SJ 20894-2003 PDF English
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Basic data
| Standard ID | SJ 20894-2003 (SJ20894-2003) |
| Description (Translated English) | Packing material selection and application for electronic equipment components |
| Sector / Industry | Electronics Industry Standard |
| Classification of Chinese Standard | L90 |
| Classification of International Standard | 31.030 |
| Word Count Estimation | 8,872 |
| Date of Issue | 2003-12-15 |
| Date of Implementation | 2004-03-01 |
| Regulation (derived from) | MIIT Electronic Industry Standard approval announcement (2003), No. 559 |
| Summary | This standard specifies the potting material encapsulating electronic equipment components selection, use requirements. This standard applies to electronic devices to improve the protective performance of electronic equipment components reinforcement, sealing, insulation. |