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Std ID |
Description (Standard Title) |
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SJ 20646-1997
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The measuring methods of DC/DC converters for hybrid integrated circuits
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SJ 50597/46-1997
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Hybrid integrated circuits Detail specification for type HFB01 transformation circuit of amplitude modulation to phase modulation
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SJ 50597/48-1997
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Hybrid integrated circuits Detail specification for type HMF01 double channel pulse signal isolation and amplification
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SJ 50597/49-1997
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Hybrid integrated circuits Detail specification for type HCHF01 frequency differencing and channel seperation
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SJ 52438/1-1997
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Hybrid integrated circuit detail specification for type HDC28D15/1000 DC/DC converter
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SJ 52438/2-1997
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Hybrid integrated circuit detail specification for type HDC28S5/1000 DC/DC converter
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SJ 52438/4-1997
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Hybrid integrated circuit detail specification for type B - DTV3 temperature - voltage convertor
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SJ 52440/1-1996
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Hybrid integrated circuits detail specification for type M metal DIP for hybrid integrated circuits
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SJ 50597.4-1994
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Detail specification for type JWHF331 JWHF341 and JWHF 351 microwave hybrid integrated amplifier
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SJ 50597/13-1994
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Detail specification for hybrid microcircuits HSH4860 high speed, precision sample/hold amplifier
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SJ 50597/14-1994
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Detail specification for hybrid microcircuits HSH91 precision dual sample/hold amplifier
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SJ 50597/15-1994
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Semiconductor integrated circuits. Detail specification for type JT54LS247 BCD-to-seven segment decoders/drivers of LS-TTL
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SJ/T 10153-1991
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Detail specification for electronic components. Hybrid thick-film integrated circuits, video output circuits, Type HM0004 and HM0190
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SJ/T 10155-1991
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Detail specification for electronic components--Case rated silicon rectifier diode, Type 2CZ58
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SJ/T 10156-1991
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Detail specification for electronic components--Case rated silicon rectifier diode, Type 2CZ59
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SJ 2903-1988
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Detail specification for electronic components--Video amplifiers for type CHM8546 of hybrid thick-film integrated circuits
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SJ 2904-1988
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Detail specification for electronic components--Frame output circuits for type CHM6232 and CHM6236 of hybrid thick-film integrated circuits
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SJ 2905-1988
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Detail specification for electronic components--Voltage established circuits for type CHM9102 of hybrid thick-film integrated circuits
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SJ 2906-1988
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Detail specification for electronic components--High voltage limiting circuits for type CHM7103 of hybrid thick-film integrated circuits
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SJ 2406-1983
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Type designation system for microwave circuits
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SJ 20642.1-1998
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Semiconductor opto-electronic module Detail specification for type GD81 PIN-FET opto-receiver module
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SJ 20642.4-1998
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Semiconductor optoelectronic module Detail specification for type GH81 opto-couplers
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SJ 20642.5-1998
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Semiconductor optoelectronic module Detail specification for type GH82 opto-couplers
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SJ/T 10154-1991
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Detail specification for electronic components--Case rated silicon rectifier diode for Type 2CZ57
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SJ 2154-1982
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Miorocrystal glass substrates for use in thick film integrated circuits
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SJ 2231-1982
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Series and types of direct current voltage regulators for thick-film and thin-film integrated circuits
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SJ 2232-1982
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Specification for metal packages of thick-film and thin-film integrated circuits
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SJ 20279-1993
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Detail specification for types JT54LS08, JT54LS09, JT54LS11, JT54SL15 and JT54LS21 AND gates of LS-TTL semiconductor integrated circuits
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SJ 20280-1993
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Detail specification for types JT54LS00, JT54LS03, JT54LS04, JT54LS05, JT54LS10, JT54LS12, JT54LS20, JT54LS22 and JT54LS30 NAND gates of LS-TTL semiconductor integrated circuits
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SJ/T 10427.1-1993
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Grneral Principles of measuring methods of FM converter for semiconductor audio integrated circuits
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SJ/T 10427.2-1993
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General principles of measuring methods of intermediate-frequency amplifier for semiconductor audio integrated circuits
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SJ 50597/27-1994
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Semiconductor integrated circuits Detail specification for type JC4067 CMOS single 16-channel analog switches
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SJ 21619-2021
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(DC input passive EMI filter test method)
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SJ 21634-2021
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(Semiconductor integrated circuits - Multi-node low-voltage differential signaling (M-LVDS) test methods)
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SJ 21635-2021
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(Semiconductor integrated circuits-Asynchronous dual-port static random access memory (SRAM) test method)
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SJ 21651-2021
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(Performance test method of military UHF passive tag chip)
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SJ 21550-2020
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(High-speed signal transmission performance test method of microelectronic package ceramic housing)
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SJ 21553-2020
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(Three-dimensional heterogeneous integrated fine-pitch micro-bump production technology requirements)
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SJ/Z 21580-2020
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(Implementation Guide for Statistical Process Control Technology of Semiconductor Discrete Devices)
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SJ/T 11701-2018
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Common NAND flash memory interface
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SJ/T 11702-2018
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Semiconductor integrated circuits Measuring methods for serial peripheral interface
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SJ 21345-2018
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(Low temperature low noise amplifier test method)
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SJ 21448-2018
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(Integrated circuit ceramic package pre-bonding inspection requirements)
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SJ 21449-2018
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(Integrated circuit ceramic package pre-installation inspection requirements)
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SJ 21450-2018
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(Integrated circuit ceramic package original film thinning process technical requirements)
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SJ 21451-2018
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(Integrated circuit ceramic package, wafer dicing process technical requirements)
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SJ 21452-2018
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(Integrated circuit ceramic package, chip adhesive bonding, technical requirements)
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SJ 21453-2018
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(Integrated circuit ceramic package gold wire bonding process technical requirements)
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SJ 21454-2018
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(Integrated circuit ceramic package silicon aluminum wire bonding technology technical requirements)
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SJ 21455-2018
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Integrated circuit ceramic package -- Technical requirements for sealing process with alloy-sintering
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SJ 21333-2018
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Ceramic package and metal package Technical requirements for braze process
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SJ 21334-2018
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Ceramic packages and metal packages Technical requirements for nickel electroplating process
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SJ 21366-2018
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(Disposable battery 钽 column housing specifications)
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SJ 21367-2018
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(Disposable lithium battery T-shaped circular pole shell specification)
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SJ 21368-2018
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(Disposable lithium battery split housing specification)
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SJ 21369-2018
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(Disposable lithium battery flat case specification)
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SJ 21379-2018
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(Electromigration effect test method)
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SJ 21380-2018
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(Hot carrier effect test method)
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SJ 21381-2018
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Test method for time dependent dielectric breakdown (TDDB)
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SJ 21382-2018
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(Ion implantation uniformity test method)
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SJ 21383-2018
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(P-N junction isolation test method)
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SJ 21384-2018
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(Capacitor-voltage test method for movable charge of oxide layer)
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SJ 21406-2018
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(Microelectronics packaged ceramic housings)
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SJ 21407-2018
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(Microelectronics package ceramics and metal casings)
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SJ 21408-2018
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(Microelectronic package ceramic housing Laser cutting and marking process technical requirements)
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SJ 21326-2018
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(Technical requirements for ceramic shell plug-in mounting)
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SJ 21327-2018
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(Technical requirements for the mounting process of ceramic shell)
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SJ 21399-2018
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(Microelectronic package ceramic and metal shell assembly inspection requirements)
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SJ 21400-2018
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(Microelectronics packaging ceramics and metal enclosures, metal parts inspection requirements)
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SJ 21401-2018
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(Technical requirements for edging and splitting of microelectronic package ceramic shell)
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SJ 21402-2018
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(Technical requirements for post-brazing treatment of microelectronic package ceramics and metal shells)
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SJ 21495-2018
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(Microelectronic packaging shell packaging technology requirements)
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SJ 21496-2018
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(Technical requirements for gold plating process of microelectronic packaging shell)
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SJ/Z 21325-2018
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(Ceramic Shell Design Guide)
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SJ/Z 21537-2018
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(Semiconductor integrated circuit statistical process control technology implementation guide)
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SJ/Z 21538-2018
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(Implementation Guide of Hybrid Integrated Circuit Statistical Process Control Technology)
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SJ 21058-2016
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(WXF0812-P41 Power Amplifier Chip Specification)
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SJ 21059-2016
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(Specification for WXF0812-P19 Driver Amplifier Chip)
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SJ 21060-2016
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(Specification for WXY0812-06 Type CNC Phase Shifter Chip)
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SJ 21061/1-2016
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(Specification for Ceramic Connectors for RP28D Refrigeration Type Infrared Focal Plane Detectors)
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SJ 21061/2-2016
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(Specification for Ceramic Connectors for RP44 Type Refrigeration Type Infrared Focal Plane Detectors)
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SJ 21061-2016
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(General specification for ceramic connectors for refrigerated infrared focal plane detectors)
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SJ 21062-2016
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(Semiconductor chip product handling, packaging and storage operation requirements)
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SJ 21134-2016
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(Specification for WXF0812-L16 Low Noise Amplifier Chip)
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SJ 21135-2016
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(Specification for WXF0812-L17 Low Noise Amplifier Chip)
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SJ 21136-2016
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(Specification for single - pole three - throw switch chip for WXK0812-103)
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SJ 21137-2016
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(Specification for WXD0812-06 Type Six - digit Control Attenuator Chip)
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SJ 21138-2016
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(Specification for WXX0812-C15 Limiter Chip)
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SJ 50597/65-2016
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(320VC5416 16-bit fixed-point digital signal processor detailed specifications)
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SJ 50597/66-2016
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(320F2812 32-bit fixed-point digital signal processor detailed specifications)
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SJ/T 11585-2016
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(Serial memory interface requirements)
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SJ 21061/3-2016
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Detail specification for type RP64 ceramic connector of cooled infrared focal plane array detector
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SJ 21061/4-2016
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Detail specification for type RP64 ceramic connector of cooled infrared focal plane array detector
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SJ/T 11477-2014
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IP core deliverables specification
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SJ/T 11478-2014
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IP core quality evaluation
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SJ/T 11479-2014
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IP documentation guide
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SJ 50597/62-2006
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Semiconductor integrated circuits detail specification for types JF1558 and JF1558A general dual operational amplifiers
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SJ 50597/63-2006
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Semiconductor integrated circuits detail specification for types JF124 and JF124A quad operational amplifiers
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SJ/Z 11351-2006
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Integrated circuit IP core attributes with formats for profiling, selection and transfer standard
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SJ/Z 11352-2006
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Integrated circuit IP core test data interchange formats and guidelines specification
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