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GB/T 30116-2013: Requirements for semiconductor manufacturing facility electromagnetic compatibility
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| GB/T 30116-2013 | English | 259 |
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Requirements for semiconductor manufacturing facility electromagnetic compatibility
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GB/T 30116-2013
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Basic data | Standard ID | GB/T 30116-2013 (GB/T30116-2013) | | Description (Translated English) | Requirements for semiconductor manufacturing facility electromagnetic compatibility | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | L95 | | Classification of International Standard | 31.550 | | Word Count Estimation | 11,111 | | Quoted Standard | GB 9254; GB/T 17626.2-2006; GB/T 17626.3-2006; GB/T 17626.4-2008; GB/T 17626.5-2008; GB/T 17626.16-2007 | | Regulation (derived from) | National Standards Bulletin No. 25 of 2013 | | Issuing agency(ies) | General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China | | Summary | This standard specifies: To ensure the semiconductor manufacturing facility for the production of semiconductor devices and together with the reliable operation of the equipment can be Electromagnetic compatibility (EMC) requirements. This standard applie | GB/T 30116-2013: Requirements for semiconductor manufacturing facility electromagnetic compatibility
---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Requirements for semiconductor manufacturing facility electromagnetic compatibility
ICS 31.550
L95
National Standards of People's Republic of China
Semiconductor production facilities electromagnetic compatibility requirements
compatibility
Issued on. 2013-12-17
2014-04-15 implementation
Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China
Standardization Administration of China released
Foreword
This standard was drafted in accordance with GB/T 1.1-2009 given rules.
Please note that some of the content of this document may involve patents. Release mechanism of the present document does not assume responsibility for the identification of these patents.
This standard by the National Standardization Technical Committee of semiconductor equipment and materials (SAC/TC203) and focal points.
This standard was drafted. the Ministry of Industry and Information Technology Research Institute and the electronics industry standardization, Anhui Xin Yang Electronics Co., Ltd.
The main drafters of this standard. Huang Yinghua, Tan Jianguo, Liu Jun, Zhou Li group, Zhong Hua, Fengya Bin.
Semiconductor production facilities electromagnetic compatibility requirements
1 Scope
This standard specifies electromagnetic compatibility To ensure the semiconductor manufacturing facilities and equipment for the production of a semiconductor device capable of reliable operation together
(EMC) requirements.
This standard applies to the production of semiconductor devices facilities and equipment, facilities and equipment of these facilities cover all alarms, security, communications and
Control systems, process equipment, measuring equipment, automation equipment and information technology equipment.
This standard does not apply to equipment and facilities, packaging and functional testing of integrated circuits used, it may not apply to the production of a semiconductor
Static electricity generated in the process.
2 Normative references
The following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein
Member. For undated references, the latest edition (including any amendments) applies to this document.
Radio disturbance characteristics - Limits and methods of measurement GB 9254 information technology equipment
GB/T 17626.2-2006 Electromagnetic compatibility - Testing and measurement techniques - Electrostatic discharge immunity test
GB/T 17626.3-2006 Electromagnetic compatibility - Testing and measurement techniques RFEMS test
GB/T 17626.4-2008 Electromagnetic compatibility - Testing and measurement techniques - Electrical fast transient burst immunity test
GB/T 17626.5-2008 Electromagnetic compatibility - Testing and measurement techniques - Surge (impact) immunity test
GB/T 17626.16-2007 electromagnetic compatibility test and measurement technology 0Hz ~ 150kHz common mode conducted disturbances immunity test
3 Terms and Definitions
The following terms and definitions apply to this document.
3.1
Electromagnetic compatibility electromagneticcompatibility; EMC
Electronic equipment is working properly in electromagnetic interference (EMI) and electrostatic discharge (ESD) environment without anything in that environment does not constitute
Ability to withstand electromagnetic interference.
3.2
Electromagnetic interference electromagneticinterference; EMI
Non-ionizing (Asia Optical) portion of the electromagnetic spectrum in any electronic devices may cause unwanted electromagnetic signals some reactions.
3.3
Electrostatic discharge electrostaticdischarge; ESD
Objects with different electrostatic potentials near or in direct contact with each other due to charge transfer.
3.4
ULF magnetic field extremelylowfrequencymagnetic; ELF
Ultra-low frequency (approximately 1Hz ~ 1kHz) equipment and facilities within the magnetic field generated by the current.
3.5
Sensitive equipment sensitiveequipment
Any performance will be adversely affected by the ELF device.
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