SJ/T 11319-2005 PDF English
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Basic data
| Standard ID | SJ/T 11319-2005 (SJ/T11319-2005) |
| Description (Translated English) | Quantity test method of the oxidation sludge in the tin solder |
| Sector / Industry | Electronics Industry Standard (Recommended) |
| Classification of Chinese Standard | L90 |
| Classification of International Standard | 30.030 |
| Word Count Estimation | 7,725 |
| Date of Issue | 2005-06-28 |
| Date of Implementation | 2005-09-01 |
| Quoted Standard | Information technology and standardization 2005-8 |
| Regulation (derived from) | Information technology and standardization 2005-8 |
| Summary | This standard specifies the molten solder tin oxide slag under dynamic conditions, the yield of test methods. This standard applies to 60/40, 63/37 tin-lead alloy solder or other lead-free solder oxide slag yield measurements. |