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GB/T 40577-2021: Terminology for integrated circuit(IC) manufacturing equipment
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| GB/T 40577-2021 | English | 1119 |
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Terminology for integrated circuit(IC) manufacturing equipment
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GB/T 40577-2021
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Basic data | Standard ID | GB/T 40577-2021 (GB/T40577-2021) | | Description (Translated English) | Terminology for integrated circuit(IC) manufacturing equipment | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | L95 | | Word Count Estimation | 56,578 | | Issuing agency(ies) | State Administration for Market Regulation, China National Standardization Administration | GB/T 40577-2021: Terminology for integrated circuit(IC) manufacturing equipment---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Terminology for integrated circuit(IC) manufacturing equipment
ICS 31.220
CCSL95
National Standards of People's Republic of China
Terminology of integrated circuit manufacturing equipment
Released on 2021-10-11
2022-05-01 implementation
State Administration of Market Supervision and Administration
Issued by the National Standardization Management Committee
Table of contents
Foreword Ⅲ
1 Scope 1
2 Normative references 1
3 Basic terminology 1
4 Crystal growth processing equipment 2
5 Mask manufacturing equipment 5
6 Lithography and etching equipment 8
7 Doping equipment 15
8 Thin film deposition equipment 17
9 Cleaning equipment 23
10 Packaging equipment 24
11 Testing equipment 27
12 Common parts 34
Reference 37
Index 38
Foreword
This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for Standardization Work Part 1.Structure and Drafting Rules of Standardization Documents"
Drafting.
Please note that some of the contents of this document may involve patents. The issuing agency of this document is not responsible for identifying patents.
This document was proposed and managed by the National Semiconductor Equipment and Material Standardization Technical Committee (SAC/TC203).
Drafting organizations of this document. China Electronics Standardization Institute, Zhejiang Jingsheng Electromechanical Co., Ltd., China Electronics Technology Electronic Equipment Group
Co., Ltd., Beijing North Huachuang Microelectronics Equipment Co., Ltd., China Micro Semiconductor Equipment (Shanghai) Co., Ltd., Shanghai Microelectronics Equipment
(Group) Co., Ltd., Dongguan Zhonggal Semiconductor Technology Co., Ltd., Jiangsu Zhuoyuan Semiconductor Co., Ltd.
The main drafters of this document. Zhang Junhua, Feng Yabin, Cao Kewei, Cao Jianwei, Pei Huichuan, Zhu Liang, Zhou Zhe, Wu Xiaojuan, Du Ruoxin, Tang Caihong,
Ding Xiaomin, Fu Linjian, Wei Wei, Tian Tao, Liu Yingbin, Li Guoping, Wang Hongzhi.
Terminology of integrated circuit manufacturing equipment
1 Scope
This document specifies the basic and commonly used terms of integrated circuit (IC) manufacturing equipment, including basic terms, crystal growth processing equipment, masks
Terminology and common parts of manufacturing equipment, lithography and etching equipment, doping equipment, thin film deposition equipment, cleaning equipment, packaging equipment, testing equipment
the term.
This document applies to the design, development, production and application of integrated circuit manufacturing equipment, as well as the scientific research and teaching of integrated circuit manufacturing equipment.
Study and publishing work.
2 Normative references
There are no normative references in this document.
3 Basic terminology
3.1
Reliability
Under specified conditions, the ability of a device to perform its predetermined functions within a certain period of time.
3.2
Availability
When needed, the device is in the possibility of performing its predetermined functions.
3.3
Maintainability
The possibility that the equipment remains in or restored to a state capable of performing its predetermined functions within a specified time.
3.4
Mean time between failures meantimebetweenfailure; MTBF
The average time between two adjacent failures of the repairable product.
Note. MTBF is also known as "mean time between failures", which is a measure of the reliability of equipment, the unit is "hours (h)", which means that the equipment is guaranteed within a specified time
An ability to sustain function.
3.5
Mean time to repair meantimetorepair; MTTR
The average value of the time required for repairable products from failure to repair.
3.6
Mean time to failure meantimetofailure; MTTF
The average time the system can operate normally.
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