SJ/T 11125-1997 PDF English
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Basic data
| Standard ID | SJ/T 11125-1997 (SJ/T11125-1997) |
| Description (Translated English) | Encapsulation materials of epoxy series for use in electronic components |
| Sector / Industry | Electronics Industry Standard (Recommended) |
| Classification of Chinese Standard | L90 |
| Classification of International Standard | 31.03 |
| Word Count Estimation | 7,736 |
| Date of Issue | 9/3/1997 |
| Date of Implementation | 1/1/1998 |
| Quoted Standard | GB 1034-1986; GB 1036-1989; GB 1408-1989; GB 1409-1988; GB 1410-1989; GB 1634-1979; GB 2411-1980; GB 2794-1981; GB 6554-1986; SJ 3262-1989; SJ/Z 9132-1987 |
| Regulation (derived from) | Industry-Science (2010) No. 77 |
| Summary | This standard specifies the potting material for electronic components (hereinafter referred to as potting) epoxy-based classification, requirements, test methods, inspection rules, packaging, labeling, transportation and storage. This standard applies to metal or plastic mold or shell potting for various types of electronic components required for encapsulation materials. |
