SJ/T 10705-1996 PDF English
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| SJ/T 10705-1996 | English | 399 | Add to Cart | 3 days [Need to translate] | Standard practice for inspection of surface quality of semiconductor lead-bonding wire |
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Basic data
| Standard ID | SJ/T 10705-1996 (SJ/T10705-1996) |
| Description (Translated English) | Standard practice for inspection of surface quality of semiconductor lead-bonding wire |
| Sector / Industry | Electronics Industry Standard (Recommended) |
| Classification of Chinese Standard | L90 |
| Word Count Estimation | 10,155 |
| Date of Issue | 7/22/1996 |
| Date of Implementation | 11/1/1996 |
| Adopted Standard | ASTM F584-1987 (1993), NEQ |
| Regulation (derived from) | Industry-Science (2010) No. 77 |