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GB/T 4937.2-2006 English PDF

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GB/T 4937.2-2006: Semiconductor devices -- Mechanical and climatic test methods -- Part 2: Low air pressure
Status: Valid
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GB/T 4937.2-2006English134 Add to Cart 3 days [Need to translate] Semiconductor devices -- Mechanical and climatic test methods -- Part 2: Low air pressure Valid GB/T 4937.2-2006

PDF similar to GB/T 4937.2-2006


Standard similar to GB/T 4937.2-2006

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Basic data

Standard ID GB/T 4937.2-2006 (GB/T4937.2-2006)
Description (Translated English) Semiconductor devices -- Mechanical and climatic test methods -- Part 2: Low air pressure
Sector / Industry National Standard (Recommended)
Classification of Chinese Standard L40
Classification of International Standard 31.080
Word Count Estimation 7,720
Date of Issue 2006-08-23
Date of Implementation 2007-02-01
Older Standard (superseded by this standard) GB/T 4937-1995 Partial
Quoted Standard IEC 60068-2-13
Adopted Standard IEC 60749-2-2002, IDT
Regulation (derived from) China Announcement of Newly Approved National Standards No. 9, 2006 (No. 96 overall)
Issuing agency(ies) General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China
Summary This standard applies to low pressure testing of semiconductor devices. The purpose of this test is a side fixed components and material ability to prevent electrical breakdown failure, and this failure is due to air pressure decreases, the air insulation and other insulating material weakening caused. This item applies only to face trial work voltage exceeding 1 000 V devices. This test applies to all air sealing semiconductor devices. This test applies only to military and space fields. The term low pressure test methods and IEC 60068-2-13 largely the same, but in view of the special requirements of semiconductor devices, the use of this part of the terms.

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