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NB/T 10297-2019: (Technical specification for derating of AC-DC switching power supply electronic components)
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(Technical specification for derating of AC-DC switching power supply electronic components)
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NB/T 10297-2019
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Basic data | Standard ID | NB/T 10297-2019 (NB/T10297-2019) | | Description (Translated English) | (Technical specification for derating of AC-DC switching power supply electronic components) | | Sector / Industry | Energy Industry Standard (Recommended) | | Classification of Chinese Standard | K81 | | Classification of International Standard | 29.200 | | Word Count Estimation | 17,125 | | Date of Issue | 2019 | | Date of Implementation | 2020-05-01 | | Issuing agency(ies) | National Energy Administration | NB/T 10297-2019: (Technical specification for derating of AC-DC switching power supply electronic components)
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Technology specification of AC-DC switching power supply for electronic components derating
ICS 29.200
K 81
NB
Energy Industry Standards of the People's Republic of China
AC-DC switching power supply electronic components derating
specifications
2019-11-04 released
2019-05-01 implementation
Issued by National Energy Administration
Table of contents
Foreword...II
1 Scope...1
2 Normative references...1
3 Terms and definitions...1
4 Derating requirements for electronic components...2
5 Test methods and test requirements...7
Appendix A (informative appendix) Standard temperature derating table...14
Figure 1 Schematic diagram of temperature test...8
Figure 2 Schematic diagram of device temperature test location 1...8
Figure 3 Schematic diagram of device temperature test location 2...9
Figure 4 Schematic diagram of thermocouple...9
Figure 5 Sketch map of surge current test...11
Figure 6 Surge current spike wave...11
Figure 7 Inrush current trapezoidal wave...12
Figure 8 Surge current rectangular wave...12
Figure 9 Surge current pulse wave...12
Figure 10 Surge current arch wave...12
Table 1 Resistance derating requirements...2
Table 2 Capacitor derating requirements...3
Table 3 Diode derating requirements...4
Table 4 Transistor derating requirements...5
Table 5 Micro-integrated circuit derating requirements...5
Table 6 Derating requirements for optoelectronic devices...6
Table 7 Derating requirements for magnetic devices...6
Table 8 Derating requirements for connectors, printed circuit boards, wires, and fuses...7
Table 9 Derating requirements for case temperature...7
Foreword
This standard was drafted in accordance with the rules given in GB/T 1.1-2009.
This standard was proposed by China Electrical Equipment Industry Association.
This standard is under the jurisdiction of the National Electrical Accessories Standardization Technical Committee (SAC/TC 67).
Drafting organizations of this standard. Shenzhen Hangjia Chiyuan Electric Co., Ltd., Jiaxing Weikai Testing Technology Co., Ltd., Hangzhou Hongyan Electric
Co., Ltd., Wanke Electronics (Tianjin) Co., Ltd., Ningbo Bull Optoelectronics Technology Co., Ltd., Guangdong Power Supply Industry Association, China Electric
Scientific Research Institute Co., Ltd., Shenzhen Wattyuan Testing and Research Co., Ltd.
The main drafters of this standard. Luo Yongjin, Lin Zhi, Wang Fengqin, Wang Fang, Wang Jin, Qin Hanjun, Cai Jun, Cao Bingxi, Wu Jinquan, Deng Yi
Cheng, Li Yong, Li Xiqin, Xie Tingting.
AC-DC switching power supply electronic components derating
specifications
1 Scope
This standard specifies the terms and definitions, technical requirements, test methods, and related tests for the derating of electronic components of AC-DC switching power supplies
Equipment requirements and test precautions, etc.
This standard applies to the selection and testing of electronic components of AC-DC switching power supplies, and provides a basis for formulating product standards.
2 Normative references
The following documents are indispensable for the application of this document. For dated reference documents, only the dated version applies to this article
Pieces. For undated references, the latest version (including all amendments) applies to this document.
GB/T 17626.5 Electromagnetic compatibility test and measurement technology surge (impact) immunity test
GB/T 17626.12 Electromagnetic compatibility test and measurement technology oscillating wave immunity test
YD/T 944 Technical requirements and test methods for lightning protection of communication power supply equipment
JB/T 12148-2015 Household and similar use socket with USB charging interface
3 Terms and definitions
The following terms and definitions apply to this document.
3.1
Electronic components
Components that make up a switching power supply, including resistors, capacitors, diodes, transistors, micro-integrated circuits, optoelectronic devices, magnetics
Parts, connectors, printed circuit boards, wires, fuses, shells, etc.
3.2
Surface mount technology
It is a kind of surface mount components (also known as chip components) without leads (wires) or short leads (foot) mounted on the printed circuit board
Circuit assembly technology that uses reflow soldering or dip soldering on the surface or on the surface of other substrates.
3.3
Pulse width modulation
Pulse width modulation is an analog control method, which modulates the bias of the transistor gate or base according to the change of the corresponding load.
The current switching regulator power supply output transistor or the change in the conduction time of the transistor, this method can make the output voltage of the power supply change when the working conditions change
keep constant.
3.4
Thermal resistance Rth
The resistance that heat encounters on the heat flow channel, the ratio of the temperature difference on the heat flow channel to the power dissipation in the channel, reflects the medium or the inter-medium
The heat transfer capacity indicates the temperature rise caused by 1 W power loss, in ℃/W or K/W. Multiply the thermal power dissipation by the thermal resistance to get
Obtain the temperature rise on the heat flow channel.
3.5
Magnetic saturation Bmax
When a magnetic material or a magnetized body is in a magnetized state, the magnetic flux per unit cross-sectional area is called the magnetic flux density, which varies with the magnetizing magnetic field.
When the magnetic field intensity continues to increase but the magnetic flux density no longer increases, the magnetic flux density is called magnetic saturation.
3.6
Derating
The stress that the component bears during use is lower than its rated value, so as to delay the degradation of its parameters and improve the reliability of use. Usually use
Stress ratio and ambient temperature are expressed.
3.7
Rating
The maximum use stress value allowed by the component.
3.8
Stress
Electrical, thermal, and mechanical loads that affect the failure rate of components.
4 Derating requirements for electronic components
If the working state of the components does not exceed the indicators on the specifications provided by the supplier, then the full life of work can be achieved. Use derating,
Can improve the reliability of the product. The important factor that the actual life cannot reach the rated life is that the working conditions of the device are in the worst condition. Worst condition
Condition, that is, the product is under various normal or abnormal working conditions (including high temperature and low temperature environment, input the lowest and highest working voltage,
It is under the most stressful working conditions.
According to product reliability requirements, design maturity and cost requirements, maintenance costs and difficulty, and safety requirements, specify the exchange
-The three derating levels of the main electronic components of the DC switching power supply are as follows.
--Level I. It is the largest derating, which improves the reliability of components the most. Applicable to the following situations. product failure to others
Personnel bring safety hazards or cause serious damage to the application system; have high reliability requirements for products, and adopt new technologies and
Process design; due to cost and technical reasons, the product cannot or should not be repaired after failure; the application system affects the size and weight of the product
There are strict limits on the amount.
--Level Ⅱ. It is a medium derating, which obviously improves the reliability of components. Applicable to the following situations. product failure will be possible
Cause damage to the application system; have high reliability requirements, and use some special designs; need to pay higher maintenance costs.
--Level III. It is the smallest derating, the relative benefit of improving the reliability of the components is the largest, but the absolute effect of improving the reliability
Not as good as grade I and grade II. Applicable to the following situations. the failure of the product will not bring safety hazards to personnel or affect the application system
Cause damage; the product adopts mature standard design; the faulty product can be repaired quickly and economically; the size and weight of the product
There is no big limit to the amount.
Note. Refer to Appendix A for temperature derating calculation.
4.1 Resistance
See Table 1 for resistance derating requirements.
5 Test methods and test requirements
5.1 Device temperature test
5.1.1 The temperature test diagram is shown in Figure 1.
Figure 1 Schematic diagram of temperature test
5.1.2 The requirements for the AC stabilized power supply for testing are as follows.
- Stability < 1%;
--Waveform distortion < 5%;
- Frequency change (< ±1) Hz.
5.1.3 Requirements for test load equipment
A programmable electronic load should be used. If the test product has multiple outputs, an integrated programmable multiple electronic load should be used.
5.1.4 The schematic diagram of the device temperature test location is shown in Figure 2 and Figure 3.
5.1.5 Calculation of core temperature (Tj) of power semiconductor
5.1.6 The temperature test requirements are as follows.
--The exposed metal part of the end of the thermocouple should not be too long, about 0.5 cm, and can not be screwed together to have multiple contact points, as shown in Figure 4
As shown, the metal end of the thermocouple should be in full contact with the device under test when pasting the thermocouple;
Figure 4 Schematic diagram of thermocouple
--When you encounter a part with a heat shrinkable tube, you need to remove the tube, paste the component body and put it back on, and cut off the tube if necessary
a part of;
--Transformers, PFC inductors and other devices covered with insulating skin, need to gently scrape off a small piece of the outer insulating skin until the paint is exposed
Cover the wire, stick the temperature rise wire on the enameled wire;
--Record the temperature change curve of the device until the curve is stable and the temperature change is less than 2 degrees within 30 minutes.
5.2 Device voltage and current stress test
5.2.1 Test purpose
Verify that the maximum working voltage and current stress of the device meet the derating requirements to ensure that the device has sufficient design margin to improve
Product reliability.
5.2.2 The required test equipment is as follows.
--Electronic load machine;
--AC power supply;
--Oscilloscope;
--Voltage probe, differential probe, current probe.
5.2.3 The test steps are as follows.
a) Ensure that the AC power supplied to the power supply under test is isolated separately and cannot share a power supply network with the test equipment.
b) The probe must be reset to zero before testing.
c) The bandwidth of the voltage stress test oscilloscope is set to full bandwidth, and the bandwidth of the current stress test oscilloscope can be set to 20 M.
d) Only one probe can be used to test one device at a time, and the device in the test circuit that is not directly connected to the ground must use a differential probe.
e) Test the stress of the device under various conditions (including minimum and maximum input voltage, power-on, power-off, output short circuit, etc.)
Or abnormal conditions).
5.3 Device power loss test
5.3.1 Test purpose
Since only the surface temperature of the device can be tested, for power devices, the core temperature can be calculated by testing its power loss.
Verify that the derating requirements are met.
5.3.2 MOS tube power loss
5.3.3 Diode power loss
5.3.4 Resistance loss power
5.4 Input surge current test
5.4.1 Test purpose
At the moment the power is turned on, the equivalent impedance of the input filter capacitor is almost zero. At this time, if there is no protection component on the AC input circuit, the input
The current will reach hundreds of amperes, which may cause damage to the input circuit components.
5.4.2 The schematic diagram of surge current test is shown in Figure 5.
Figure 5 Schematic diagram of surge current test
5.4.3 The test steps are as follows.
a) AC input is the maximum working input voltage of the power supply.
b) When the output is full, test the inrush current of the power supply under cold and warm conditions.
c) Calculate the corresponding energy (I2t) according to the shape of the surge current waveform.
5.5 USB socket test
5.5.1 USB female seat temperature rise test
Refers to the result of a separate test of the USB female socket unit under the same voltage, load and environmental conditions.
5.5.2 USB socket plug test
The test method is carried out in accordance with the provisions of 18.2 in JB/T 12148-2015.
5.6 Lightning resistance (or ringing wave) residual voltage test of rectifier bridges, electrolytic capacitors and other devices
5.6.1 Lightning resistance test
The test method is carried out in accordance with the provisions of GB/T 17626.5, the test level is set to common mode ±6 kV, differential mode ±6 kV, and the phases are respectively set. 0 degrees,
90 degree, 180 degree, 270 degree, each phase test 5 times, each time interval is 60 seconds, the equivalent output impedance setting of the signal generator, common mode
The voltage test is 12 Ω, and the differential mode voltage test is 2 Ω. The output load requires a full-load test and a resistive load. The test process
The oscilloscope is used to measure the impulse surge residual voltage of the rectifier bridge, electrolytic capacitor and other devices, and it should meet the requirements in Table 2 and Table 3.
5.6.2 Anti-ringing wave test
The test method is carried out in accordance with the provisions of GB/T 17626.12.Refer to the provisions in 5.6.1 for test levels and setting requirements.
Note. To prevent damage to the oscilloscope, it should be connected to the mains through an isolation transformer.
5.7 Lightning current immunity
The test method is carried out in accordance with YD/T 944, the AC-DC switching power supply input interface should be able to withstand a nominal value of 5 kA (8/20 μS)
The impulse test of the discharge current is carried out between the live wire to the ground wire, the neutral wire to the ground wire, and the live wire to the neutral wire. The impulse current test waveform
The test is repeated 5 times with positive polarity and negative polarity each with an interval of 3 minutes. The output load requires a full load test and is a resistive load.
After the test, the performance of the switching power supply was normal and no component was damaged.
5.8 Shell temperature test
5.8.1 Switching power supply with fan
a) Test under the worst conditions (including input voltage, output load, ambient temperature, etc.)
b) The thermocouple paste position should include the area with the highest temperature of the switching power supply shell, and if necessary, use an infrared thermal imaging tester for analysis.
c) After the temperature curve is stable, the temperature change is less than 2 degrees within 30 minutes, and the temperature test data is recorded.
5.8.2 Switching power supply without fan
a) Test under the worst conditions (including input voltage, output load, ambient temperature, etc.)
b) The thermocouple sticking position should include the area with the highest temperature of the switching power supply shell, and if necessary, use an infrared thermal imaging tester for analysis.
c) The test should be carried out according to the product label upward and product label downward.
d) The test should be carried out in a closed environment without wind and natural convection.
e) After the temperature curve is stable, the temperature change is less than 2 degrees within 30 minutes, and the temperature test data is recorded.
AA
Appendix A
(Informative appendix)
Standard temperature derating table
Derating(%)
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