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GB/T 31469-2015: Semiconductor materials cutting fluid
Status: Valid
| Standard ID | Contents [version] | USD | STEP2 | [PDF] delivered in | Standard Title (Description) | Status | PDF |
| GB/T 31469-2015 | English | 149 |
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Semiconductor materials cutting fluid
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GB/T 31469-2015
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Basic data | Standard ID | GB/T 31469-2015 (GB/T31469-2015) | | Description (Translated English) | Semiconductor materials cutting fluid | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | L90 | | Classification of International Standard | 31-030 | | Word Count Estimation | 7,747 | | Date of Issue | 2015-05-15 | | Date of Implementation | 2016-01-01 | | Quoted Standard | GB/T 601; GB/T 603; GB/T 3143; GB/T 4472-2011; GB/T 6368; GB/T 6678; GB/T 6680; GB/T 6682-2008; GB/T 8170; GB/T 10247; GB/T 11275; GB/T 11446.1; GB/T 12582; GB/T 15346-2012 | | Regulation (derived from) | National Standard Announcement 2015 No. 15 | | Issuing agency(ies) | General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China | | Summary | This Standard specifies the technical requirements, test methods, inspection rules semiconductor material cutting fluid, logo, packaging, storage and transportation requirements. This Standard applies to semiconductor materials cutting wire cutting fluid used. | GB/T 31469-2015: Semiconductor materials cutting fluid---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Semiconductor materials cutting fluid
ICS 31-030
L90
National Standards of People's Republic of China
The semiconductor material cutting fluid
Issued on. 2015-05-15
2016-01-01 implementation
Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China
Standardization Administration of China released
Table of Contents
Preface Ⅰ
1 Scope 1
2 Normative references 1
3 Technical requirements 1
4 Test Method 2
5 Inspection Rules 2
6 signs, packaging, storage and transportation 3
Foreword
This standard was drafted in accordance with GB/T 1.1-2009 given rules.
The standard equipment by the National Standardization Technical Committee and the semiconductor material (SAC/TC203) and focal points.
This standard was drafted. Yangzhou Hua Yuguang V Materials Co., Xi'an Flight News Optical Co., Ltd. Yangzhou Vocational University, Dongfang Electric
Emei Semiconductor Materials Group Co., Ltd., China Electronics Standardization Institute.
Drafters of this standard. Miu Dejun, Xurong Yan, Miao Li Shan, Peng Xinling, Ding Hao, Guo Qian, Pu Xuejun Wang Xiang.
The semiconductor material cutting fluid
1 Scope
This standard specifies the technical requirements, test methods, inspection rules semiconductor material cutting fluid, logo, packaging, storage and transportation
Claim.
This standard applies to semiconductor materials cutting wire cutting fluid used.
2 Normative references
The following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein
Member. For undated references, the latest edition (including any amendments) applies to this document.
Preparation of GB/T 601 chemical reagent standard titration solution
GB/T 603 chemical reagent in test methods - Preparations with
GB/T 3143 Determination of color liquid chemicals (Hazen unit --- platinum - cobalt color number)
Determination of GB/T 4472-2011 Chemical density, relative density
Determination of GB/T 6368 aqueous surfactant solution of pH potentiometric method
GB/T 6678 General Principles for Sampling Chemical Products
GB/T 6680 General rules for sampling liquid chemical products
Laboratory use specifications and test methods GB/T 6682-2008 Analysis
GB/T 8170 repair value expressed about the rules and limit values \u200b\u200band judgment
GB/T 10247 Viscosity Measurement
Determination of GB/T 11275 surfactant water content
GB/T 11446.1 Electronic grade water
GB/T 12582 Determination of the electrical conductivity of liquid hydrocarbons
GB/T 15346-2012 Chemicals Packaging and marking
3 Technical requirements
Semiconductor Materials cutting fluid should meet the technical requirements specified in Table 1.
Table 1 semiconductor and solar-grade crystal materials cutting wire cutting fluid requirements
project
Claim
Type of Type Ⅰ Ⅱ Ⅲ
Appearance colorless or yellowish transparent liquid
Viscosity
mPa · s (25 ℃)
≤40 40 ~ 52 ≥52
density
g/cm3 (25 ℃)
1.103 - 1.118 1.113 - 1.126 1.118 - 1.130
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