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GB/T 41213-2021: Integrated circuit full automatic die bonder
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| Standard ID | Contents [version] | USD | STEP2 | [PDF] delivered in | Standard Title (Description) | Status | PDF |
| GB/T 41213-2021 | English | 269 |
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Integrated circuit full automatic die bonder
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GB/T 41213-2021
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Basic data | Standard ID | GB/T 41213-2021 (GB/T41213-2021) | | Description (Translated English) | Integrated circuit full automatic die bonder | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | L95 | | Word Count Estimation | 13,126 | | Issuing agency(ies) | State Administration for Market Regulation, China National Standardization Administration | GB/T 41213-2021: Integrated circuit full automatic die bonder---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Integrated circuit full automatic die bonder
ICS 31:220
CCSL95
National Standards of People's Republic of China
Fully automatic chip loader for integrated circuits
Published on 2021-12-31
2022-07-01 Implementation
State Administration for Market Regulation
Released by the National Standardization Administration
directory
Preface III
1 Scope 1
2 Normative references 1
3 Terms and Definitions 1
4 Product structure, classification, model and basic parameters 2
4:1 Structure 2
4:2 Category 2
4:3 Type 2
4:4 Basic parameters 2
5 Working conditions 3
5:1 Cleanliness 3
5:2 Relative humidity 3
5:3 Ambient temperature 3
5:4 Anti-static requirements 3
5:5 Power Requirements 3
5:6 Equipment Current Requirements 3
5:7 Compressed air pressure and flow requirements 3
5:8 Vacuum pressure requirements 3
6 Requirements 4
6:1 Appearance 4
6:2 Transfer mechanism 4
6:3 Welding mechanism 4
6:4 Image Recognition System 4
6:5 Wafer table 4
6:6 Thimble mechanism 4
6:7 Dispensing mechanism 4
6:8 Blanking mechanism 5
6:9 Electrical section 5
6:10 Software Part 5
6:11 Safety requirements 5
7 Test method 6
7:1 Appearance 6
7:2 Transfer mechanism 6
7:3 Welding mechanism 6
7:4 Image Recognition System 6
7:5 Wafer table 6
7:6 Thimble mechanism 6
7:7 Dispensing mechanism 7
7:8 Blanking mechanism 7
7:9 Electrical inspection 7
7:10 Software Detection 7
7:11 Product Safety 7
8 Inspection rules 7
8:1 Inspection classification 7
8:2 Type inspection 7
8:3 Factory inspection 8
9 Marking, Packaging, Shipping and Storage 8
9:1 Flags 8
9:2 Packaging 9
9:3 Transport 9
9:4 Storage 9
foreword
This document is in accordance with the provisions of GB/T 1:1-2020 "Guidelines for Standardization Work Part 1: Structure and Drafting Rules of Standardization Documents"
drafted:
Please note that some content of this document may be patented: The issuing agency of this document assumes no responsibility for identifying patents:
This document is proposed and managed by the National Technical Committee for Standardization of Semiconductor Equipment and Materials (SAC/TC203):
This document is drafted by: Dalian Jiafeng Automation Co:, Ltd:, China Electronics Standardization Institute:
The main drafters of this document: Wang Yunfeng, Huang Jian, Liang Jingjing, Bian Zhicheng, Sun Yongjun, Sun Qichao, Li Deming, Zhang Fei, Du Fengqin, Feng Yabin,
Cao Kewei:
Fully automatic chip loader for integrated circuits
1 Scope
This document specifies the structure, classification, basic parameters, working conditions, requirements, test methods and inspection regulations of the automatic chip loader for integrated circuits:
regulations, marking, packaging, transportation and storage:
This document applies to fully automatic chip loaders for integrated circuit packaging:
2 Normative references
The contents of the following documents constitute essential provisions of this document through normative references in the text: Among them, dated citations
documents, only the version corresponding to that date applies to this document; for undated references, the latest edition (including all amendments) applies to
this document:
GB/T 191 Graphical signs of packaging, storage and transportation
GB/T 5226:1-2019 Mechanical and Electrical Safety Mechanical and Electrical Equipment Part 1: General Specifications
GB/T 13306 Signs
GB 50073-2013 Design code for clean workshop
3 Terms and Definitions
The following terms and definitions apply to this document:
3:1
wafer
Silicon wafers used in the fabrication of integrated circuits:
Note 1: The shape is circular:
Note 2: It can be processed into various circuit element structures on silicon wafers, and become semiconductor products such as ICs and discrete devices with specific electrical functions:
3:2
Scribing film tape
The film remaining after the wafer is cut and the protective film is removed:
Note: It plays the role of supporting and fixing the chip:
3:3
carrier
A kind of electrical connection between the terminal of the internal circuit of the chip and the outer lead by means of bonding materials (gold wire, aluminum wire, copper wire, etc:)
It is a key structural part of the electrical circuit:
Note 1: Including lead frame, substrate and ceramic plate, etc:
Note 2: It acts as a bridge to connect with external wires:
3:4
pressure force
The pick-up pressure to pick up the die from the wafer and the solder pressure to attach the die to the carrier:
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