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GBZ41275.22-2023: Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
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Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
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Basic data | Standard ID | GB/Z 41275.22-2023 (GB/Z41275.22-2023) | | Description (Translated English) | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines | | Sector / Industry | National Standard | | Classification of Chinese Standard | V25 | | Classification of International Standard | 49.025.01 | | Word Count Estimation | 62,674 | | Date of Issue | 2023-12-28 | | Date of Implementation | 2024-07-01 | | Issuing agency(ies) | State Administration for Market Regulation, China National Standardization Administration | GBZ41275.22-2023: Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
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GB /Z 41275:22-2023: Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free Solder Part 22: Technical Guidelines
ICS 49:025:01
CCSV25
National Standardization Guiding Technical Documents of the People's Republic of China
Avionics Process Management
Aerospace and defense electronic systems containing lead-free solders
Part 22: Technical Guidelines
containinglead-freesolder-Part 22:Technicalguidelines
Published on 2023-12-28
2024-07-01 Implementation
State Administration for Market Regulation
Released by the National Standardization Administration Committee
Table of contents
Preface V
Introduction VI
1 Scope 1
2 Normative references 1
3 Terms, definitions and abbreviations 1
3:1 Terms and definitions 1
3:2 Abbreviations 6
4 Technical Path 7
5 General properties of lead-free solder 7
5:1 General 7
5:2 High temperature 8
5:3 Low temperature 8
5:4 Temperature cycling 8
5:5 Vibration/mechanical shock 9
6 System-level usage environment 10
6:1 General 10
6:2 Usage environment 10
6:3 Thermal environment of electronic/electrical equipment 10
6:4 Vibration and shock11
6:5 Humidity 11
6:6 Other environments: salt spray, mold, cooling air quality and fluid compatibility11
7 High performance electronic product testing11
8 Solder joint reliability11
8:1 General 11
8:2 Mixing of Solder Alloys and Platings 12
8:3 Lead-free terminals in Sn-Pb solder joints 13
8:4 Sn-Pb terminals in lead-free solder joints 15
8:5 Bismuth Effect15
8:6 Mixed alloy combination test 16
8:7 Establishment of lead-free solder and mixed metallurgical models 17
9 parts 20
9:1 Materials 20
9:2 Temperature evaluation 20
9:3 Notes 20
9:4 Plastic Encapsulated Microcircuit (PEM) Moisture Sensitivity Level (MSL) 20
9:5 Terminal plating 20
9:6 Assembly stress 21
9:7 Hot dip welding 21
10 Printed circuit board 22
10:1 General 22
10:2 Plated hole 22
10:3 Copper dissolution 22
10:4 Laminated materials 23
10:5 Surface coating 23
10:6 Lead-free PCB/PWB process verification 25
10:7 PCB/PWB design considerations for lead-free soldering applications 25
11 Printed Circuit Board (PCB)/Printed Wiring Board (PWB) Assembly 25
11:1 General 25
11:2 PCB/PWB Coupon Board 25
11:3 Welding inspection standards 25
11:4 Flux, Residues, Cleaning and Surface Insulation Resistance 25
12 Module Assembly 31
12:1 Connectors and sockets 31
12:2 Radiator/Module 31
12:3 Conformal coating 31
13 Wire/Cable Assembly32
13:1 Effect of temperature 32
13:2 Cable connector 32
13:3 Wire terminal 32
13:4 Splicing 32
13:5 Bushing 32
14 Rework/Fix 32
14:1 General 32
14:2 Part rework33
14:3 Base level repair 34
14:4 Hybrid solder rework temperature profile 34
14:5 Flux 35
14:6 Rework/Repair Cleaning Process 35
14:7 Inspection requirements 36
15 General product life test 36
15:1 Thermal cycle, vibration and shock testing 36
15:2 Other environments 36
16 Similarity analysis 36
16:1 General 36
16:2 Analysis Project 36
16:3 Test item 37
Appendix A (informative) Structural changes of this document compared with IEC /T S62647-22:201338
Appendix B (informative) Technical differences and reasons between this document and IEC /T S62647-22:2013 39
Appendix C (informative) Equipment usage environment definition 44
Reference 45
Foreword
This document complies with the provisions of GB/T 1:1-2020 "Standardization Work Guidelines Part 1: Structure and Drafting Rules of Standardization Documents"
Drafting:
This document is Part 22 of GB/T (Z) 41275 "Aviation Electronics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free Solder"
point: GB/T (Z)41275 has released the following parts:
---Part 2: Reducing the harmful effects of tin;
---Part 3: System performance test methods containing lead-free solder and lead-free pins;
---Part 4: Ball Grid Array Ball Planting;
---Part 21: Transition Guide to Lead-Free Electronics;
---Part 22: Technical Guidelines;
---Part 23: Guidelines for rework/repair of lead-free and mixed electronic products:
This document is modified to adopt IEC /T S62647-22:2013 "Aviation Electronics Process Management of Lead-free Solders for Aerospace and Defense Electronics Systems"
"System Part 22: Technical Guidelines", the document type was adjusted from IEC 's technical specifications to my country's national standardization guiding technical documents:
Compared with IEC /T S62647-22:2013, this document has many structural adjustments: Comparison of structure number changes in the two files
See Appendix A for the table:
Compared with IEC /T S62647-22:2013, there are many technical differences between this document and the outer margins of the clauses involved:
Indicated with a single vertical line (︱): A list of these technical differences and their causes is provided in Appendix B:
The following editorial changes have been made to this document:
--- Correct the definition of the term 3:1:27 "repair";
---Deleted the Fahrenheit temperature in the full text and retained the Celsius temperature;
---Replaced IEC /T S62647-23 with the informative reference GB /Z 41275:23 (see 14:1:1 and 14:3):
Please note that some content in this document may be subject to patents: The publisher of this document assumes no responsibility for identifying patents:
This document is proposed and coordinated by the National Avionics Process Management Standardization Technical Committee (SAC/TC427):
This document was drafted by: Aviation Industry Corporation of China Leihua Electronic Technology Research Institute, China Aviation Integrated Technology Research Institute, China Aviation Industry Corporation
Luoyang Electro-optical Equipment Research Institute of Air Industry Group Corporation, State-owned Wuhu Machinery Factory, Taiyuan Aviation Instrument Co:, Ltd:, Guangzhou Hanyuan Microelectronics Packaging
MATERIALS LIMITED:
The main drafters of this document: Zhao Bingqian, Zhang Xiaolei, Ren Haitao, Liu Zhanping, Wang Jie, Wang Jinquan, Sun Ke, Pang Jingyu, Lu Bing, Du Wenjie,
Fan Xin, Liu Liangyong, Ren Ye, Duan Yusi, Li Wei, Ning Jiangtian:
Introduction
GB/T (Z) 41275 stipulates the management requirements and technical requirements for lead-free aerospace, national defense and high-performance electronic systems: It is planned to be
Composed of 7 parts:
---Part 1: Preparation of lead-free control plan: The purpose is to provide for lead-free control of programming of aerospace, defense and high-performance electronic systems:
plan goals and requirements:
---Part 2: Reducing the harmful effects of tin: The purpose is to regulate aerospace, defense and high-performance electronic systems to reduce the harmful effects of tin:
The technical methods adopted for the impact:
---Part 3: System performance test methods containing lead-free solder and lead-free pins: The purpose is to regulate lead-free solder and lead-free tubing
Performance test methods and test procedures for aerospace, defense, and high-performance electronic systems:
---Part 4: Ball Grid Array Ball Planting: The purpose is to regulate aerospace, defense and high-performance electrical products containing lead-free solder and lead-free leads:
Requirements for subsystem replacement of ball grid array (BGA) component solder balls:
---Part 21: Transition Guide to Lead-Free Electronics: The purpose is to provide for aerospace and defense electronic system project management or system
A guide for engineering management to manage the transition to lead-free electronics:
---Part 22: Technical Guidelines: The purpose is to provide for aerospace, defense and high-performance electronic systems to ensure continued performance, quality,
Technical guidance for reliability, safety, airworthiness, configuration control, affordability, maintainability, and supportability:
---Part 23: Guidelines for rework/repair of lead-free and mixed electronic products: The purpose is to specify aerospace, defense and high performance electronics
Technical guidelines for disassembly and replacement of parts (including components) during system rework/repair:
Avionics Process Management
Aerospace and defense electronic systems containing lead-free solders
Part 22: Technical Guidelines
1 Scope
This document provides technical guidance for the transition to lead-free electronic products, mainly including technical paths, general performance of lead-free solder, system-level
Operating environment, high-performance electronic product testing, solder joint reliability, components, printed circuit boards, printed circuit boards (PCB)/printed circuit boards
(PWB) assembly, module assembly, wire/cable assembly, rework/repair, general product life test, similarity analysis, etc:
This document is applicable to aerospace, defense and high-performance electronics applications and other high-performance and high-reliability industries for reference use:
2 Normative reference documents
The contents of the following documents constitute essential provisions of this document through normative references in the text: Among them, dated citations
For documents, only the version corresponding to the date applies to this document; for undated referenced documents, the latest version (including all modification orders) applies
in this document:
GB/T 41275:2-2022 Avionics process management Aerospace and defense electronic systems containing lead-free solder Part 2: Reduction
Harmful effects of less tin (IEC /T S62647-2:2012, MOD)
GB/T 41275:3-2022 Avionics process management Aerospace and defense electronic systems containing lead-free solder Part 3: Including
System performance test method for lead-free solders and lead-free pins (IEC TS62647-3:2014, MOD)
IEC /T S62647-1:2012 Avionics process management Aerospace and defense electronic systems containing lead-free solders Part 1: None
taininglead-freesolder-Part 1:Preparationforalead-freecontrolplan)
GEIA-HB-0005-4 Guidelines for Reliability Assessment of Lead-Free Assemblies for Aerospace and High-Performance Electronics Applications (Guidelinesfor
PracticesGuideline)
3 Terms, definitions and abbreviations
3:1 Terms and definitions
The following terms and definitions apply to this document:
3:1:1
Alloy compositionaloycomposition
The total composition of an alloy, defined by weight as a percentage:
Note: For example, 63Sn-37Pb is equivalent to a mixture of 63% (by weight) tin and 37% (by weight) lead:
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