|
US$359.00 · In stock
Delivery: <= 4 days. True-PDF full-copy in English will be manually translated and delivered via email.
GB/T 34507-2017: Palladium coated copper bonding wire for semiconductor package
Status: Valid
| Standard ID | Contents [version] | USD | STEP2 | [PDF] delivered in | Standard Title (Description) | Status | PDF |
| GB/T 34507-2017 | English | 359 |
Add to Cart
|
4 days [Need to translate]
|
Palladium coated copper bonding wire for semiconductor package
| Valid |
GB/T 34507-2017
|
PDF similar to GB/T 34507-2017
Basic data | Standard ID | GB/T 34507-2017 (GB/T34507-2017) | | Description (Translated English) | Palladium coated copper bonding wire for semiconductor package | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | H68 | | Classification of International Standard | 77.150.99 | | Word Count Estimation | 18,156 | | Date of Issue | 2017-10-14 | | Date of Implementation | 2018-05-01 | | Issuing agency(ies) | General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China | GB/T 34507-2017: Palladium coated copper bonding wire for semiconductor package---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Palladium coated copper bonding wire for semiconductor package
ICS 77.150.99
H68
National Standards of People's Republic of China
Package bonding with palladium-plated copper wire
2017-10-14 Published
2018-05-01 implementation
General Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China
China National Standardization Administration released
Foreword
This standard was drafted in accordance with the rules given in GB/T 1.1-2009.
This standard is proposed by China Nonferrous Metals Industry Association.
This standard by the National Non-ferrous Metal Standardization Technical Committee (SAC/TC243) centralized.
This standard drafting unit. Beijing Dubbo non-ferrous metal solder limited liability company, Shandong Branch Ding new Electronic Technology Co., Ltd., non-ferrous metals
Technology and Economy Institute, Zhejiang Jia Bo Technology Co., Ltd., Guangdong Jia Bo Electronic Technology Co., Ltd.
The main drafters of this standard. Yan Ru, Tsui Wah, Xiang Lei, Li Tianxiang, Zhao Yidong, Zhou Gang, Zhou Xiaoguang, Liu Jie, Gao Liang, Liang Zhong, Sun Ni.
Package bonding with palladium-plated copper wire
1 Scope
This standard specifies the semiconductor package, including discrete devices, integrated circuits, LED package with palladium-plated copper requirements, test methods, testing
Rules, marking, packaging, transportation, storage, quality certificates, purchase orders (or contracts).
This standard applies to the semiconductor package with palladium-plated copper wire.
2 Normative references
The following documents for the application of this document is essential. For dated references, only the dated version applies to this article
Pieces. For undated references, the latest edition (including all amendments) applies to this document.
GB/T 5121.27 Methods for chemical analysis of copper and copper alloys Part 27. Inductively coupled plasma atomic emission spectrometry
GB/T 10573 non-ferrous metal filament tensile test method
YS/T 716.7 Black copper chemical analysis method - Part 7. Determination of platinum content and palladium content Fire test gold enrichment - Inductively coupled plasma
Atomic Emission Spectrometry and Flame Atomic Absorption Spectrometry
3 requirements
3.1 product classification
Product model, status, diameter should be consistent with the provisions of Table 1.
Table 1
Model Status Diameter/mm
HCP1-n semi-hard state
0.013, 0.015, 0.016, 0.017, 0.018, 0.019.0.020, 0.021, 0.022, 0.023,
0.025, 0.028, 0.030, 0.032, 0.033, 0.035, 0.038, 0.040, 0.042,
0.043, 0.044, 0.045, 0.050
Note 1. Other diameter products can be produced upon request.
Note 2. The manufacturer can be based on different chemical composition of the model assigned.
3.2 Product Marking Examples
HCP
Copper-plated copper wire (H-Highpurity; C-Copper; P-Paladium)
□,
Model (1-n)
φ □
diameter
× □ m
length
Diameter is marked in millimeters.
Tips & Frequently Asked Questions:Question 1: How long will the true-PDF of GB/T 34507-2017_English be delivered?Answer: Upon your order, we will start to translate GB/T 34507-2017_English as soon as possible, and keep you informed of the progress. The lead time is typically 2 ~ 4 working days. The lengthier the document the longer the lead time. Question 2: Can I share the purchased PDF of GB/T 34507-2017_English with my colleagues?Answer: Yes. The purchased PDF of GB/T 34507-2017_English will be deemed to be sold to your employer/organization who actually pays for it, including your colleagues and your employer's intranet. Question 3: Does the price include tax/VAT?Answer: Yes. Our tax invoice, downloaded/delivered in 9 seconds, includes all tax/VAT and complies with 100+ countries' tax regulations (tax exempted in 100+ countries) -- See Avoidance of Double Taxation Agreements (DTAs): List of DTAs signed between Singapore and 100+ countriesQuestion 4: Do you accept my currency other than USD?Answer: Yes. If you need your currency to be printed on the invoice, please write an email to [email protected]. In 2 working-hours, we will create a special link for you to pay in any currencies. Otherwise, follow the normal steps: Add to Cart -- Checkout -- Select your currency to pay.
|