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SJ/T 11514-2015 PDF English

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SJ/T 11514-2015: Thermosetting Conductive Paste for Printed Circuit Board (PCB)
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SJ/T 11514-2015English369 Add to Cart 3 days [Need to translate] Thermosetting Conductive Paste for Printed Circuit Board (PCB)

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Basic data

Standard ID SJ/T 11514-2015 (SJ/T11514-2015)
Description (Translated English) Thermosetting Conductive Paste for Printed Circuit Board (PCB)
Sector / Industry Electronics Industry Standard (Recommended)
Classification of Chinese Standard L90
Classification of International Standard 31.03
Word Count Estimation 16,199
Date of Issue 2015-04-30
Date of Implementation 2015-10-01
Quoted Standard GB/T 191-2008; GB/T 2036; GB/T 2421.1-2008; GB/T 2423.3-2006; GB/T 2423.16-2008; GB/T 2423.22-2002; GB/T 4677-2002; GB/T 2828.1-2003; GB/T 4588.2-1996; GB/T 5547-2007; GB/T 6739-2006; GB/T 6753.1-2007; GB/T 9286-1998; GB/T 17473.3-2008; GB/T 13557-1992; SJ/T 11171-1998
Regulation (derived from) Ministry of Industry and Information Technology Announcement (2015 No. 28)
Issuing agency(ies) Ministry of Industry and Information Technology
Summary This Standard specifies the terms and definitions for printed circuits thermosetting conductive paste, requirements, test methods, inspection rules and packaging, labeling, transportation and so on. This Standard applies to the printed circuit board conductive pattern, contacts, contacts, jumpers, hole fill, and membrane switch, buried resistors, RFID and other manufacturing conductive paste by heat curing, including silver conductor, copper conductor paste, silver and carbon conductive carbon paste mixed slurry.

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