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GB/T 44687-2024: Super abrasive products - Precision grinding wheels for semiconductor wafers
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| GB/T 44687-2024 | English | 529 |
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Super abrasive products - Precision grinding wheels for semiconductor wafers
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GB/T 44687-2024
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Basic data | Standard ID | GB/T 44687-2024 (GB/T44687-2024) | | Description (Translated English) | Super abrasive products - Precision grinding wheels for semiconductor wafers | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | J43 | | Classification of International Standard | 25.100.70 | | Word Count Estimation | 26,231 | | Date of Issue | 2024-09-29 | | Date of Implementation | 2025-04-01 | | Issuing agency(ies) | State Administration for Market Regulation, China National Standardization Administration | GB/T 44687-2024: Super abrasive products - Precision grinding wheels for semiconductor wafers---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
ICS 25.100.70
CCSJ43
National Standard of the People's Republic of China
Super abrasive products
Grinding wheels for precision grinding of semiconductor wafers
Released on 2024-09-29
2025-04-01 Implementation
State Administration for Market Regulation
The National Standardization Administration issued
Table of Contents
Preface III
1 Scope 1
2 Normative references 1
3 Terms and Definitions 1
4 Product Categories 1
4.1 Grinding wheels for precision grinding of wafer edge chamfering (hereinafter referred to as “chamfering grinding wheels”) 1
4.2 Grinding wheels for wafer end surface thinning precision grinding (hereinafter referred to as “thinning grinding wheels”) 3
5 Product Marking 12
5.1 Chamfering grinding wheel 12
5.2 Thinning grinding wheel 12
6 Technical Requirements12
6.1 Appearance 12
6.2 Limit deviations of basic dimensions 13
6.3 Geometric tolerances 15
6.4 Matrix roughness 15
6.5 Dynamic balancing 15
6.6 Rotational strength 15
7 Test methods 15
7.1 Appearance 15
7.2 Basic size 16
7.3 Geometric tolerances 16
7.4 Matrix roughness 17
7.5 Dynamic balancing 17
7.6 Rotational strength 17
8 Inspection rules 17
9 Sign 17
9.1 Product Labelling17
9.2 Certificate of Conformity 17
9.3 Outer packaging marking 17
10 Packaging, transportation and storage 18
10.1 Packaging 18
10.2 Transportation18
10.3 Storage 18
Foreword
This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for standardization work Part 1.Structure and drafting rules for standardization documents"
Drafting.
Please note that some of the contents of this document may involve patents. The issuing organization of this document does not assume the responsibility for identifying patents.
This document was proposed by the China Machinery Industry Federation.
This document is under the jurisdiction of the National Technical Committee for Standardization of Abrasives and Grinding Tools (SAC/TC139).
This document was drafted by. Zhengzhou Abrasives and Grinding Research Institute Co., Ltd., Jiangsu Saiyang Precision Technology Co., Ltd., Huaqiao University,
Beijing Antai Steel Research Institute Superhard Materials Products Co., Ltd., Jiangsu Sanjing Semiconductor Materials Co., Ltd., Qingdao Gaoce Technology Co., Ltd.
Co., Ltd., Guangdong Benlang New Materials Co., Ltd.
The main drafters of this document are. Bao Hua, Zhao Yanjun, Chen Weidong, Huang Guoqin, Liu Yibo, Zou Yuyao, Zhang Xiutao, Tao Hongliang, Gu Chunqing, Han Xin,
Ding Yulong, Li Guowei, Niu Junkai, Zhang Liang, Ye Tengfei, Wang Lihua, Zhu Liang, Yang Songbin, Yin Yulong.
Super abrasive products
Grinding wheels for precision grinding of semiconductor wafers
1 Scope
This document specifies the product classification, product marking, technical requirements, test methods, inspection rules,
Labeling, packaging, transportation and storage.
This document applies to metal bonds, resin bonds and ceramic bonds used for precision grinding of semiconductor wafer edge chamfering and end face thinning.
Diamond grinding wheels with porcelain bond and composite bond.
2 Normative references
The contents of the following documents constitute essential clauses of this document through normative references in this document.
For referenced documents without a date, only the version corresponding to that date applies to this document; for referenced documents without a date, the latest version (including all amendments) applies to
This document.
GB/T 1800.2-2020 Geometrical Product Specifications (GPS) Linear Dimension Tolerances ISO Code System Part 2.Standards
Tolerance zone codes and limit deviation tables for holes and shafts
GB/T 2493 Test method for rotational strength of abrasive tools
GB/T 9239.1 Mechanical vibration steady-state (rigid) rotor balancing quality requirements Part 1.Specification and balance tolerance inspection
GB/T 16458 Terminology of abrasives and grinding tools
GB/T 35479 Superabrasive products Diamond or cubic boron nitride abrasive tool shapes overview and marking
JB/T 7425 Technical specification for super abrasive products - diamond or cubic boron nitride grinding tools
3 Terms and definitions
The terms and definitions defined in GB/T 16458 apply to this document.
4 Product Categories
4.1 Grinding wheel for precision grinding of wafer edge chamfering (hereinafter referred to as “chamfering grinding wheel”)
4.1.1 Abrasive layer groove type
The groove type and code of the abrasive layer are shown in Table 1.
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