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GB/T 5226.33-2017: Electrical safety of machinery -- Electrical equipment of machines -- Part 33: Requirements for semiconductor fabrication equipment
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Electrical safety of machinery -- Electrical equipment of machines -- Part 33: Requirements for semiconductor fabrication equipment
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GB/T 5226.33-2017
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Basic data | Standard ID | GB/T 5226.33-2017 (GB/T5226.33-2017) | | Description (Translated English) | Electrical safety of machinery -- Electrical equipment of machines -- Part 33: Requirements for semiconductor fabrication equipment | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | J09 | | Classification of International Standard | 29.020 | | Word Count Estimation | 96,917 | | Date of Issue | 2017-10-14 | | Date of Implementation | 2018-05-01 | | Quoted Standard | GB/T 4025-2010; GB/T 4026-2010; GB/T 4205-2010; GB 4793.1-2007; GB/T 7974-2010; GB/T 12668.201-2013; GB/T 13002-2008; GB/T 16842-2016; GB/T 16895.5-2012; GB/T 16895.21-2011; GB/T 16895.23-2012; GB/T 18209.1-2010; GB/T 18216.3-2012; GB/T 19212.7-2012; GB 2 | | Adopted Standard | IEC 60204-33-2009, IDT | | Regulation (derived from) | National Standard Announcement 2017 No. 26 | | Issuing agency(ies) | General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China | | Summary | This standard specifies the semiconductor equipment manufacturing, measuring, assembly and testing of electrical, electronic and programmable electronic equipment and system safety requirements. This section refers to the device from the introduction of machinery and electrical power supply Department began (see 5.1) This Part applies to electrical equipment or electrical equipment components, the nominal voltage does not exceed 1000Va.c. Or 1500Vd.c., Rated frequency does not exceed 200 Hz. For higher voltages or frequencies, special requirements may be required. This section includes protective measures for electrical safety hazards and electrical interlock protection circuit for non-electrical safety hazards, but does not cover all the requirements for personal safety protection (such as chemical hazards, mechanical hazards, radiation harm) | GB/T 5226.33-2017: Electrical safety of machinery -- Electrical equipment of machines -- Part 33: Requirements for semiconductor fabrication equipment
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Electrical safety of machinery. Electrical equipment of machines. Part 33. Requirements for semiconductor fabrication equipment
ICS 29.020
J09
National Standards of People's Republic of China
Mechanical Electrical Safety Mechanical Electrical Equipment
Part 33. Technical specifications for semiconductor equipment
Part 33.Requirementsforsemiconductorfabricationequipment
(IEC 60204-33.2009, Safety of manufacturing-Electric appliance equipment-machinery-
Part 33.Requirementsforsemiconductorfabricationequipment, IDT)
2017-10-14 Published
2018-05-01 implementation
General Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China
China National Standardization Administration released
Directory
Introduction Ⅶ
1 Scope 1
2 Normative references 1
3 Terms and definitions 3
4 basic requirements 11
4.1 General principles 11
4.2 Selection of electrical equipment 11
4.3 Power Supply 11
4.4 The actual environment and operating conditions 12
4.5 Transportation and storage 12
4.6 equipment handling 12
4.7 Installation 12
5 Introduce the power cord termination method and disconnect switch 12
5.1 Introduction of the power cord termination method 12
5.2 Connect the terminal of the external protective earthing system 13
5.3 power cut off (isolation) switch 13
5.4 additional cutting device 15
5.5 Protection from unauthorized, negligent and wrong connections 15
6 electric shock protection
6.1 Overview 16
6.2 direct contact protection 16
6.3 Indirect contact protection 17
6.4 Protection with PELV 18
6.5 Prevent skilled workers and trainees from touching hazardous live parts 19
7 Protection of Electrical Equipment 19
7.1 Overview 19
7.2 Overcurrent protection 20
7.3 Motor overheating protection 22
7.4 motor speeding protection 22
7.5 Detection of abnormal temperature 23
7.6 Protection against interruption of power supply or subsequent restoration of voltage drop 23
7.7 Ground fault/residual current protection 23
7.8 Phase Sequence Protection 23
7.9 Lightning and Switch Surge Protection Overvoltage Protection 23
7.10 electrolytic capacitor 23
8 equipotential bonding 23
8.1 Overview 23
8.2 Protection circuit 25
8.3 Functional Linkages 27
8.4 Limit the impact of large leakage current measures 27
9 control circuit, emergency disconnect (EMO) and protection interlock circuit 27
9.1 Control Circuit 27
9.2 Emergency Disconnect (EMO) 28
9.3 Operations other than emergency disconnection 29
9.4 Interlocking protection 30
9.5 Suspension of safety functions and/or protective measures 31
10 control panel and control device 31 mounted on the machine
10.1 General Regulations 31
10.2 button 32
10.3 Indicators 33
10.4 Cursor buttons 34
10.5 Rotate the control device 34
10.6 Start Device 34
10.7 Emergency disconnect device 34
10.8 Emergency stop device 35
10.9 Enable Control Device 35
11 Control Equipment. Location, Installation and Electrical Cabinets 35
11.1 General requirements 35
11.2 Location and Installation 35
11.3 Degree of protection 36
11.4 Panel 36
12 conductor and cable 38
12.1 General requirements 38
12.2 Insulation 39
12.3 Current carrying capacity 39
12.4 Wire and Cable Voltage Drops 39
12.5 Flexible Cable 39
13 Wiring Technology 40
13.1 Connection and Cabling 40
13.2 Multi-Socket Assembly 42
13.3 Plug/Socket Assembly 42
13.4 Lead Identification 42
13.5 outside the cabinet wiring 43
13.6 Pipes, junction boxes and other junction boxes
Motor and related equipment 46
14.1 General requirements 46
14.2 Remotely mounted motor 46
14.3 Motor Size 46
14.4 Motor Mounting and Compartment 46
15 Accessories and lighting 46
15.1 Annex 46
15.2 Local Lighting of Semiconductor Equipment 46
16 marks, warning signs and reference code 47
16.1 Overview 47
16.2 Shock hazard warning signs 47
16.3 Function Recognition 47
16.4 Equipment nameplate 48
16.5 Refer to code 48
Technical documents 48
17.1 General 48
17.2 Information provided 48
17.3 Requirements applicable to all documents 49
17.4 Installation Documents 49
17.5 Sketch Map and Function Chart 50
17.6 Circuit Diagram 50
17.7 Operating Documents 50
17.8 Repair Documents 50
18 Test 51
18.1 Overview 51
18.2 Ground Continuity and Protection Bonding Circuit Continuity Test 51
18.3 Test of contact current of integrated power cord 52
18.4 pressure test 52
18.5 Cable Pull Test 53
18.6 Short circuit test of electrical output 54
18.7 Interlock protection circuit function test 54
18.8 Storage capacitor discharge test (see 6.2.4) 54
18.9 Temperature Test 55
18.10 cabinet strength test; 30N stability test 55
18.11 Electrical cabinet strength test; 250N stability test 56
18.12 Finger test 56
18.13 Wire bending test 56
18.14 Insulation resistance test 57
18.15 EMO Functional Test 57
18.16 Input Current Test 57
18.17 Other safety circuit experiments 57
18.18 Motor Temperature Test 57
Appendix A (Normative) Basic protection in TN system (indirect contact protection) (from GB/T 16895.21-2011
And GB/T 16895.23-2012) 59
Appendix B (Normative) Protection of indirect contacts in TT systems (from GB/T 16895.21-2011 and
GB/T 16895.23-2012) 62
Appendix C (Normative) Conductor current carrying capacity, clearance and creepage distance 64
Appendix D (Normative) Standard Trial Version 70
Appendix E (informative) system grounding type (cited from IEC 60364-1.2005) 72
References 86
Figure 1 Equipotential grounding electrical equipment example 24
Figure 2 front of the electrical enclosure space 38
Figure A.1 Typical configuration of faulty loop impedance measurement 61
Figure D.1 Rigid test finger 70
Figure D.2 Hinged test finger 71
Figure E.1 The overall system neutral and protective conductor is a separate TN-S system 73
Figure E.2 Entire system grounding conductor and protective conductor are separate TN-S systems 73
Figure E.3 TN-S System with Protective Earth Without Distribution Neutral Conductor
Figure E.4 In a TN-CS three-phase, four-wire system, PEN is separated from N by somewhere in the installation 74
Figure E.5 In a three-phase, four-wire TN-CS system, the PEN is split into PE and N 75 at the incoming terminal
Figure E.6 In a single-phase, two-wire TN-CS system, the PEN is split into PE and N 75 at the incoming terminal
Figure E.7 TN-C system The whole system of neutral conductor and protective conductor 76
Figure E.8 TN-CS multi-supply system for protecting conductors and neutrals in electrical consumers 77
Figure E.9 TN Multi-Power System with Two-Phase or Three-Phase Load, Whole System with Conductor Protection and Without Centerline 78
Figure E.10 TT system with neutral and protective conductors separated throughout the installation 79
Figure E.11 TT system with a grounded protective conductor throughout the installation without centerline 79
Figure E.12 All exposed conductive parts are interconnected by a common ground protective conductor IT system 80
Figure E.13 IT System with Exposed Conductive Portions Grounded or Individually Grounded 80
Figure E.14 TN-S DC System 81
Figure E.15 TN-C DC System 82
Figure E.16 TN-CS DC System 83
Figure E.17 TT DC System 84
Figure E.18 IT DC System 85
Table 1 transformer thermal protection without over-current protection 21
Table 2 Transformer Overcurrent Protection with Thermal Protection 22
Table 3 button actuator color code and its meaning 32
Table 4 Button Symbol 33
Table 5 Indicator Colors and Their Meaning with respect to Semiconductor Device Status 34
Table 6 Acceptable temperature of electrical equipment components 55
Table A.1 TN system, the longest cut-off time 59
Table B.1 the longest cut-off time 63
Table C.1 conductor carrying capacity of AWG30-4, ambient temperature 30 ℃ 64
Table C.2 25mm2 ~ 600kcmil conductor carrying capacity, ambient temperature 30 ℃ 65
Table C.3 Derating Capacity (According to Table C.1 and Table C.2) 0.050mm2 ~ 4.00mm2 65
Table C.4 Ambient temperature correction factor 66
Table C.5 Uninsulated busbar size 66
Table C.6 Clearances and creepage distances at cleanroom class 1000 or lower 68
Table C.7 Printed Wiring Board (PWB) Creepage 68
Table C.8 Clearances and creepage distances 69 above cleanroom class 1000
Foreword
GB/T 5226 "mechanical and electrical safety mechanical and electrical equipment" to be divided into sections published, has released the following sections.
--- Part 1. General technical conditions;
--- Part 6. Construction machinery and technical conditions;
--- Part 11. Technical conditions for high-voltage equipment with voltage higher than 1000Va.c. Or 1500Vd.c. But not exceeding 36kV;
--- Part 31 - Special safety and electromagnetic compatibility requirements for sewing machines, sewing units and systems;
--- Part 32. General technical requirements for lifting machinery;
--- Part 33. Semiconductor equipment technical conditions.
This section GB/T 5226 Part 33.
This section drafted according to GB/T 1.1-2009 given rules.
This section uses the translation method identical with IEC 60204-33.2009 "Mechanical safety machinery and electrical equipment Part 33. Semiconductor equipment
Preparation of technical conditions "(1st edition, English version).
The documents of our country that are consistent with the corresponding international documents that are normative references in this section are as follows.
--- GB/T 156-2007 standard voltage (IEC 60038.2002, MOD)
--- GB/T 4208-2017 Enclosure rating (IP code) (IEC 60529.2001, IDT)
--- GB/T 4728 (all parts) Electrical diagrams with graphical symbols [IEC 60617 (all parts)]
--- GB 4943.1-2011 Information technology equipment safety Part 1. General requirements (IEC 60950-1.2005, MOD)
--- GB/T 5169.16-2008 Fire hazard testing for electrician and electronic products - Part 16. Test flame 50W level and vertical
Straight flame test method (IEC 60695-11-10.2003, IDT)
--- GB/T 5465 (all parts) Graphical symbols for electrical equipment [IEC 60417 (all parts)]
--- GB/T 16855 (all parts) Mechanical safety control systems related to safety components [ISO 13849 (all parts)]
--- GB/T 16855.1-2008 Safety of Machinery for Safety of Machinery-Part 1. Design Principles (ISO 13849-
1.2006, IDT)
--- GB/T 18209 (All Parts) Mechanical Safety Instructions, Signs and Operations [IEC 61310 (All Parts)]
--- GB/T 19212.1-2016 Safety of transformers, reactors, power supply units and combinations - Part 1. General requirements and tests
Inspection (IEC 61558-1.2009, MOD)
--- GB/T 19671-2005 mechanical safety two-hand control device functional status and design principles (ISO 13851.2002,
MOD)
--- GB/T 20438 (all parts) Functional safety of electrical/electronic/programmable electronic safety-related systems [IEC 61508
section)]
This section made the following editorial changes.
--- Standard name changed to "mechanical and electrical safety machinery and electrical equipment Part 33. Semiconductor equipment, technical conditions."
This part is proposed by China Machinery Industry Federation.
This part of the National Industrial Machinery Electrical System Standardization Technical Committee (SAC/TC231) centralized.
This section is responsible for drafting unit. Semiconductor Devices (Shanghai) Co., Ltd..
This section participates in the drafting unit. Beijing Machine Tool Research Institute, Shanghai Microelectronics Equipment Co., Ltd., Beijing North Microelectronics Base Equipment Technology
Research Center Co., Ltd., Shenyang Tuo Jing Technology Co., Ltd., Beijing Seven Star Huachuang Electronics Co., Ltd., Sheng photoelectric equipment
Sea) Co., Ltd., Ideal Solar (Shanghai) Co., Ltd., Shengmei Semiconductor Equipment (Shanghai) Co., Ltd.
The main drafters of this section.Li Tianxiao, Huang Zuguang, Wang Haitao, Tian Bao Xia, Guo Heping, Shen Hong, Sun Dongxi, Pan Jufeng, Sun Yan, Liu Zhongwu,
Zhang Zhiqiang, Li Zhong, Xue Ruijuan.
Mechanical Electrical Safety Mechanical Electrical Equipment
Part 33. Technical specifications for semiconductor equipment
1 Scope
This section GB/T 5226 specifies the manufacture, measurement, assembly and testing of semiconductor equipment related to electrical, electronic and programmable electronic
Equipment and system safety requirements.
Note 1. The term "electrical" in this section includes three aspects of electrical, electronic and programmable electronic equipment (such as electrical equipment refers to electrical equipment, electronic equipment and programmable
Electronic equipment).
NOTE 2 For the purposes of this standard, the term "Person" generally refers to any individual including the person assigned, used and managed by the user or his agent.
The equipment referred to in this section starts from the power lead-in of mechanical and electrical equipment (see 5.1).
Note 3. GB/T 16895 series of standards for building electrical installations are given.
This section applies to electrical equipment or electrical equipment components, the nominal voltage does not exceed 1000Va.c. Or 1500Vd.c., rated frequency
Not more than.200Hz. For higher voltages or frequencies, special requirements may be required.
Note 4. Electrical equipment within the derived voltage exceeds the supply voltage limit is still within the scope of this section.
This section includes protective measures for electrical safety hazards and electrical interlock protection circuit for non-electrical safety hazards, but does not cover
All requirements for personal safety protection (such as chemical, mechanical and radiation hazards) as prescribed by other standards or regulations. Each type
The machinery meets its specific requirements to provide adequate safety.
The following electrical installations for semiconductor manufacturing equipment shall provide additional and special technical requirements.
--- Use, processing or production of explosive materials;
--- Used in flammable and explosive environment;
--- There is a special risk when producing or using a material;
--- As lifting machinery (included in IEC 60204-32).
This section does not include semiconductor equipment performance or functional specifications. This section does not involve may have an impact on human health from
Semiconductor equipment emissions (such as electromagnetic fields, noise).
This section does not specify the electromagnetic compatibility (EMC) requirements.
2 Normative references
The following documents for the application of this document is essential. For dated references, only the dated version applies to this edition
file. For undated references, the latest edition (including all amendments) applies to this document.
GB/T 4025-2010 man-machine interface markings of the basic and safety rules Indicator and operating device coding rules
(IEC 60073.2002, IDT)
GB/T 4026-2010 man-machine interface signs the basic and safety rules Identification of equipment terminals and conductor terminals
(IEC 60445.2006, IDT)
GB/T 4205-2010 man-machine interface mark the basic rules and safety rules of operation (IEC 60447.2004, IDT)
GB 4793.1-2007 Safety requirements for electrical equipment for measurement, control and laboratory use - Part 1. General requirements (IEC 61010-
1.2001, IDT)
Basic and safety rules for marking of human machine interfaces - Conductor color or alphanumeric identification (IEC 60446).
2007, IDT)
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