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HG/T 5051-2025 PDF English

HG/T 5051: Evolution and historical versions

Std ID	Contents [version]	USD	STEP2	[PDF] delivered in	Standard Title (Description)	Status
HG/T 5051-2025	English	RFQ	ASK	3 days [Need to translate]	(Hot melt adhesive for low pressure injection molding encapsulation)	Valid
HG/T 5051-2016	English	169	Add to Cart	3 days [Need to translate]	(Hot - melt adhesives for low - pressure injection molding)	Valid

Standard ID	HG/T 5051-2025 (HG/T5051-2025)
Description (Translated English)	(Hot melt adhesive for low pressure injection molding encapsulation)
Sector / Industry	Chemical Industry Standard (Recommended)
Classification of Chinese Standard	G39
Classification of International Standard	83.180
Date of Issue	2025-12-17
Date of Implementation	2026-07-01
Older Standard (superseded by this standard)	HG/T 5051-2016
Issuing agency(ies)	Ministry of Industry and Information Technology
Summary	This standard specifies the nomenclature and classification, technical requirements, inspection rules, and requirements for packaging, marking, transportation, and storage of hot melt adhesives for low-pressure injection molding, and describes the corresponding test methods. This document applies to polyamide hot melt adhesives for low-pressure injection molding of sensors, connectors, wire harnesses, circuit boards, and other electronic products.