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GB/T 42968.4-2024 English PDF

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GB/T 42968.4-2024: Integrated circuits - Measurement of electromagnetic immunity - Part 4: Direct RF power injection method
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GB/T 42968.4-2024English434 Add to Cart 4 days [Need to translate] Integrated circuits - Measurement of electromagnetic immunity - Part 4: Direct RF power injection method Valid GB/T 42968.4-2024

PDF similar to GB/T 42968.4-2024


Standard similar to GB/T 42968.4-2024

GB/T 43770   SAMR 76   SJ/T 11460.6.4   GB/T 42968.2   GB/T 42968.8   GB/T 42969   

Basic data

Standard ID GB/T 42968.4-2024 (GB/T42968.4-2024)
Description (Translated English) Integrated circuits - Measurement of electromagnetic immunity - Part 4: Direct RF power injection method
Sector / Industry National Standard (Recommended)
Classification of Chinese Standard L56
Classification of International Standard 31.200
Word Count Estimation 22,230
Date of Issue 2024-12-31
Date of Implementation 2024-12-31
Issuing agency(ies) State Administration for Market Regulation, China National Standardization Administration

GB/T 42968.4-2024: Integrated circuits - Measurement of electromagnetic immunity - Part 4: Direct RF power injection method


---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
ICS 31.200 CCSL56 National Standard of the People's Republic of China Integrated Circuit Electromagnetic Immunity Measurement Part 4.Radio frequency power direct injection method Released on 2024-12-31 Implementation on 2024-12-31 State Administration for Market Regulation The National Standardization Administration issued

Table of Contents

Preface III Introduction IV 1 Scope 1 2 Normative references 1 3 Terms and Definitions 1 4 General 1 4.1 Measurement principle 1 4.2 Single-pin direct power injection method 3 4.3 Multi-pin direct power injection method 3 5 Test conditions 4 6 Test equipment 4 6.1 General 4 6.2 RF Power Source 4 6.3 RF Power Meter and Directional Coupler 4 7 Experimental Arrangement 5 7.1 Overview 5 7.2 Power injection arrangement 5 7.3 Breadboard 5 7.4 Characteristics of power injection arrangements 6 7.5 Decoupling Network 7 8 Test procedures 7 8.1 General 7 8.2 Specific test procedures 7 9 Test Report 8 Appendix A (informative) Examples of immunity levels in automotive applications 9 Appendix B (Informative) Installation tips for optimal RF test arrangement 10 Appendix C (informative) Description of constant peak test level 16 Reference 17

Foreword

This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for standardization work Part 1.Structure and drafting rules for standardization documents" Drafting. This document is Part 4 of GB/T 42968.GB/T 42968 has been published in the following parts. --- Part 1.General conditions and definitions; --- Part 2.Radiated immunity measurement TEM cell and broadband TEM cell method; --- Part 4.Radio frequency power direct injection method; --- Part 8.Radiated immunity measurement IC stripline method. This document is equivalent to IEC 62132-4.2006 "Integrated Circuit Electromagnetic Immunity Measurement 150kHz~1GHz Part 4.Radio Frequency Immunity Test" Direct Frequency Power Injection Method. The following minimal editorial changes were made to this document. --- In order to coordinate with the existing standards, the name of the standard is changed to "Measurement of electromagnetic immunity of integrated circuits Part 4.Direct radio frequency power Injection Method. Please note that some of the contents of this document may involve patents. The issuing organization of this document does not assume the responsibility for identifying patents. This document was proposed by the Ministry of Industry and Information Technology of the People's Republic of China. This document is under the jurisdiction of the National Technical Committee for Integrated Circuit Standardization (SAC/TC599). This document was drafted by. China Electronics Technology Standardization Institute, Nanjing Rongce Testing Technology Co., Ltd., Shenzhen Beice Standard Technology Services Co., Ltd., Beijing Zhixin Microelectronics Technology Co., Ltd., the Fifth Institute of Electronics of the Ministry of Industry and Information Technology, Tianjin Institute of Advanced Technology, Jiangsu Quality and Standardization Research Institute, Shanghai Metrology and Testing Technology Research Institute, Suzhou Filippo Electromagnetic Technology Co., Ltd., Anhui Metrology Science Research Institute, China Academy of Information and Communications Technology, Shenzhen Quanxing Technology Co., Ltd., Chongqing University of Posts and Telecommunications, Chongqing Shiyi Product Quality Inspection Co., Ltd. Limited Liability Company, Dongguan Vocational and Technical College, and Shanghai Precision Metrology and Testing Institute. The main drafters of this document are. Zhang Qiang, Cui Qiang, Shen Xueqi, Qiao Yanbin, Fang Wenxiao, Wu Jianfei, Liu Xiaojun, Wang Shaoqi, Fu Jun, Yang Bo, Li Jinlong, Cui Peibin, Lian Pengfei, Shi Suolan, Huang Xubiao, Zhang Hongsheng, Liu Yang, Bao Jingjing.

Introduction

To standardize the electromagnetic immunity measurement of integrated circuits and provide different electromagnetic immunity measurement methods for integrated circuit manufacturers and testing agencies GB/T 42968 specifies the general conditions, definitions, test procedures and test methods for electromagnetic immunity measurement of integrated circuits. The test requirements are planned to consist of 7 parts. --- Part 1.General conditions and definitions. The purpose is to specify the general conditions and definitions for the measurement of electromagnetic immunity of integrated circuits. --- Part 2.Radiated immunity measurement TEM cell and broadband TEM cell method. The purpose is to specify the TEM cell and broadband Test procedure and test requirements with TEM chamber method. --- Part 3.Bulk current injection (BCI) method. The purpose is to specify the test procedures and test requirements for the bulk current injection method. --- Part 4.Radio frequency power direct injection method. The purpose is to specify the test procedures and test requirements for the radio frequency power direct injection method. --- Part 5.Bench Faraday cage method. The purpose is to specify the test procedures and test requirements for the bench Faraday cage method. --- Part 8.Radiated immunity measurement IC stripline method. The purpose is to specify the test procedures and test requirements of the stripline method. --- Part 9.Radiated immunity measurement surface scanning method. The purpose is to specify the test procedures and test requirements of the surface scanning method. Integrated Circuit Electromagnetic Immunity Measurement Part 4.Radio frequency power direct injection method

1 Scope

This document specifies the method for measuring the immunity of integrated circuits (ICs) in the presence of conducted radio frequency (RF) disturbances, e.g. caused by radiated Conducted RF disturbances caused by RF disturbances. This method ensures high repeatability and correlation of immunity measurements. This document establishes a common basis for the evaluation of semiconductor devices in equipment when operating in the presence of unwanted RF electromagnetic waves.

2 Normative references

The contents of the following documents constitute essential clauses of this document through normative references in this document. For referenced documents without a date, only the version corresponding to that date applies to this document; for referenced documents without a date, the latest version (including all amendments) applies to This document. IEC 61967-4 Integrated circuit electromagnetic emission measurement Part 4.Conducted emission measurement 1Ω/150Ω direct coupling method (In- Note. GB/T 44937.4-2024 Integrated circuit electromagnetic emission measurement Part 4.Conducted emission measurement 1Ω/150Ω direct coupling method (IEC 61967-4.2021, IDT) IEC 62132-1 Integrated circuits electromagnetic immunity measurement Part 1.General conditions and definitions (Integratedcircuits- Note. GB/T 42968.1-2023 Integrated Circuit Electromagnetic Immunity Measurement Part 1.General Conditions and Definitions (IEC 62132-1.2015, IDT)

3 Terms and definitions

For the purposes of this document, the terms and definitions defined in IEC 62132-1 apply.

4 General

4.1 Measurement principle The minimum electromagnetic immunity level required for an IC depends on the maximum RF disturbance level that can be emitted by the electronic system. Determined by the specific parameters of the system and actual application. In order to determine the IC's immunity performance and ensure high repeatability, a measurement procedure is required The following are the basic requirements for this test. The largest geometry found in ICs is the lead frame. The lead frame size is in the range of a few centimeters or less. The structural size is even two orders of magnitude smaller than that of the lead frame. For the frequency range below 1 GHz, this lead frame and chip The structure does not constitute an effective antenna for receiving unwanted RF signals. What constitutes an effective antenna is the cable bundle and/or printed circuit board (PCB) The IC receives unwanted RF energy through the pins connected to these cables. Therefore, the IC's electromagnetic immunity can be reduced by RF conducted disturbances. The RF signal is characterized by the interference (i.e. RF forward power) instead of the field parameters usually used in module and/or system testing. For module and system testing, the forward power provided to the circuit by a cable bundle or printed circuit board trace acting as an antenna can be measured or estimated. Regardless of whether this power is reflected or absorbed, it is considered forward power supplied to the circuit.

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