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Database: 189759 (26 Oct 2025)
YS/T 1637-2023 English PDF
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YS/T 1637-2023
: (Fine tin-based alloy solder powder)
Status: Valid
Standard ID
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YS/T 1637-2023
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(Fine tin-based alloy solder powder)
Valid
YS/T 1637-2023
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Basic data
Standard ID
YS/T 1637-2023 (YS/T1637-2023)
Description (Translated English)
(Fine tin-based alloy solder powder)
Sector / Industry
Nonferrous Metallurgy Industry Standard (Recommended)
Classification of Chinese Standard
H62
Classification of International Standard
77.150.60
Word Count Estimation
9,963
Date of Issue
2023-12-20
Date of Implementation
2024-07-01
Issuing agency(ies)
Ministry of Industry and Information Technology
Summary
This standard specifies the classification and labeling, technical requirements, test methods, inspection rules, marking, packaging, packaging, transportation, storage and accompanying documents and order form content of fine tin-based alloy solder powder. This standard applies to fine tin-based alloy solder powder for electronic packaging and electronic circuit interconnection.
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