SJ/T 11197-2013 PDF English
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SJ/T 11197: Historical versions
| Std ID | Version | USD | Buy | Deliver [PDF] in | Title (Description) |
| SJ/T 11197-2013 | English | 369 | Add to Cart | 3 days [Need to translate] | Epoxy molding compound |
| SJ/T 11197-1999 | English | 399 | Add to Cart | 3 days [Need to translate] | Epoxy molding compounds |
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Basic data
| Standard ID | SJ/T 11197-2013 (SJ/T11197-2013) |
| Description (Translated English) | Epoxy molding compound |
| Sector / Industry | Electronics Industry Standard (Recommended) |
| Classification of Chinese Standard | L90 |
| Classification of International Standard | 31.030 |
| Word Count Estimation | 14,115 |
| Older Standard (superseded by this standard) | SJ/T 11197-1999 |
| Quoted Standard | GB/T 191; GB/T 1033; GB/T 1408; GB/T 1409; GB/T 1410; GB/T 1449; GB/T 2408; GB/T 3139; GB/T 6679; EJ/T 823 |
| Regulation (derived from) | Ministry of Industry and Information Technology Bulletin No. 52, 2013; industry standard for filing Notice No. 2 of 2014 (No. 170 overall) |
| Issuing agency(ies) | Ministry of Industry and Information Technology |
| Summary | This standard specifies the microelectronics industry with epoxy molding compound classification, requirements, test methods, inspection rules and signs, packaging, transport and storage. This standard applies to packaged discrete devices microelectronics |
