SJ 20848-2002 PDF English
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Basic data
| Standard ID | SJ 20848-2002 (SJ20848-2002) |
| Description (Translated English) | Specification for molybdenum-copper composite materials bar |
| Sector / Industry | Electronics Industry Standard |
| Classification of Chinese Standard | L90 |
| Word Count Estimation | 11,120 |
| Date of Issue | 2002-10-30 |
| Date of Implementation | 2003-03-01 |
| Summary | This standard specifies the requirements of molybdenum-copper alloy rods, quality assurance requirements, preparation and delivery of the relevant provisions. This standard applies to the manufacture of military power microelectronic devices sealing material as a heat sink and aluminum oxide ceramic sealing and structural materials with molybdenum-copper alloy rod, also applies to the manufacture of civilian power microelectronic devices thermal conductivity given inflation sealing heat sink with a molybdenum-copper alloy rod. |
