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GB/T 4937.12-2018: Semiconductor devices -- Mechanical and climatic test methods -- Part 12: Vibration, variable frequency
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| GB/T 4937.12-2018 | English | 119 |
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Semiconductor devices -- Mechanical and climatic test methods -- Part 12: Vibration, variable frequency
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GB/T 4937.12-2018
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Basic data | Standard ID | GB/T 4937.12-2018 (GB/T4937.12-2018) | | Description (Translated English) | Semiconductor devices -- Mechanical and climatic test methods -- Part 12: Vibration, variable frequency | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | L40 | | Classification of International Standard | 31.080.01 | | Word Count Estimation | 6,614 | | Date of Issue | 2018-09-17 | | Date of Implementation | 2019-01-01 | | Issuing agency(ies) | State Administration for Market Regulation, China National Standardization Administration | GB/T 4937.12-2018: Semiconductor devices -- Mechanical and climatic test methods -- Part 12: Vibration, variable frequency
---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Semiconductor devices - Mechanical and climatic test methods - Part 12. Vibration, variable frequency
ICS 31.080.01
L40
National Standards of People's Republic of China
Semiconductor device mechanical and climatic test methods
Part 12. Sweeping vibration
Part 12.Vibration,variablefrequency
(IEC 60749-12.2002, IDT)
Published on.2018-09-17
2019-01-01 implementation
State market supervision and administration
China National Standardization Administration issued
Foreword
GB/T 4937 "Mechanical and Climatic Test Methods for Semiconductor Devices" consists of the following components.
--- Part 1. General;
--- Part 2. Low pressure;
--- Part 3. External visual inspection;
--- Part 4. Strongly accelerated steady-state damp heat test (HAST);
---Part 5. Steady-state temperature and humidity bias life test;
---Part 6. High temperature storage;
--- Part 7. Internal water vapor content test and other residual gas analysis;
--- Part 8. Sealing;
---Part 9. Logo durability;
--- Part 10. Mechanical shock;
--- Part 11. rapid temperature change double tank method;
--- Part 12. Sweeping vibration;
--- Part 13. Salt spray;
--- Part 14. Terminal strength (lead robustness);
---Part 15. Resistance to soldering of through-hole mounting devices;
--- Part 16. Particle collision noise detection (PIND);
---Part 17. Neutron irradiation;
---Part 18. Ionizing radiation (total dose);
---Part 19. Chip shear strength;
--- Part 20. The combined effects of moisture-resistant and soldering heat on plastic surface mount devices;
---Part 20-1. Operation, packaging, marking and transport of surface mount devices sensitive to the combined effects of moisture and soldering heat;
---Part 21. Solderability;
---Part 22. Bonding strength;
--- Part 23. High temperature working life;
--- Part 24. Accelerated moisture-resistant and non-biased strong accelerated stress test (HSAT);
---Part 25. Temperature cycling;
--- Part 26. Electrostatic discharge (ESD) sensitivity test human body model (HBM);
--- Part 27. Electrostatic discharge (ESD) sensitivity test mechanical model (MM);
--- Part 28. Electrostatic discharge (ESD) sensitivity test, charged device model (CDM), device level;
---Part 29. Latch test;
--- Part 30. Pre-treatment of unsealed surface mount devices prior to reliability testing;
--- Part 31. Flammability of plastic encapsulated devices (internal);
--- Part 32. Flammability of plastic encapsulated devices (external);
---Part 33. Accelerated moisture resistance without bias high pressure cooking;
--- Part 34. Power cycling;
--- Part 35. Acoustic scanning microscopy of plastic electronic components;
---Part 36. Constant acceleration;
--- Part 37. Plate-level drop test method using accelerometers;
--- Part 38. Soft error test methods for semiconductor memory devices;
--- Part 39. Measurement of moisture diffusivity and water dissolution rate of raw materials for semiconductor components;
--- Part 40. Plate-level drop test method using tension meter;
--- Part 41. Reliability test methods for non-volatile memory devices;
--- Part 42. Storage of temperature and humidity;
--- Part 43. Guide to the reliability identification scheme for integrated circuits (ICs);
--- Part 44. Test method for neutron beam irradiation single particle effect of semiconductor devices.
This part is the 12th part of GB/T 4937.
This part is drafted in accordance with the rules given in GB/T 1.1-2009.
This section uses the translation method equivalent to IEC 60749-12.2002 "Semiconductor device mechanical and climatic test methods Part 12.
Sweeping vibration.
Please note that some of the contents of this document may involve patents. The issuing organization of this document is not responsible for identifying these patents.
This part was proposed by the Ministry of Industry and Information Technology of the People's Republic of China.
This part is under the jurisdiction of the National Semiconductor Device Standardization Technical Committee (SAC/TC78).
This section was drafted. The 13th Research Institute of China Electronics Technology Group Corporation.
The main drafters of this section. Chi Lei, Peng Hao, Yue Zhenpeng, Li Shujie, Cui Bo, Gao Jinhuan, Yan Xuan, Zhang Yanjie.
Semiconductor device mechanical and climatic test methods
Part 12. Sweeping vibration
1 Scope
The purpose of this part of GB/T 4937 is to determine the effect of vibration on the device over a specified frequency range. This test is a destructive test
It is usually used for devices with cavities.
This test is basically the same as GB/T 2423.10-2008, but in view of the special requirements of semiconductor devices, the terms of this part are adopted.
2 Normative references
The following documents are indispensable for the application of this document. For dated references, only dated versions apply to this article.
Pieces. For undated references, the latest edition (including all amendments) applies to this document.
GB/T 2423.10-2008 Environmental testing for electric and electronic products - Part 2. Test method test Fc. Vibration (sinusoidal)
(IEC 60068-2-6.1995, IDT)
3 test equipment
The equipment required for this test includes a vibration device capable of sweeping vibration under specified conditions, and the light necessary for measurement after the test.
Learning and electrical equipment.
4 test procedure
The sample should be rigidly mounted on the shaker table and the terminals and cables should be securely secured to avoid introducing additional lead resonance. Should be made
The product is a simple harmonic vibration with a magnitude of twice the amplitude of 1.5 mm (peak-to-peak) or a peak acceleration of.200 m/s2, whichever is smaller. Vibration frequency
The rate is approximately logarithmic in the range of 20 Hz to.2000 Hz. From 20Hz to.2000Hz and back to the entire frequency range of 20Hz
The moving time should not be less than 4 minutes. This cycle was performed 4 times in each of the X, Y, and Z directions (12 times in total).
4.1 Inspection
Visual inspection, electrical performance testing (including electrical parameter testing and functional testing) and sealing inspection (gas) in accordance with the relevant documents
Closed package device).
4.2 Failure criteria
According to the provisions of the relevant documents, if the parameters of the device are out of tolerance, the function is lost under normal or extreme conditions, the sealing device leaks, etc.
In the case, the device is judged to be invalid. Magnify 10 times to 20 times to check if there is package crack, breakage or breakage caused by non-installation or human operation.
When the mechanical damage is caused, the device is judged to be invalid.
5 Description
Relevant documents should specify the following.
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