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(High purity copper ingot)
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| YS/T 919-2013 | English | 209 |
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High purity copper ingot
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Standard similar to YS/T 919-2025 GB/T 469 | GB/T 728 | YS/T 817 | YS/T 921 | YS/T 909 | Basic data | Standard ID | YS/T 919-2025 (YS/T919-2025) | | Description (Translated English) | (High purity copper ingot) | | Sector / Industry | Nonferrous Metallurgy Industry Standard (Recommended) | | Classification of Chinese Standard | H62 | | Classification of International Standard | 77.150.30 | | Date of Issue | 2025-08-19 | | Date of Implementation | 2026-03-01 | | Older Standard (superseded by this standard) | YS/T 919-2013 | | Issuing agency(ies) | Ministry of Industry and Information Technology | | Summary | This standard specifies the product grade, technical requirements, test methods, inspection rules, marking, packaging, transportation, storage, and accompanying documents and order form contents for high-purity copper ingots. This standard is applicable to high-purity copper ingots required for manufacturing sputtering targets for semiconductors, display devices, etc. | YS/T 919-2013: High purity copper ingot---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
High purity copper ingot
ICS 77.120.30
H62
People's Republic of China Nonferrous Metals Industry Standard
High copper ingots
Issued on. 2013-10-17
2014-03-01 implementation
Ministry of Industry and Information Technology of the People's Republic of China released
Foreword
This standard was drafted in accordance with GB/T 1.1-2009 given rules.
This standard by the national non-ferrous metals Standardization Technical Committee (SAC/TC243) centralized.
This standard was drafted. Yes REVIEW billion of the new Materials Co., Ltd..
The main drafters. Zhang Tao, Liu Shuqin, yet again Yan, Wang Xinping, Gao Yan, He Xin, Zeng Hao, Wang right, Lei Jifeng, Wang Yongming,
Zhu Xiaoguang, Chen.
High copper ingots
1 Scope
This standard specifies the requirements of high pure copper ingot product, manufacturing conditions, test methods, inspection rules, marking, packaging, transportation, storage, quality
Certificates and contracts (or orders) content.
This standard applies to the manufacture of semiconductor copper target desired high copper ingots. Other industries required high copper ingots can also refer to use.
2 Normative references
The following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein
Member. For undated references, the latest edition (including any amendments) applies to this document.
GB/T 14265 metallic materials hydrogen, oxygen, nitrogen, carbon and sulfur analysis General
YS/T 837 sputtering targets - back binding quality ultrasonic inspection
Determination glow YS/T 922 high copper chemical analysis of trace impurities in the discharge mass spectrometry
3 Requirements
3.1 Categories
High copper ingots chemical composition is divided into four grades. 6N5,6N, 5N, 4N5.
3.2 Chemical Composition Requirements
3.2.1 high copper ingots impurities should be consistent with the requirements specified in Table 1.
Table 1 high impurity content of copper ingots
Grade 6N5 6N 5N 4N5
Copper content (mass fraction) /%, no less than 99.99995 99.9999 99.999 99.995
Impurities/10-4%
no greater than
Ag 0.1 0.3 2 25
Al 0.005 0.05 0.5 -
As 0.01 0.02 0.1 5
Bi 0.01 0.02 0.2 1
Ca 0.01 0.02 0.5 -
Cd 0.05 - 0.1 1
Cl 0.05 - - -
Co 0.02 - 0.3 -
Cr 0.01 0.02 0.1 -
F 0.05 - - 1
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