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GB/T 28859-2025: Epoxy powder encapsulation material for electronic packaging
Status: Valid GB/T 28859: Evolution and historical versions
| Standard ID | Contents [version] | USD | STEP2 | [PDF] delivered in | Standard Title (Description) | Status | PDF |
| GB/T 28859-2025 | English | 359 |
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Epoxy powder encapsulation material for electronic packaging
| Valid |
GB/T 28859-2025
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| GB/T 28859-2012 | English | 299 |
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Encapsulating material of powdered epoxy for electronic components
| Valid |
GB/T 28859-2012
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Standard similar to GB/T 28859-2025 GB/T 51033 GB/T 50082 GB/T 28859 Basic data | Standard ID | GB/T 28859-2025 (GB/T28859-2025) | | Description (Translated English) | Epoxy powder encapsulation material for electronic packaging | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | L90 | | Classification of International Standard | 31.030 | | Word Count Estimation | 18,160 | | Date of Issue | 2025-08-01 | | Date of Implementation | 2026-02-01 | | Older Standard (superseded by this standard) | GB/T 28859-2012, GB/T 28861-2012 | | Issuing agency(ies) | State Administration for Market Regulation, Standardization Administration of China | GB/T 28859-2025: Epoxy powder encapsulation material for electronic packaging---This is an excerpt. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.), auto-downloaded/delivered in 9 seconds, can be purchased online: https://www.ChineseStandard.net/PDF.aspx/GBT28859-2025
ICS 31.030
CCSL90
National Standard of the People's Republic of China
Replaces GB/T 28859-2012, GB/T 28861-2012
Epoxy powder encapsulant for electronic packaging
Released on August 1, 2025
Implementation on February 1, 2026
State Administration for Market Regulation
The National Standardization Administration issued
Preface
This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for standardization work Part 1.Structure and drafting rules for standardization documents"
Drafting.
This document replaces GB/T 28859-2012 “Epoxy Powder Encapsulants for Electronic Components” and GB/T 28861-2012 “Epoxy Powder
Test method for melt flowability of encapsulating materials". Compared with GB/T 28859-2012 and GB/T 28861-2012, in addition to structural adjustments and editorial
In addition to the modifications, the main technical changes are as follows.
a) Added terms and definitions (see Chapter 3);
b) The product classification has been changed (see Chapter 4, 3.1 of GB/T 28859-2012);
c) Deleted composition and materials (3.2 of GB/T 28859-2012);
d) The properties of the encapsulating material powder have been changed (see 5.1, 4.1 of GB/T 28859-2012);
e) The properties of the cured encapsulant have been changed (see 5.2, 4.2 of GB/T 28859-2012);
f) The equipment, test steps and results of softening point (Kofler hot plate method) have been changed (see 6.1.3, GB/T 28859-2012
5.1.3);
g) Modified the flowability test method, sample preparation, test procedures, and test report (see 6.1.6 and Appendix B, GB/T 28859-2012
5.1.6, Chapter 5 to Chapter 8 of GB/T 28861-2012);
h) The inspection requirements for cured products have been changed (see 6.2, 5.2 of GB/T 28859-2012);
i) The insulation resistance description and reference documents have been changed (see 6.2.3, 5.2.3 of GB/T 28859-2012);
j) The reference document for glass transition temperature has been changed (see 6.2.5, 5.2.5 of GB/T 28859-2012);
k) The description of temperature shock resistance has been changed (see 6.2.9, 5.2.9 of GB/T 28859-2012);
l) The test method for hardness has been changed (see 6.2.10, 5.2.10 of GB/T 28859-2012);
m) Added "Flexural Strength", "Flexural Modulus", "Thermal Conductivity", "Electrical Conductivity", "Comparative Tracking Index (CTI)" and "Volume Resistivity"
Test method (see 6.2.11 to 6.2.15);
n) The identification inspection and quality consistency inspection items and sampling descriptions have been changed (see 7.2, 7.3, and 6.2, 6.3 of GB/T 28859-2012);
o) The requirements for packaging, labeling, storage and transportation have been changed (see Chapter 8 and Chapter 7 of GB/T 28859-2012).
Please note that some of the contents of this document may involve patents. The issuing organization of this document does not assume the responsibility for identifying patents.
This document was proposed and coordinated by the National Technical Committee for Semiconductor Equipment and Materials Standardization (SAC/TC203).
This document was drafted by. China Electronics Technology Standardization Institute, Beijing Qixing Flight Electronics Co., Ltd., Tianjin Kaihua Insulation Materials Co., Ltd.
Co., Ltd., Xianyang Xinweihua Insulation Materials Co., Ltd., Guangdong Changxing Semiconductor Technology Co., Ltd., Wuhan Shangsai Optoelectronics Technology Co., Ltd.
Shenzhen Boen New Materials Co., Ltd., Shantou Free Trade Zone Songtian Electronic Technology Co., Ltd., Zhejiang Sanshiji New Materials Technology Co., Ltd.
Co., Ltd., Xi'an Hongxing Electronic Paste Technology Co., Ltd.
The main drafters of this document are. Guan Qi, Li Yang, Ren Kaikuo, Cao Kewei, Zhang Baoshuai, Lian Junjie, Zhou Qingfeng, Wu Yiran, Chang Anji, Zhao Junsha,
Shi Zeyuan, Zhang Hui, Liu Cheng, Yuan Feng, Liu Nianjie, Zhang Zhiqiang, Mu Guangyuan, Tang Zhengyang, Huang Chenyao, Li Wen, and Zhao Ying.
The previous versions of this document and the documents it replaces are as follows.
---First published in.2012 as GB/T 28859-2012 and GB/T 28861-2012;
---This is the first revision.
Epoxy powder encapsulant for electronic packaging
1 Scope
This document specifies the product classification, requirements, inspection rules and packaging of epoxy powder encapsulants for electronic packaging (hereinafter referred to as "encapsulants").
It also describes the requirements for packaging, labeling, storage and transportation, and the corresponding test methods.
This document applies to electronic components such as ceramic capacitors, varistors, film capacitors, resistor networks, thermistors, etc.
Encapsulation is done with epoxy powder encapsulant.
2 Normative references
The contents of the following documents constitute the essential clauses of this document through normative references in this document.
For referenced documents without a date, only the version corresponding to that date applies to this document; for referenced documents without a date, the latest version (including all amendments) applies to
This document.
GB/T 1034-2008 Determination of water absorption of plastics
GB/T 1408.1 Test methods for electric strength of insulating materials Part 1.Tests at power frequency
GB/T 1409-2006 Measurement of permittivity and dielectric loss of electrical insulating materials at power frequency, audio frequency and high frequency (including meter wave wavelength)
Recommended method for loss factor
GB/T 1636 Plastics - Determination of apparent density of materials capable of flowing from a specified funnel
GB/T 2411 Plastics and hard rubber - Determination of indentation hardness (Shore hardness) using a durometer
GB/T 3139 Test method for thermal conductivity of fiber reinforced plastics
GB/T 4207-2022 Determination of tracking resistance index and relative tracking index of solid insulating materials
GB/T 4722-2017 Test methods for rigid copper-clad laminates for printed circuits
GB/T 5169.16-2017 Fire hazard tests for electric and electronic products Part 16.Test flame 50W horizontal and vertical flame
Test methods
GB/T 6003.1 Technical requirements and inspection of test sieves Part 1.Wire mesh test sieves
GB/T 9341 Determination of flexural properties of plastics
GB/T 21782.9 Powder coatings Part 9.Sampling
GB/T 26572 Limit requirements for restricted substances in electrical and electronic products
GB/T 28858-2012 Phenolic encapsulant for electronic components
GB/T 28860 Determination of gelling time of epoxy powder encapsulants
GB/T 28862 Epoxy powder encapsulant sample processing method
GB/T 31838.2 Dielectric and resistive properties of solid insulating materials Part 2.Resistance properties (DC method) Volume resistance and
Volume resistivity
GB/T 31838.4 Dielectric and resistive properties of solid insulating materials Part 4.Resistance characteristics (DC method) Insulation resistance
GB/T 36800.2 Thermomechanical analysis of plastics (TMA) Part 2.Coefficient of linear thermal expansion and glass transition temperature
Determination
GB/T 40564-2021 Test methods for epoxy molding compounds for electronic packaging
3 Terms and Definitions
There are no terms or definitions that require definition in this document.
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