2 5 Data processing 4 Appendix A (informative appendix) Sample preparation using MEMS process 5 Appendix B (informative appendix) The effect of alignment deviation and geometry on performance testing 7 Appendix C (informative appendix) Test result error and compensation of the nano-indenter 9 Reference 10

Foreword

This standard was drafted in accordance with the rules given in GB/T 1.1-2009. This standard was proposed and managed by the National Micro-Electromechanical Technology Standardization Technical Committee (SAC/TC336). This standard was drafted by. Peking University, China Machine Productivity Promotion Center, Beijing Zhixin Sensor Technology Co., Ltd., Wuxi China Resources Shanghua Technology Co., Ltd., North University of China, Beijing Bichuang Technology Co., Ltd. The main drafters of this standard. Zhang Wei, Li Haibin, Zhang Yating, Zhu Yue, Xia Changfeng, Shi Yunbo, Chen Demin, Ma Shucong, Cheng Hongbing, Zhou Haonan. Microelectromechanical system (MEMS) technology Test method for tensile properties of ribbon film

1 Scope

This standard specifies the test method and data processing of the tensile properties of the ribbon film. This standard applies to samples with a thickness between 50nm and a few microns and a ratio of length to thickness greater than 300. It can also be used for MEMS Quality control of the product film structure.

2 Normative references

The following documents are essential for the application of this document. For dated references, only the dated version applies to this article Pieces. For the cited documents without date, the latest version (including all amendments) applies to this document. GB/T 26111 Technical terms for microelectromechanical system (MEMS)

3 Terms and definitions

The terms and definitions defined in GB/T 26111 and the following apply to this document. 3.1 Modulus of elasticity When the material is in the stage of elastic deformation, the ratio of stress to strain. Note. Rewrite GB/T 3102.3-1993, definition 3.18.1. 3.2 Yield strength yieldstrength Re When the material exhibits a yielding phenomenon, the stress point at which plastic deformation occurs and the force does not increase during the test is reached. Note 1. Rewrite GB/T 228.1-2010, definition 3.10.2. Note 2. For materials with obvious yield phenomena, the yield strength is the stress at the yield limit of the material when the yield phenomenon occurs; for materials where the yield phenomenon is not obvious, The yield strength is the stress when the strain reaches 0.2% of the residual strain. 3.3 Tensile strength Rm The corresponding maximum stress during the material breaking process. Note. Rewrite GB/T 228.1-2010, definition 3.10.1. 3.4 Deflection The linear displacement of the sample structure axis in the direction perpendicular to the axis or the linear displacement of the midplane in the direction perpendicular to the midplane.

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