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GB/T 41275.2-2022 English PDF

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GB/T 41275.2-2022: Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin
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GB/T 41275.2-2022English1239 Add to Cart 8 days [Need to translate] Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin Valid GB/T 41275.2-2022

PDF similar to GB/T 41275.2-2022


Standard similar to GB/T 41275.2-2022

GB/T 28878.10   GB/T 28878.9   GB/Z 41275.22   GB/Z 41275.4   GB/T 41275.21   

Basic data

Standard ID GB/T 41275.2-2022 (GB/T41275.2-2022)
Description (Translated English) Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin
Sector / Industry National Standard (Recommended)
Classification of Chinese Standard V25
Word Count Estimation 62,629
Issuing agency(ies) State Administration for Market Regulation, China National Standardization Administration

GB/T 41275.2-2022: Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin


---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2.Mitigation of deleterious effects of tin ICS 49.025.01 CCSV25 National Standards of People's Republic of China Avionics Process Management Aerospace and Defense Electronic Systems with Lead-Free Solder Part 2.Reducing the Harmful Effects of Tin (IEC /T S62647-2.2012, MOD) Published on 2022-03-09 2022-10-01 Implementation State Administration for Market Regulation Released by the National Standardization Administration directory Preface III Introduction IV 1 Scope 1 2 Normative references 1 3 Terms, Definitions and Abbreviations 1 3.1 Terms and Definitions 1 3.2 Abbreviations 4 4 Technical requirements5 4.1 Control level selection 5 4.1.1 Overview 5 4.1.2 Manufacture Control Level 6 4.1.3 COTS Control Level 6 4.1.4 Other control level selection information 6 4.2 Requirements for each control level 6 4.2.1 Level 1 Control Requirements 6 4.2.2 Level 2A control requirements 7 4.2.3 Level 2B control requirements 7 4.2.4 Level 2C Control Requirements 8 4.2.5 Level 3 Control Requirements 9 4.2.6 Requirements for Mitigating Solder Whisker Risk 10 4.3 Implementation method 10 4.3.1 Issue requirements to suppliers with low control levels (applicable to level 2B control requirements, 2C level control requirements and level 3 control requirements) required) 10 4.3.2 Detecting and controlling the introduction of lead-free tin coatings 10 4.3.3 Sample monitoring plan (applicable to Level 2B and Level 2C controls) 10 4.3.4 Requirements for batch monitoring (applicable to Level 3 control) 10 4.4 Methods to reduce the influence of lead-free tin (applicable to Class 2B and Class 2C controls) 11 4.4.1 Overview 11 4.4.2 Hard potting and encapsulation 11 4.4.3 Physical barriers 11 4.4.4 Conformal and other coatings 11 4.4.5 Coverage of proven SnPb soldering processes 11 4.4.6 Circuit and Design Analysis 12 4.5 Part selection process 12 4.6 Assessment and Documentation of Risk and Mitigation Effectiveness12 4.6.1 Overview 12 4.6.2 Evaluation elements 12 4.6.3 Other Risk Analysis Questions 13

Appendix A

(Informative) Guidelines for control levels, risk assessment and link assessment14

Appendix B

(Informative) Technical guidance on detection methods, mitigation methods and methods to limit the harmful effects of tin20

Appendix C

(Informative) Tin whisker detection 30

Appendix D

(Informative) Analysis and Risk Assessment Guidelines37

Appendix E

(Informative) Tin whiskers grown from fillets and solder bulk40

Appendix F

(Informative) Verification Report on Reducing the Hazards of Tin Whiskers in PCB Immersion 47

Appendix G

(Informative) This document is related to IEC /TS 62647-2..2012 Technical Differences and Reasons 52 Reference 53

foreword

This document is in accordance with GB/T 1.1-2020 Provisions of "Standardization Work Guidelines Part 1.Structure and Drafting Rules of Standardization Documents" drafted. This document is GB/T Part 2 of 41275 Avionics Process Management for Aerospace and Defense Electronic Systems Containing Lead-Free Solders. GB/T 41275 has released the following parts. --- Part 2.Reducing the harmful effects of tin; --- Part 3.System performance test methods containing lead-free solder and lead-free pins; --- Part 21.Guidelines for the transition to lead-free electronics. This document is modified to adopt IEC /TS 62647-2.2012 "Avionics Process Management Containing Lead-Free Solder Aerospace and Defense Electronics Department System Part 2.Reducing the Harmful Effects of Tin", the document type is adjusted from ISO technical specifications to my country's national standards. This document is related to IEC /TS Compared with 62647-2.2012, there are many technical differences. In the outer margins of the clauses involved, use A vertical single line (|) is marked. See Appendix G for a list of these technical differences and their reasons. The following editorial changes have been made to this document. --- Added appendix F (informative) verification report on reducing PCB tin whisker hazards. Please note that some content of this document may be patented. The issuing agency of this document assumes no responsibility for identifying patents. This document is sponsored by the National Technical Committee for Standardization of Avionics Process Management (SAC/TC) 427) proposed and managed. This document is drafted by. Luoyang Electro-Optical Equipment Research Institute of China Aviation Industry Corporation, China Aviation Comprehensive Technology Research Institute, Guangzhou Xingyuan Technology Co., Ltd. Sen Express Circuit Technology Co., Ltd., Shenzhen Weiteou New Materials Co., Ltd., the 58th Research Institute of China Electronics Technology Group, Harbin Institute of Technology. The main drafters of this document. Yu Bo, Shao Wentao, Liu Zhanping, Qiao Shuxiao, Wang Helong, Li Weijun, Wang Gang, Wu Xiaoming, Hu Menghai, Jin Ting, Zou Yongchun.

Introduction

GB/T 41275 specifies the management requirements and technical requirements for the realization of lead-free in aerospace, defense and high-performance electronic systems. Consists of 3 parts. --- Part 2.Reducing the harmful effects of tin. The purpose is to regulate aerospace, defense and high performance electronic systems to reduce the harmful effects of tin The technical approach adopted in response. --- Part 3.Test methods for system performance containing lead-free solder and lead-free pins. The purpose is to specify lead-free solder and lead-free pipes Performance test methods and test procedures for aerospace, defense, and high-performance electronic systems for feet. --- Part 21.Guidelines for the transition to lead-free electronics. The purpose is to specify the management or system of the aerospace and defense electronic systems program A working guide for engineering management to manage the transition to lead-free electronics. Lead (Pb) is widely used in electronic solder and electronic component terminals and printed circuit boards. In electronic systems, lead-free tin plating is subject to The growth of tin whiskers will cause various electrical faults such as parameter deviation, short circuit, burnout, etc. After decades of research, people still do not fully understand the principles behind the growth of crystal structures. The European Union (EU) has issued two directives..2002/95/EC "Directive on Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment" (RoHS) and.2002/96/EC The Waste Electrical and Electronic Equipment Directive (WEEE), which restricts or prohibits waste produced after June.2006 Harmful substances such as lead (Pb) are used in the product. Similar "environmental" laws have been enacted in several Asian countries and several states in the United States, and many Asian Electronics manufacturer announces full adoption of "green" production lines. The ban of lead-containing substances has caused many parts and circuit board suppliers to experience Transition of lead-tin (SnPb) surface coatings to pure tin or other lead-free coatings. This document is intended for use in purchasing, designing, manufacturing and servicing electronic assemblies using lead-free tin plated products to document their assurance that the assembly The process of certifying performance, reliability, airworthiness, safety, and reliability. This document provides customers and suppliers with information on electronic system controls A framework for communication and consultation on tin whisker risks. The nature and meaning of "risks" arising from tin whiskers may vary widely to users of this document. As with any risk assessment, in any application In use, the possibility of risk and failure and the consequences of risk and failure need to be considered. In choosing/deciding which controls to use etc. When leveling, the potential whisker failure modes for a particular hardware/system must be carefully considered. This document focuses on the risks of tin whiskers. However, for tin The current state of research on required risk is still unable to provide an accurate quantitative assessment of this risk and reliability. The degree of attention given to the risk of tin whiskers is divided into There are three types of tin materials. unlimited, partially restricted and prohibited. This document is intended to be compatible with IEC /TS 62647-1, IEC /PAS 62647-21 and IEC /PAS 62647-22 for use. proposals, solicitation This document may be cited in proposals, statements of work, contracts and other documents. This document can be used independently or as an IEC /TS 62647-1's part. Avionics Process Management Aerospace and Defense Electronic Systems with Lead-Free Solder Part 2.Reducing the Harmful Effects of Tin

1 Scope

This document specifies the selection of control levels for tin whiskers during mitigation measures to reduce the harmful effects of lead-free tin in electronic systems. selection, requirements for each control level, implementation methods, methods to reduce the impact of lead-free tin, part selection process, risk and mitigation effectiveness assessment and Records and other technical requirements. This document is suitable for aerospace, defense and high-performance electronic applications, and other high-performance and high-reliability electronic industries can refer to use.

2 Normative references

The contents of the following documents constitute essential provisions of this document through normative references in the text. Among them, dated citations For documents, only the version corresponding to that date applies to this document; for undated references, the latest edition (including all amendments) applies in this document. IPC-CC-830 Qualification and Performance of Electrically Insulating Composite Materials for Printed Board Assemblies and of electrical insulating insulating for printed wiring IPC J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies for electrical and assemblies) 3 Terms, Definitions and Abbreviations 3.1 Terms and Definitions The following terms and definitions apply to this document. 3.1.1 Assemblies Electronic products that require electrical connections, including soldering of leads or component terminals. Example. Printed circuit boards and connecting wires. [Source. IEC /TS 62647-1.2012, 3.1] 3.1.2 critical feature A characteristic that, if malfunctioning, could endanger personal safety, cause the failure of a weapon system or a major system to accomplish the required mission. [Source. IEC /TS 62647-1.2012, 3.2] 3.1.3 control level level The level of attention that should be given to the risk of tin whiskers (i.e. no restrictions, partial restrictions and prohibitions on the use of tin materials).

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