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GB/T 34479-2017 English PDF

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GB/T 34479-2017: Specification for alphanumeric marking of silicon wafers
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PDF similar to GB/T 34479-2017


Standard similar to GB/T 34479-2017

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Basic data

Standard ID GB/T 34479-2017 (GB/T34479-2017)
Description (Translated English) Specification for alphanumeric marking of silicon wafers
Sector / Industry National Standard (Recommended)
Classification of Chinese Standard H80
Classification of International Standard 29.045
Word Count Estimation 14,113
Date of Issue 2017-10-14
Date of Implementation 2018-07-01
Issuing agency(ies) General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China

GB/T 34479-2017: Specification for alphanumeric marking of silicon wafers

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Specification for alphanumeric marking of silicon wafers ICS 29.045 H80 National Standards of People's Republic of China Silicon alphanumeric marking specification 2017-10-14 Published 2018-07-01 implementation General Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China China National Standardization Administration released

Foreword

This standard was drafted in accordance with the rules given in GB/T 1.1-2009. This standard by the National Semiconductor Equipment and Materials Standardization Technical Committee (SAC/TC203) and the National Semiconductor Equipment and Materials Standards Technical Committee Sub-Technical Committee on Materials (SAC/TC203/SC2) co-sponsored and centralized. This standard was drafted unit. Research Semiconductor Materials Co., Ltd., Zhejiang Province, silicon material quality inspection center. The main drafters of this standard. Zhang Jing, Sun Yan, while Yong Zhi, Chunlan Building. Silicon alphanumeric marking specification

1 Scope

This standard specifies the encoding of alphanumeric symbols on silicon wafers or other semiconductor wafers, including the shape and size of the emblem, the number of letters Word code definition, requirements and alphanumeric code error checking methods. This standard applies to the wafer and other chips on the front or back of the coding signs. Note. Alphanumeric signs and associated information are stored in the database and can be independently and quickly identified by a simple automated optical character reading (OCR) instrument or manually Chip manufacturer consistency with wafer markings.

2 Normative references

The following documents for the application of this document is essential. For dated references, only the dated version applies to this article Pieces. For undated references, the latest edition (including all amendments) applies to this document. GB/T 14264 semiconductor materials terminology SEMIAUX001 List of Vendor Identification Numbers SEMIAUX015 Automatic Optical Character Reading Character Overview (SEMIOCRcharacteroutlines)

3 Terms and definitions

GB/T 14264 and defined by the following terms and definitions apply to this document. 3.1 Character spacing characterseparation The horizontal distance between adjacent borders of any character. 3.2 Character spacing characterspacing Horizontal distance between character centerlines of adjacent characters. 3.3 Character tilts characterskew Character inclination between the baseline of the character and the parallel lines at the bottom of the character's window. 3.4 Adjacent character misalignment charactermisalignment Radj Vertical distance between character baselines of two adjacent characters on the same line. 3.5 Line character misalignment linespacingmisalignment Rline The vertical distance between the baselines of the highest and lowest characters in the same line.

4 logo shape and size

4.1 characters can be written using solid line or dot matrix method, the minimum lattice size should be horizontal 5 points, vertical 9 points, as shown in Figure 1

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