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Encapsulating material of phenolic for electronic components
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Basic data | Standard ID | GB/T 28858-2012 (GB/T28858-2012) | | Description (Translated English) | Encapsulating material of phenolic for electronic components | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | L90 | | Classification of International Standard | 31.030 | | Word Count Estimation | 12,120 | | Quoted Standard | GB/T 1408.1-2006; GB/T 1409-2006; GB/T 2411-2008; GB/T 4722; GB/T 6003.1-1997; GB/T 10064-2006 | | Regulation (derived from) | National Standards Bulletin 2012 No. 28 | | Issuing agency(ies) | General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China | | Summary | This standard specifies the phenolic encapsulation materials for electronic components (hereinafter referred to as encapsulation materials) classification, technical requirements, inspection rules, test methods, packaging, labeling, storage and transporta |
GB/T 28858-2012: Encapsulating material of phenolic for electronic components---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Encapsulating material of phenolic for electronic components
ICS 31.030
L90
National Standards of People's Republic of China
Electronic Component encapsulation materials with phenolic
Issued on. 2012-11-05
2013-02-15 implementation
Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China
Standardization Administration of China released
Foreword
This standard was drafted in accordance with GB/T 1.1-2009 given rules.
The standard equipment by the National Standardization Technical Committee and the semiconductor material (SAC/TC203) and focal points.
This standard was drafted. Xianyang Wei-hua Insulation Materials Co., Ltd., Xianyang Reid Electronic Technology Co., Ltd., Yantai namics Electronic Materials
Ltd., Shandong Laizhou Smooth Electronic Materials Co., Matsuda Shantou High-tech Zone Industrial Co., Ltd., China Electronics Standardization Institute
Studies, Shaanxi Huaxing Electronics Group Co., Ltd., Chengdu Hongming Electronics Co., Ltd., Beijing Seven Star flight Electronics Co., Ltd., Michael Falkenhausen
G (Changzhou) Services Limited.
The main drafters of this standard. High Yan Ru, Liu Nianjie, Zhang Ping, Huang Ruinan, Liu Yun, Peihui Chuan, Realing.
Electronic Component encapsulation materials with phenolic
1 Scope
This standard specifies the encapsulation of electronic components with phenolic material (hereinafter referred to as encapsulation materials) classification, technical requirements, inspection rules, test methods,
Packaging, labeling, storage and transportation requirements.
This standard applies to ceramic capacitors, piezoelectric ceramic element, thermistor, thick film circuit and other electronic components encapsulated with phenolic wet bag
Seal material.
2 Normative references
The following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein
Member. For undated references, the latest edition (including any amendments) applies to this document.
GB/T 1408.1-2006 electrical insulating materials strength test methods - Part 1. Tests at power frequencies
GB/T 1409-2006 Measurement of electrical insulating materials at power, audio, high-frequency (including meter wavelengths included) of the permittivity and dielectric loss
The recommended method consumption factor
GB/T 2411-2008 Plastics and ebonite - Determination of indentation hardness using a durometer (Shore hardness)
GB/T 4722 printed circuits copper clad laminates Test Method
GB/T 6003.1-1997 Test sieves of metal wire cloth
Test methods of insulation resistance of solid insulating materials GB/T 10064-2006 Determination
3 product classification, composition and materials
3.1 Classification
Encapsulation materials according to their different characteristics into conventional drying and quick-drying type, model and characteristics are shown in Table 1.
Table 1 Type and characteristics of the encapsulating material
Characteristics of a Model
FS-150-C Drying time > 2h/25 ℃
FS-150-K Drying time ≤2h/25 ℃
NOTE. The encapsulation materials by type binder, the application form, the curing temperature of the material, the material properties of code. F codes for the phenolic resin; material is the S
Application Form Code (ie wet); 150 curing temperature for the material of the code; C conventional drying; K for quick drying.
a component in accordance with Appendix A encapsulation.
3.2 Composition and Materials
3.2.1 Composition
Encapsulating material is a phenolic resin-based binder, adding pigments, fillers and other additives from milling.

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