YS/T 863: Evolution and historical versions
| Standard ID | Contents [version] | USD | STEP2 | [PDF] delivered in | Standard Title (Description) | Status | PDF |
| YS/T 863-2025 | English | RFQ |
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Copper profile for computer cooling systems
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YS/T 863-2025
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| YS/T 863-2013 | English | 319 |
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Copper profiles for computer heat sink
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YS/T 863-2013
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Basic data | Standard ID | YS/T 863-2025 (YS/T863-2025) | | Description (Translated English) | Copper profile for computer cooling systems | | Sector / Industry | Nonferrous Metallurgy Industry Standard (Recommended) | | Classification of Chinese Standard | H62 | | Classification of International Standard | 77.150.30 | | Date of Issue | 2025-04-10 | | Date of Implementation | 2025-11-01 | | Older Standard (superseded by this standard) | YS/T 863-2013 | | Issuing agency(ies) | Ministry of Industry and Information Technology | YS/T 863-2013: Copper profiles for computer heat sink---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Copper profiles for computer heat sink
ICS 77.150.30
H62
People's Republic of China Nonferrous Metals Industry Standard
Computer radiator copper profiles
Issued on. 2013-04-25
2013-09-01 implementation
Ministry of Industry and Information Technology of the People's Republic of China released
Foreword
This standard was drafted in accordance with GB/T 1.1-2009 given rules.
The standard reference adopted EU EN13605.2002 "conductive copper and copper alloy profiles and profile."
This standard by the national non-ferrous metals Standardization Technical Committee (SAC/TC243) centralized.
This standard is drafted by. Foshan Huahong Copper Tube Co., Ltd.
The main drafters of this standard. Kongrui Xiang, Jiang Jie, Liu Yicheng, Jingshuitan Song Zhijian, Ruanlian Ying, Liu Jinxiang, Wang, Yu-hong high.
Computer radiator copper profiles
1 Scope
This standard specifies the requirements for copper profiles with computers, test methods, inspection rules and signs, packaging, transportation, storage, and quality certificate
Contracts (or orders) and so on.
This standard applies to computer use radiator is not greater than the width of 180mm and a thickness of not more than 25mm of copper profiles.
2 Normative references
The following documents for the application of this document is essential. For cited documents with dates, only the dated edition applies to this document.
For undated references, the latest edition (including any amendments) applies to this document.
GB/T 228.1-2010 metal material tensile test - Part 1. room temperature test methods (ISO 6892-1.2009, MOD)
GB/T 231.1 metallic materials Brinell hardness test - Part 1. Test methods
GB/T 2828.1 Sampling procedures for inspection - Part 1. by acceptance quality limit (AQL) retrieval batch inspection sampling plan
GB/T 3048.2 wire and cable electrical performance test methods - Part 2. Metal resistivity test
GB/T 4340.1 metallic materials - Vickers hardness test - Part 1. Test methods
GB/T 5121 (all parts) of copper and copper alloys -
GB/T 5231 Wrought copper and copper alloy chemical composition and shape of the product
GB/T 8888 heavy non-ferrous metal processing products, packaging, labeling, transportation and storage
GB/T 23606 copper embrittlement test methods
GB/T 26303.2 copper and copper alloy processing material Dimensions detection methods - Part 2. rods, wire, profiles
YS/T 478 copper and copper alloy conductivity eddy current testing method
YS/T 482 copper and copper alloy analysis photoemission spectroscopy
3 Requirements
3.1 Categories
3.1.1 grade, status, specifications
Grade profiles, status, size should be in accordance with Table 1. Product cross-section shown in Figure 1.
Table 1 grade profile, status, size
Grade Availability shape state
width
mm
thickness
mm
length
mm
TU1
TU2
T1
T2
TAg0.1
Straight strip
Extruded drawn state (H50)
Semi-hard state (H55)
Hard (H80)
Soft state (O60)
≤180 ≤25 ≤6000
NOTE. If you have other demand-side grade, status, specifications, when desired shape, agreement by both parties.
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