SJ/T 11390-2019 PDF English
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SJ/T 11390: Historical versions
| Std ID | Version | USD | Buy | Deliver [PDF] in | Title (Description) |
| SJ/T 11390-2019 | English | 349 | Add to Cart | 3 days [Need to translate] | (Test method for lead-free solder) |
| SJ/T 11390-2009 | English | 639 | Add to Cart | 3 days [Need to translate] | Test method for lead-free solders |
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Basic data
| Standard ID | SJ/T 11390-2019 (SJ/T11390-2019) |
| Description (Translated English) | (Test method for lead-free solder) |
| Sector / Industry | Electronics Industry Standard (Recommended) |
| Classification of Chinese Standard | L90 |
| Classification of International Standard | 31.030 |
| Word Count Estimation | 15,197 |
| Date of Issue | 2019 |
| Date of Implementation | 2020-07-01 |
| Issuing agency(ies) | Ministry of Industry and Information Technology |
| Summary | This standard specifies melting temperature, mechanical stretching, spreading, wetting, solder joint stretching and shearing, QFP lead solder joint 45° stretching, chip component solder joint shearing and core tinning for lead-free solders Test method for wire splash. |
