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GB/T 42706.7-2026: Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices
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Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices
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Basic data | Standard ID | GB/T 42706.7-2026 (GB/T42706.7-2026) | | Description (Translated English) | Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | L40 | | Classification of International Standard | 31.020 | | Word Count Estimation | 18,159 | | Date of Issue | 2026-02-27 | | Date of Implementation | 2026-09-01 | | Issuing agency(ies) | State Administration for Market Regulation, Standardization Administration of China | GB/T 42706.7-2026: Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices
---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
ICS 31.020
CCSL40
National Standards of the People's Republic of China
Long-term storage of electronic components and semiconductor devices
Part 7.Microelectromechanical Devices
(IEC 62435-7.2020, IDT)
Published on 2026-02-27
Implemented on 2026-09-01
State Administration for Market Regulation
The State Administration for Standardization issued a statement.
Table of contents
Preface III
Introduction IV
1.Scope 1
2 Normative References 1
3.Terms and Definitions 1
4.Storage Precautions 2
4.1 Overview of Microelectromechanical Device Applications 2
4.2 Failure Mechanism 3
4.3 Raw Material Management 6
4.4 Storage Medium 7
4.5 Document/Paper Batch Identifier 7
4.6 Inventory Inspection 7
4.7 Update of Dry Packaging in Stock 7
4.8 Inventory Reassessment 7
5.Basic requirements for long-term storage 7.
5.1 General Rules 7
5.2 Moisture Sensitive Label 7
5.3 Dry Packaging 8
5.4 Storage of non-moisture-sensitive components 8
5.5 Storage of Microelectromechanical Devices Before Assembly - Wafer-Level and Chip-Level Storage 8
5.6 Storage of Moisture-Sensitive Coated Components 8
Appendix A (Informative) Environmental Factors for the Storage of Packaged or Coated Components 10
Reference 11
Foreword
This document complies with the provisions of GB/T 1.1-2020 "Standardization Work Guidelines Part 1.Structure and Drafting Rules of Standardization Documents".
Drafting.
This document is Part 7 of GB/T 42706 "Electronic Components and Semiconductor Devices - Long-Term Storage". GB/T 42706 has been published.
The following parts were included.
---Part 1.General Provisions;
---Part 2.Degradation Mechanisms;
---Part 3.Data;
---Part 4.Storage;
---Part 5.Chips and Wafers;
---Part 6.Encapsulating or Coating Components;
---Part 7.Microelectromechanical Devices;
---Part 8.Passive Electronic Devices;
---Part 9.Special Cases
This document is equivalent to IEC 62435-7.2020 "Electronic components, semiconductor devices - Long-term storage - Part 7.Microelectromechanical systems".
Devices.
Please note that some content in this document may involve patents. The issuing organization of this document assumes no responsibility for identifying patents.
This document was proposed by the Ministry of Industry and Information Technology of the People's Republic of China.
This document is under the jurisdiction of the National Semiconductor Device Standardization Technical Committee (SAC/TC78).
This document was drafted by. Hebei Beixin Semiconductor Technology Co., Ltd., Anhui Yifala Electric Technology Co., Ltd., and Xi'an Electronic Technology Co., Ltd.
Universities, Tianjin University, Xiamen ChipSun Technology Co., Ltd., the 13th Research Institute of China Electronics Technology Group Corporation, and the People's Liberation Army Army
Military Engineering University Shijiazhuang Campus, Hebei University of Science and Technology, Beijing Zhixin Microelectronics Technology Co., Ltd., and the Fifth Research Institute of Electronics of the Ministry of Industry and Information Technology
Institute, Hebei Shenghao Optoelectronic Technology Co., Ltd., Xi'an Space Radio Technology Research Institute, Beijing Ketong Electronic Relay Factory Co., Ltd.
Guangdong Quanxin Semiconductor Co., Ltd.
The main drafters of this document are. Jiao Longfei, Chen Yazhou, Chi Lei, Dai Mian, Chai Zhi, An Wei, Wang Yutao, Gui Mingyang, Liu Tao, Zhao Yuyang, and Chen Longpo.
Zhang Wenhua, Zhou Xiaoli, Zhang Chong, Zhang Tao, Wang Chong, Peng Hao, Xi Shanbin, Hu Songxiang, Cao Yaolong, Zheng Xuefeng, Wang Chao, Sun Hongjun, Hu Xiaofeng, Yang Jie
Jia Lin, Li Dejian, Yang Baobin, Dong Xianshan, Shen Chengbin, Du Haiyang, Miao Huixia, Chen Lifang, Yin Lijing, Yao Xiaolei, Zhang Min, Cao Yufeng, Li Jinguang.
Introduction
This document describes the current best practices for long-term storage. Long-term storage refers to the expected storage time of electronic components exceeding 12 months.
Monthly storage.
Long-term storage requires proper execution of storage procedures, especially the storage environment. The purpose of this document is to provide guidelines for the long-term storage of electronic components.
Guidance. This document proposes a method to delay obsolescence to the greatest extent possible, but it cannot guarantee that components will be in good condition after storage.
Work status.
GB/T 42706 "Electronic Components and Semiconductor Devices - Long-Term Storage" ensures that after long-term storage, components have sufficient durability for use.
Reliability. Users are encouraged to request technical specifications from suppliers for relevant products to demonstrate that the storage process meets their needs. These standards
The aim is to provide relevant guidance for electronic components that require long-term storage.
GB/T 42706 is divided into 9 parts. Parts 1 through 4 apply to all long-term storage and include general requirements and specifications.
Guidelines. Parts 5 through 9 apply to the storage of several specific product types. This is in accordance with the general requirements of Parts 1 through 4.
In addition, specific product type requirements must be met. Starting from Part 5, electronic components requiring different storage conditions are covered.
GB/T 42706 "Long-term storage of electronic components and semiconductor devices" is proposed to consist of nine parts.
---Part 1.General Provisions. The purpose is to define the relevant terms, definitions, and principles for long-term storage, and to provide effective methods for long-term storage of electronic components.
Storage concepts, good work habits, and general methods.
---Part 2.Degradation Mechanisms. The aim is to define the degradation mechanisms of electronic components over time under actual storage conditions and...
Degradation patterns and guidelines for testing methods to assess general degradation mechanisms.
---Part 3.Data. The purpose is to specify the requirements for data storage during the long-term storage of electronic components, ensuring traceability.
Traceability or data chain integrity.
---Part 4.Storage. This section describes methods for long-term storage of electronic components and related recommended conditions, including transportation and control.
Safety of manufacturing and storage facilities.
---Part 5.Chips and Wafers. The purpose is to specify individual chips, portions of wafers, or entire wafers, as well as those with metal structures (introduced).
Storage conditions and rules for chips (metal layers, ball bearings, pillar bearings, etc.), and also for general-purpose and special-purpose packaging products containing chips or wafers.
Provide operating instructions.
---Part 6.Packaged or Coated Components. The purpose is to specify the methods and recommended conditions for long-term storage of packaged or coated components.
This includes the safety of transportation, control, and storage facilities.
---Part 7.Microelectromechanical Devices. The purpose is to specify the precautions and basic requirements for long-term storage of microelectromechanical devices.
This requirement.
---Part 8.Passive Electronic Devices. The purpose is to specify the precautions and basic requirements for long-term storage of passive electronic devices.
This requirement.
---Part 9.Special Cases. This section aims to specify storage methods for special types of products and when the storage environment changes, providing users with [specific guidelines/methods].
Guidelines and requirements for interacting with suppliers help manage the complexities involved.
Long-term storage of electronic components and semiconductor devices
Part 7.Microelectromechanical Devices
1 Scope
This document specifies methods and recommended conditions for the long-term storage of microelectromechanical devices (MEMS), including transportation, control, and storage facilities.
Safety. Long-term storage refers to storage of the product with an expected shelf life exceeding 12 months. This document also provides effective methods for microelectromechanical systems.
Principles, best practices and general methods for long-term storage of items.
2 Normative references
The contents of the following documents, through normative references within the text, constitute essential provisions of this document. Dated citations are not included.
For references to documents, only the version corresponding to that date applies to this document; for undated references, the latest version (including all amendments) applies.
This document.
IEC 60721-3-1 Classification of Environmental Conditions Part 3-1.Classification of Environmental Parameter Groups and Their Severity Levels (Classifi-
and their severities-Storage)
Note. GB/T 4798.1-2019 Classification of Environmental Conditions - Classification of Environmental Parameter Groups and Their Severity Grading - Part 1.Storage (IEC 60721-3-1.
2018, IDT)
IEC 60749-20 Semiconductor devices – Mechanical and climatic testing methods – Part 20.Molded surface mount devices – Resistance to moisture and soldering
Note. GB/T 4937.20-2018 Semiconductor Devices - Mechanical and Climate Test Methods - Part 20.Resistance to Moisture and Solder Thermal Synthesis of Molded Surface Mount Devices
Combined impact (IEC 60749-20.2008, IDT)
IEC 60749-20-1 Mechanical and climatic testing methods for semiconductor devices – Part 20-1.Sensitivity to the combined effects of humidity and soldering heat
Note. GB/T 4937.201-2018 Mechanical and Climatic Testing Methods for Semiconductor Devices - Part 20-1.Tables Sensitive to the Combined Effects of Humidity and Soldering Heat
Handling, packaging, marking and transport of surface-mount devices (IEC 60749-20-1.2009, IDT)
JEDEC/IPCJ-STD-020 Joint standard for moisture/reflow sensitivity classification of unsealed surface mount devices
3 Terms and Definitions
The following terms and definitions apply to this document.
3.1
storage environment
A storage area where temperature, humidity, atmospheric environment, and other conditions are controlled according to product requirements.
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