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GB/T 34502-2017: Gold-coated silver and silver alloy bonding wires for semiconductor package
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| Standard ID | Contents [version] | USD | STEP2 | [PDF] delivered in | Standard Title (Description) | Status | PDF |
| GB/T 34502-2017 | English | 439 |
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Gold-coated silver and silver alloy bonding wires for semiconductor package
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GB/T 34502-2017
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Basic data | Standard ID | GB/T 34502-2017 (GB/T34502-2017) | | Description (Translated English) | Gold-coated silver and silver alloy bonding wires for semiconductor package | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | H68 | | Classification of International Standard | 77.150.99 | | Word Count Estimation | 22,241 | | Date of Issue | 2017-09-29 | | Date of Implementation | 2018-04-01 | | Issuing agency(ies) | General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China | GB/T 34502-2017: Gold-coated silver and silver alloy bonding wires for semiconductor package---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Gold-coated silver and silver alloy bonding wires forsemiconductor package
ICS 77.150.99
H68
National Standards of People's Republic of China
Package bonding with gold-plated silver and silver alloy wire
2017-09-29 Posted
2018-04-01 implementation
General Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China
China National Standardization Administration released
Foreword
This standard was drafted in accordance with the rules given in GB/T 1.1-2009.
This standard is proposed by China Nonferrous Metals Industry Association.
This standard by the National Non-ferrous Metal Standardization Technical Committee (SAC/TC243) is responsible for centralized.
This standard drafting unit. Beijing Dubbo non-ferrous metal solder limited liability company, Shandong Branch Ding new Electronic Technology Co., Ltd., non-ferrous metals
Technology and Economy Institute, Zhejiang Jia Bo Technology Co., Ltd., Guangdong Jia Bo Electronic Technology Co., Ltd.
The main drafters of this standard. Yan Ru, Tsui Wah, Xiang Lei, Li Tianxiang, Zhao Yidong, Zhou Gang, Zhou Xiaoguang, Liu Jie, Gao Liang, Liang Zhong, Sun Ni.
Package bonding with gold-plated silver and silver alloy wire
1 Scope
This standard specifies the semiconductor package, including discrete devices, integrated circuits, LED packages with gold-plated silver and silver alloy wire requirements, test side
Law, inspection rules, marking, packaging, transportation, storage, quality certificate, purchase order (or contract).
This standard applies to semiconductor package bonding with gold-plated silver and silver alloy wire.
2 Normative references
The following documents for the application of this document is essential. For dated references, only the dated version applies to this article
Pieces. For undated references, the latest edition (including all amendments) applies to this document.
GB/T 10573 non-ferrous metal filament tensile test method
GB/T 11067 (all parts) Silver chemical analysis methods
YS/T 938.4 Chemical analysis of gold and palladium based alloys for dental porcelain repair - Part 4. Determination of gold, platinum, palladium, copper, tin, indium,
Gallium, beryllium, iron, manganese, lithium content Determination of inductively coupled plasma atomic emission spectrometry
3 requirements
3.1 product classification
Products according to different substrates can be divided into gilded silver and gold-plated silver alloy wire two categories, gilded silver wire model HSG, gold-plated silver alloy wire
Base silver content is divided into different AS3, AS6, AS8, AS13 models. Product types, models, status, diameter should be consistent with the provisions of Table 1.
Table 1
Type Model Status Diameter/mm
Gilt silver HSG semi-hard state
0.013, 0.015, 0.016, 0.017, 0.018, 0.019.0.020, 0.021, 0.022, 0.023, 0.024,
0.025, 0.028, 0.030, 0.032, 0.033, 0.035, 0.038, 0.040, 0.042,
0.043, 0.044, 0.045, 0.050
Gold-plated silver alloy wire
AS3 semi-hard state
AS6 semi-hard state
AS8 semi-hard state
AS13 semi-hard state
0.018, 0.020, 0.023, 0.025, 0.030, 0.038
Note. Other diameter products can be produced upon request.
3.2 Product Marking Examples
3.2.1 each gilt silver mark
HSG,
G-Silver (H-Highpurity; S-Silver; G-Gold)
φ □
diameter
× □ m
length
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