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GB/T 42968.1-2023: Integrated circuits - Measurement of electromagnetic immunity - Part 1: General conditions and definitions
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Integrated circuits - Measurement of electromagnetic immunity - Part 1: General conditions and definitions
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GB/T 42968.1-2023
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Basic data | Standard ID | GB/T 42968.1-2023 (GB/T42968.1-2023) | | Description (Translated English) | Integrated circuits - Measurement of electromagnetic immunity - Part 1: General conditions and definitions | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | L56 | | Classification of International Standard | 31.200 | | Word Count Estimation | 22,249 | | Date of Issue | 2023-09-07 | | Date of Implementation | 2024-01-01 | | Issuing agency(ies) | State Administration for Market Regulation, China National Standardization Administration | GB/T 42968.1-2023: Integrated circuits - Measurement of electromagnetic immunity - Part 1: General conditions and definitions
---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
ICS 31.200
CCSL56
National Standards of People's Republic of China
Integrated circuit electromagnetic immunity measurement
Part 1.General conditions and definitions
(IEC 62132-1.2015,IDT)
Published on 2023-09-07
2024-01-01 Implementation
State Administration for Market Regulation
Released by the National Standardization Administration Committee
Table of contents
Preface III
Introduction IV
1 Scope 1
2 Normative reference documents 1
3 Terms and Definitions 1
4 Test conditions 4
4.1 General 4
4.2 Environmental conditions 4
4.3 Test generator 4
4.4 Frequency range 5
5 Test equipment 5
5.1 Overview 5
5.2 Shield 5
5.3 Test generators and power amplifiers 5
5.4 Other components 5
6 Test layout 5
6.1 General 5
6.2 Test board 5
6.3 Pin selection option 6
6.4 IC pin loading/terminal 6
6.5 Power supply requirements 6
6.6 Special requirements for IC7
6.7 IC Temporal Stability7
7 Test procedure 7
7.1 Monitoring and Inspection 7
7.2 Human exposure7
7.3 System verification 7
7.4 Special procedures 8
8 Test Report 9
8.1 General 9
8.2 Immunity limits or class 9
8.3 IC Performance Class 9
8.4 Explanation of test results10
Appendix A (informative) Comparison of test methods 11
Appendix B (Informative) Description of Universal Test Board 13
Reference 16
Foreword
This document complies with the provisions of GB/T 1.1-2020 "Standardization Work Guidelines Part 1.Structure and Drafting Rules of Standardization Documents"
Drafting.
This document is Part 1 of GB/T 42968 "Measurement of Electromagnetic Immunity of Integrated Circuits". GB/T 42968 has released the following
part.
---Part 1.General conditions and definitions;
---Part 8.Radiated immunity measurement IC stripline method.
This document is equivalent to IEC 62132-1.2015 "Measurement of electromagnetic immunity of integrated circuits Part 1.General conditions and definitions".
This document has made the following minimal editorial changes.
---The documents IEC 62132-2, IEC 62132-5, IEC 62132-8, IEC /T S62132-9 cited only in the informative appendix are
Chapter 2 Go to References;
---Replaced the informative reference IEC 62132-8 with GB/T 42968.8.
Please note that some content in this document may be subject to patents. The publisher of this document assumes no responsibility for identifying patents.
This document is proposed by the Ministry of Industry and Information Technology of the People's Republic of China.
This document is under the jurisdiction of the National Semiconductor Device Standardization Technical Committee (SAC/TC78).
This document was drafted by. China Electronics Technology Standardization Institute, Beijing Zhixin Microelectronics Technology Co., Ltd., Zhejiang Nuoyi Technology Co., Ltd.
The company, the Fifth Research Institute of Electronics of the Ministry of Industry and Information Technology, Tianjin Advanced Technology Research Institute, Guangzhou Chengzhen Electronic Technology Co., Ltd., Yangxin Technology
(Shenzhen) Co., Ltd., Beijing Radio Measurement and Testing Research Institute, Shanghai Measurement and Testing Technology Research Institute, China Household Electrical Appliances Research Institute, Henan
Kairui Vehicle Inspection and Certification Center Co., Ltd., Southeast University, Shenzhen Beida Standard Technical Services Co., Ltd., China Automotive Engineering Research Institute
Co., Ltd., Beijing Xinkejian Technology Co., Ltd., Nanjing University of Information Science and Technology, China Academy of Information and Communications Technology, China National Conformity Assessment Center
Accreditation Center, Xiamen Hainuoda Scientific Instrument Co., Ltd., Suzhou Taisite Electronic Technology Co., Ltd., Zhengzhou Xinjiye Automotive Electronics Co., Ltd.
Department, Beijing University of Posts and Telecommunications, Nanjing Rongxiang Testing Equipment Co., Ltd., Shanghai Electrical Equipment Testing Institute Co., Ltd., China Electronics Technology Group Corporation
Research Institute 32.
The main drafters of this document. Cui Qiang, Fu Jun, Qiao Yanbin, Zheng Yimin, Fang Wenxiao, Wu Jianfei, Ye Chang, Li Nan, Zhu Sai, Yang Hongbo, Liu Xingxun,
Li Jinlong, Zhang Yanyan, Bai Yun, Zhou Xiang, Liu Xiaojun, Huang Xuemei, Chen Yanning, Shao E, Wan Fayu, Zang Qi, Liu Jia, Liang Jiming, Hu Xiaojun, Guo Wenming,
Zhang Jinling, Xing Liwen, Zhang Qingqing, Zhang Xianli, Chen Meishuang.
Introduction
To standardize the electromagnetic immunity measurement of integrated circuits and provide different electromagnetic immunity measurements for integrated circuit manufacturers and testing institutions
Method, GB/T 42968 "Measurement of Electromagnetic Immunity of Integrated Circuits" specifies the general conditions, definitions and
The test procedures and test requirements for different measurement methods are planned to be composed of 7 parts.
---Part 1.General conditions and definitions. The purpose is to specify general conditions and definitions for electromagnetic immunity measurements of integrated circuits.
---Part 2.Radiated immunity measurement TEM chamber and broadband TEM chamber methods. The purpose is to specify TEM cells and broadband
Test procedures and test requirements for TEM chamber method.
---Part 3.Large current injection (BCI) method. The purpose is to specify the test procedures and test requirements for the large current injection method.
---Part 4.Radio frequency power direct injection method. The purpose is to specify the test procedures and test requirements for the direct injection method of radio frequency power.
---Part 5.Bench Faraday cage method. The purpose is to specify the test procedures and test requirements for the bench Faraday cage method.
---Part 8.Radiated immunity measurement IC stripline method. The purpose is to specify the test procedures and tests for the IC stripline method
Require.
---Part 9.Radiated immunity measurement surface scanning method. The purpose is to specify the test procedures and test requirements for the surface scanning method.
Integrated circuit electromagnetic immunity measurement
Part 1.General conditions and definitions
1 Scope
This document defines general information for electromagnetic immunity measurements of conducted and radiated disturbances on integrated circuits (ICs) and describes conventional test conditions.
parts, test equipment and layout, test procedures and test report content. A comparison table of test methods is given in Appendix A to help select the appropriate
Measurement methods.
2 Normative reference documents
The contents of the following documents constitute essential provisions of this document through normative references in the text. Among them, the dated quotations
For undated referenced documents, only the version corresponding to that date applies to this document; for undated referenced documents, the latest version (including all amendments) applies to
this document.
IEC 62132-3 Electromagnetic immunity measurement of integrated circuits (150kHz~1GHz) Part 3.Bulk current injection (BCI) method
IEC 62132-4 Electromagnetic immunity measurement of integrated circuits (150kHz~1GHz) Part 4.Radio frequency power direct injection method
3 Terms and definitions
The following terms and definitions apply to this document.
3.1
amplitude modulation;AM
The process in which the carrier amplitude changes according to a given rule.
[Source. IEC 60050-314.2001,314-08-01, with modifications]
3.2
Artificial networkartificialnetwork;AN
A reference load specified to simulate the impedance presented by the actual network to the device under test (DUT) is connected across it to measure the radio frequency disturbance current.
voltage, which can isolate the equipment from the power supply or load within the specified frequency range.
NOTE. Actual network, such as extended power lines or communications lines.
3.3
associatedequipment
Connected to a measurement receiver or test generator to establish interference or interference between the DUT and the measurement equipment or (test) signal generator
Signal transmission path to the sensor.
Examples. Probes, Networks and Antennas.
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