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Std ID |
Description (Standard Title) |
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SJ/T 11638-2016
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Test method of particle in electronic chemicals
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SJ/T 3200-2016
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(Silver brazed joint specification)
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SJ/T 3201-2016
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Specification for brazing joint with aluminum filler metals
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SJ/T 3228.10-2016
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(High purity quartz sand for electronic products - Part 10: Determination of lead)
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SJ/T 3228.1-2016
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(High purity quartz sand for electronic products - Part 1: Technical conditions)
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SJ/T 3228.2-2016
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(High purity quartz sand for electronic products - Part 2: General principles of analytical methods)
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SJ/T 3228.3-2016
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High purity arenaceous quartz for used in electronics - Part 3: Determining loss on ignition
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SJ/T 3228.4-2016
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(High purity quartz sand for electronic products - Part 4: Determination of silica)
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SJ/T 3228.5-2016
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(High purity quartz sand for electronic products - Part 5: Determination of iron)
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SJ/T 3228.6-2016
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High purity arenaceous quartz for used in electronics part 6 determining the content of copper
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SJ/T 3228.7-2016
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(High purity quartz sand for electronic products - Part 7: Determination of chromium)
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SJ/T 3228.8-2016
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(High purity quartz sand for electronic products - Part 8: Determination of aluminum)
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SJ/T 3328.10-2016
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(Determination of high-purity quartz sand section 10 of the electronic products with lead)
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SJ/T 3328.1-2016
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(Electronic products with high purity quartz sand technical conditions Part 1)
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SJ/T 3328.2-2016
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(Electronic products with high purity quartz sand Part 2 General Analysis)
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SJ/T 3328.3-2016
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[See SJ/T 3228.3-2016] High purity arenaceous quartz for used in electronics - Part 3: Determining loss on ignition
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SJ/T 3328.4-2016
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(Determination of high-purity quartz silica sand Part 4 of electronic products)
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SJ/T 3328.5-2016
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(Determination of high purity quartz sand Part 5 iron electronic products)
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SJ/T 3328.6-2016
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(Electronic products with high purity quartz sand Part 6 Determination of copper)
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SJ/T 3328.7-2016
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(Determination of high purity quartz sand Part 7 chrome electronic products)
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SJ/T 3328.8-2016
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(Determination of high purity quartz sand Section 8 electronic products with aluminum)
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SJ/T 10414-2015
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(The semiconductor device with solder)
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SJ/T 10464-2015
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Metallized polypropylene film for capacitors
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SJ/T 10465-2015
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Metallized polyester film for capacitors
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SJ/T 10753-2015
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(Electronics with gold, silver and alloy solder)
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SJ/T 10754-2015
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(Electronics with gold, silver and alloy brazing methods cleanliness, sputtering Determination)
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SJ/T 11011-2015
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(Electronics ICP-AES test method silver brazing filler metal impurity content of lead, bismuth, zinc, cadmium, iron, magnesium, aluminum, tin, antimony, phosphorus)
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SJ/T 11028-2015
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(Determination of copper with gold and copper electronics solder analysis EDTA volumetric method)
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SJ/T 11029-2015
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(Electronics determination of nickel with gold Nickel solder analysis EDTA volumetric method)
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SJ/T 11030-2015
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(Electronic devices with gilt bronze and gold-nickel brazing filler metal impurities of lead, zinc, phosphorus ICP-AES determination)
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SJ/T 11484-2015
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Aluminum doped zinc oxide type transparent conductive oxide coated glass
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SJ/T 11506-2015
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Aluminum etching solution for Integrated Circuit
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SJ/T 11507-2015
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Oxide coating etching buffer for integrated circuit
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SJ/T 11508-2015
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Positive Photoresist developer for Integrated Circuit
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SJ/T 11509-2015
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ITO etching solution for liquid crystal display
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SJ/T 11510-2015
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Aluminum etching solution for LCD
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SJ/T 11511-2015
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Positive Photoresist developer for LCD
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SJ/T 11512-2015
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Test methods of electronic pastes for integrated circuit performent
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SJ/T 11513-2015
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Aluminium paste for solar cell
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SJ/T 11514-2015
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Thermosetting Conductive Paste for Printed Circuit Board (PCB)
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SJ/T 11515-2015
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Pb-free glass powder for plasma display panel
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SJ/T 11516-2015
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Specification for thin film transistor (TFT) mask
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SJ/T 11518-2015
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Surface Mount Technology Print Stencil
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SJ/T 11519-2015
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Specification for tinned copper wire of electronic connection used
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SJ/T 11549-2015
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No-clean flux used for crystalline silicon photovoltaic (PV) modules
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SJ/T 11550-2015
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(Crystalline silicon photovoltaic module with dip solder ribbon)
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SJ/T 11554-2015
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(Inductively coupled plasma emission spectrometry hydrofluoric acid content of metal elements)
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SJ/T 11555-2015
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(Determination of nitric acid metal elements by inductively coupled plasma mass spectrometry)
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SJ/T 11556-2015
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Determination of Ag, Au, Ca, Cu, Fe, K, Na concentration of nitric acid by AAS
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SJ/T 11246-2014
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(Effective ceramic shell vacuum switch)
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SJ/T 11469-2014
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Test methods for the piezoelectric properties of ceramics shear piezoelectric strain constant d15 testing on quasi-static principle
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SJ/T 11483-2014
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Electrodeposited copper foil for lithium ion battery
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SJ/T 11197-2013
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Epoxy molding compound
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SJ/T 10380-2012
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Industrial pickling quartz sand
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SJ/T 11140-2012
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Electrode foil for electrolytic capacitors
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SJ/T 11186-2009
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General specification for solder paste
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SJ/T 11389-2009
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Fluxes for lead-free soldering application
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SJ/T 11390-2009
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Test method for lead-free solders
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SJ/T 11391-2009
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Solder powder for electronic soldering applications
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SJ/T 11392-2009
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Lead-free solders. Chemical compositions and forms
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SJ/T 11397-2009
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Phosphors for light emitting diodes
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SJ/T 11369-2007
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Electronic glass technical data
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SJ 20964-2006
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Specification for tungsten-37 rhenium alloy
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SJ 20965-2006
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Specification for beryllia ceramic carrier used for photocon devices
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SJ 20966-2006
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Measuring methods for soft ferrite materials
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SJ/T 11319-2005
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Quantity test method of the oxidation sludge in the tin solder
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SJ/T 3231-2005
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Frit glass powder
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SJ 20900-2004
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Specification for beryllia ceramic sleeves used in microwave electronic tubes
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SJ 20894-2003
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Packing material selection and application for electronic equipment components
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SJ/T 11282-2003
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Specification for E glass paper for printed boards
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SJ/T 11283-2003
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Specification for finished fabric woven from E glass for printed boards
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SJ 20848-2002
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Specification for molybdenum-copper composite materials bar
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SJ 20857-2002
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Specification for resistance foil composite material
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SJ 20859-2002
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Network management protocol and interface requirements for the military digital secure automatic telephone network
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SJ/T 10675-2002
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Silicon dioxide micropowder for electronic and electrical equipment industry
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SJ/T 11273-2002
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No-clean liquid soldering flux
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SJ/T 11246-2001
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The ceramic housing used in vacuum interrupter
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SJ/T 3326-2001
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Test method used in tensile strength of ceramic to metal seal
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SJ 20745-1999
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Specification for tungsten alloy wire of high percentage of rhenium
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SJ/T 11197-1999
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Epoxy molding compounds
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SJ/T 11198-1999
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Glass tube for black-white picture tubes, monochrome displayer tube and electro-optic source
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SJ 20670-1998
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Specification for Zr-Al getters
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SJ/T 11168-1998
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Solder wire for soldering cleanout-free
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SJ/T 11186-1998
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General specifications for tin-lead soldering pastes
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SJ/T 11187-1998
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General specification for surface mounting adhesives
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SJ 20633-1997
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Specification for epoxide powder encapsulating material of self-extinguishing
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SJ 20634-1997
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Test methods for electronic pastes performance
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SJ 20637-1997
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Specification for AIN powder for electric ceramics
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SJ 20638-1997
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Specification for liquid crystal materials for TFT-LCD
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SJ 20639-1997
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Specification for black guest-host liquid crystal
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SJ/T 11116-1997
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Generic specification for optical fibre preform
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SJ/T 11124-1997
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Encapsulation materials of epoxy series powder for use in electronic components
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SJ/T 11125-1997
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Encapsulation materials of epoxy series for use in electronic components
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SJ/T 11126-1997
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Encapsulation materials of phenolic series for use in electronic components
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SJ/T 11136-1997
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Zirconium dioxide used for electronic ceramics
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SJ/T 11140-1997
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Electrode foil for aluminum electrolytic capacitor
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SJ 20601-1996
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Specification for terminating paste for use in MLC
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SJ 20603-1996
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Specification for resistance paste for use in chip resistors
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SJ/T 10705-1996
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Standard practice for inspection of surface quality of semiconductor lead-bonding wire
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SJ/T 10714-1996
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Standard practice for checking the operation characteristics of X-ray photoelectron spectrometers
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