GB/T 16596-2019 PDF in English
GB/T 16596-2019 (GB/T16596-2019, GBT 16596-2019, GBT16596-2019)
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Specification for establishing a wafer coordinate system
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| GB/T 16596-1996 | English | 239 |
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Specification for establishing a wager coordinate system
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Standards related to (historical): GB/T 16596-2019
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GB/T 16596-2019: PDF in English (GBT 16596-2019) GB/T 16596-2019
NATIONAL STANDARD OF THE
PEOPLE’S REPUBLIC OF CHINA
ICS 29.045
H 80
Replacing GB/T 16596-1996
Specification for Establishing a Wafer Coordinate
System
ISSUED ON: MARCH 25, 2019
IMPLEMENTED ON: FEBRUARY 01, 2020
Issued by: State Administration for Market Regulation;
Standardization Administration of the People’s Republic of
China.
Table of Contents
Foreword ... 3
1 Scope ... 4
2 Normative references ... 4
3 Establishing principle of a wafer coordinate system ... 4
4 Establishing steps of the wafer coordinate system ... 5
5 Application of the wafer coordinate system ... 7
Foreword
This Standard was drafted in accordance with the rules given in GB/T 1.1-2009.
This Standard replaces GB/T 16596-1996 "Specification for establishing a
wager coordinate system". Compared with GB/T 16596-1996, the main
technical changes, except editorial changes, are as follows:
-- In the “Normative references”, delete GB/T 12964, SEMI M12 and SEMI
M13, add GB/T 34479 and YS/T 986 (see Chapter 2, Chapter 2 of version
1996);
-- Add "Establishing principle of a wafer coordinate system" (see Chapter 3);
-- Add "Back wafer surface coordinate system" and "Three-dimensional
coordinate system" (see 4.2, 4.3);
-- Delete 4.1.1 and 4.1.2 of the “Application and related contents of the wafer
coordinate system” (see 4.1.1, 4.1.2 of version 1996);
-- Add contents such as “In SEMI M1, the edge reference coordinate system
that is established with the edge contour template is used for edge
reference, which is different from the wafer coordinate system. Edge
contour template and edge contour parameters use different coordinate
systems, as follows: …” “In some cases, some wafer surfaces without
patterns are difficult to be distinguished of front and back surfaces.” “There
is no special specification for the diameter of the wafer; however, for
automatic equipment, only wafers of nominal diameter may be received”
(see 5.3, 5.6, 5.9).
This Standard is jointly proposed and managed by the National Semiconductor
Equipment and Materials Standardization Technical Committee (SAC/TC 203)
and the National Semiconductor Equipment and Materials Standardization
Technical Committee Material Subcommittee (SAC/TC 203 / SC 2).
The drafting organizations of this Standard: China Nonferrous Metals Techno-
Economic Research Institute, GRINM Semiconductor Materials Co., Ltd.,
Zhejiang Haina Semiconductor Co., Ltd., Zhejiang Silicon Materials Quality
Inspection Center, Wafer Works (Shanghai) Corp.
The drafters of this Standard: Lu Liyan, Sun Yan, Pan Jinping, Yang Suxin, Lou
Chunlan, Hu Jinzhi, Li Suqing.
The previous versions of the standards which are replaced by this Standard are:
-- GB/T 16596-1996.
Specification for Establishing a Wafer Coordinate
System
1 Scope
This Standard specifies procedures for using rectangular coordinates and polar
coordinates to establish the front, back, and three-dimensional wafer coordinate
systems.
This Standard applies to the establishment of wafer coordinate systems with
and without pattern. The coordinate system is used to determine and record the
exact locations of test results such as defects and particles on the wafer.
2 Normative references
The following documents are indispensable for the application of this document.
For dated references, only the dated version applies to this document. For
undated references, the latest edition (including all amendments) applies to this
document.
GB/T 16595, Specification for a universal wafer grid
GB/T 34479, Specification for alphanumeric marking of silicon wafers
YS/T 986, Specification for serial alphanumeric marking of the front surface
of wafers
SEMI E5, Specification for SEMI equipment communications standard 2
message content (SECS-II)
SEMI M1, Specification for polished single crystal silicon wafers
3 Establishing principle of a wafer coordinate system
3.1 General
The wafer coordinate system in this Standard uses the center point of the wafer
as the origin of the rectangular coordinates (X-Y) or the polar coordinates (r-θ)
to determine the coordinate of any point on the wafer. For a wafer without
pattern, the wafer coordinate system can be used directly; it can also be used
together with a rectangular array or a polar coordinate overlay array. The wafer
coordinate system can also be used to determine the positions of the origin or
other reference points of the other coordinate system, which often represents
the wafer coordinate system. Edge contour template and edge contour
parameters use different coordinate systems, as follows:
a) For the edge contour template, use the radial direction of the X-axis
(inward from the wafer edge) and the vertical direction of the Y-axis (from
the wafer surface to the wafer median plane) to define the template;
b) For the edge contour parameters, use the radial direction of the q-axis
(inward from the wafer edge) and the vertical direction of the Z-axis (from
the wafer median plane to the wafer surface) to define the cross section
of the edge contour.
5.5 In SEMI E5, the standard position of the wafer is similar to its position in the
wafer coordinate system, that is, the main positioning reference is downward,
and its bisector is in the negative direction of the Y-axis; the rotational position
of the wafer is defined by the clockwise rotation from the standard position,
which is contrary to the polar coordinate rules of the wafer coordinate system.
In SEMI E5, do not rotate the axis of the coordinate system; the wafer rotates
relative to the axis. In the wafer coordinate system, the coordinate axes are
positioned by the wafer itself, which is not limited by the actual spatial position
of the wafer.
5.6 In GB/T 34479 and YS/T 986, for wafers with reference planes of diameters
of 100 mm, 125 mm and 150 mm, the position of its character field is specified
with reference to the reference plane, instead of the reference wafer center
point; the position of the character field is varied with respect to the center point
of the wafer; the coordinates of the position at the top corner of the character
field (in the wafer coordinate system) may vary from wafer to wafer; the position
of the character field of wafers with slits of diameters of 150 mm, 200 mm and
300 mm are positioned with reference to the wafer center point.
5.7 In some cases, some wafer surfaces without patterns are difficult to be
distinguished of front and back surfaces.
5.8 SEMI E5 describes how a coordinate system reports position data that is to
be transmitted in "Stream 12 - chip image". In addition, the origin of the
coordinate system may be specified by the device when the wafer image is
generated; it may also be one of five positions in the array (namely, upper left
corner, lower left corner, upper right corner, lower right corner, or center). The
"stream" ensures the transfer of any data of the wafer image coordinate system
and the reference point corresponding to the actual wafer; and the wafer
coordinate system can be used to determine the position of the reference point
and the origin of the wafer image coordinate system.
Note: A stream is a contiguous byte sequence of program input or output.
......
Source: Above contents are excerpted from the PDF -- translated/reviewed by: www.chinesestandard.net / Wayne Zheng et al.
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