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Database: 189759 (26 Oct 2025)
YS/T 1722-2025 English PDF
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YS/T 1722-2025
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Oxygen-free copper tape for copper clad ceramic substrate
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YS/T 1722-2025
Basic data
Standard ID
YS/T 1722-2025 (YS/T1722-2025)
Description (Translated English)
Oxygen-free copper tape for copper clad ceramic substrate
Sector / Industry
Nonferrous Metallurgy Industry Standard (Recommended)
Classification of Chinese Standard
H62
Classification of International Standard
77.150.30
Date of Issue
2025-04-10
Date of Implementation
2025-11-01
Issuing agency(ies)
Ministry of Industry and Information Technology
Summary
This standard specifies the classification and marking, technical requirements, test methods, inspection rules, marking, packaging, transportation, storage, and accompanying documents and order form contents for oxygen-free copper strips used in copper-clad ceramic substrates. This document applies to oxygen-free copper strips used in the manufacture of power modules and power electronic modules constructed with insulated-gate bipolar transistors (IGBTs).
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