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GB/T 4909.12-2009 English PDF

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GB/T 4909.12-2009: Test methods for bare wires -- Part 12: Solderability test of coating -- Solder globule method
Status: Valid

GB/T 4909.12: Evolution and historical versions

Standard IDContents [version]USDSTEP2[PDF] delivered inStandard Title (Description)StatusPDF
GB/T 4909.12-2009English209 Add to Cart 3 days [Need to translate] Test methods for bare wires -- Part 12: Solderability test of coating -- Solder globule method Valid GB/T 4909.12-2009
GB/T 4909.12-1985English279 Add to Cart 3 days [Need to translate] Test methods for bare wires--Solderability test of coating--Solder globule method Obsolete GB/T 4909.12-1985

PDF similar to GB/T 4909.12-2009


Standard similar to GB/T 4909.12-2009

GB/T 4910   GB/T 5585.1   GB/T 5585.2   GB/T 4909.3   GB/T 4909.4   GB/T 4909.11   

Basic data

Standard ID GB/T 4909.12-2009 (GB/T4909.12-2009)
Description (Translated English) Test methods for bare wires -- Part 12: Solderability test of coating -- Solder globule method
Sector / Industry National Standard (Recommended)
Classification of Chinese Standard K11
Classification of International Standard 29.060.10
Word Count Estimation 9,957
Date of Issue 2009-03-19
Date of Implementation 2009-12-01
Older Standard (superseded by this standard) GB/T 4909.12-1985
Quoted Standard GB/T 4909.1-2009
Regulation (derived from) Announcement of Newly Approved National Standards No. 3, 2009 (No. 143 overall)
Issuing agency(ies) General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China
Summary This standard specifies the bare wires Ball France solderability test equipment, sample preparation, measurement procedures, test results and evaluation and so on. This section applies to testing tinned copper surface by molten solder wetting characteristics, this characteristic expressed by a specific time. This part of the method is to use the sample of the molten solder ball split halves cut sample was measured into the sample stream into the solder balls around you to cover the time required for the sample. This time indication weldability of the sample. This part should GB/T 4909. 1-2009 together.

GB/T 4909.12-2009: Test methods for bare wires -- Part 12: Solderability test of coating -- Solder globule method


---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Test methods for bare wires Part 12. Solderability test of coating Solder globule method ICS 29.060.10 K11 National Standards of People's Republic of China Replacing GB/T 4909.12-1985 Test methods for bare wires Part 12. solderability test methods --- balls Posted 2009-03-19 2009-12-01 implementation Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China Standardization Administration of China released

Foreword

GB/T 4909 "Test methods for bare wires" is divided into twelve parts. --- Part 1. General; --- Part 2. size measurement; --- Part 3. Tensile test; --- Part 4. torsion test; --- Part 5. --- bending test repeated bending; --- Part 6. bending test --- unidirectional bending; --- Part 7. winding test; --- Part 8. --- Brinell hardness test method; --- Part 9. continuity of coating --- more sodium sulfide; --- Part 10. Test for continuity of coating --- ammonium persulfate law; --- Part 11. Coating adhesion test; --- Part 12. solderability test methods --- balls. This section GB/T Part of 124,909. This Part replaces GB/T 4909.12-1985 "Test methods for bare wires solderability test ball method." Section compared with the GB/T 4909.12-1985 The main changes are as follows. --- According to GB/T 1.1-2000 requirements, and on the formatting has been modified, and the part of the text has been modified; --- Added "Normative References" chapter (1985 edition no; Chapter 2 of this edition). This part is proposed by the China Electrical Equipment Industrial Association. This part of the National Standardization Technical Committee Wire and Cable (SAC/TC213) centralized. This section is drafted. Shanghai Electric Cable Research Institute, Jiang Su Shengan Cable Co., Ltd., Kunming Cable Co., Ltd., Baosheng Science and Technology Innovation Co., Ltd. Shanghai Yalong Industry Co., Ltd. Hunan to electrical, Shenzhen, China Cable Co., Ltd., no Tin Jiangnan Cable Co., Ltd. Mastery Cable Co., Ltd. and Henan. This section drafted Leader. Lu Sheng Ye, Xing Hai Yong, Sun Ping, HE Wen Jun, Zhang Hui Jiang, Li Bin, Wu Xue-yu, Zhang Peng, Zhang Chuan Province, Shiwan Fu. This part of the standard replaces the previous editions are. --- GB/T 4909.12-1985. Test methods for bare wires Part 12. solderability test methods --- balls

1 Scope

GB/T 4909 provisions of this part of the test equipment of bare wire ball method solderability test, sample preparation, measurement procedures, tests Evaluation results and the like. This section applies to testing tinned copper surface by molten solder wetting characteristics, this characteristic is represented by a specific time. This part of the method is to use a sample of molten solder ball split in half, cut the measurement sample flows into the solder balls to four weeks and the test sample Comp time live coverage required. This time indicates the solderability of the specimen. This section should be used in conjunction with the GB/T 4909.1-2009.

2 Normative references

The following documents contain provisions which, through reference to GB/T 4909 to the present, constitute provisions of this section. For dated reference documents Member, all subsequent amendments (not including errata content) or revisions do not apply to this section, however, encouraged to reach under this section Parties to research agreement to use the latest versions of these documents. For undated reference documents, the latest versions apply to this section. GB/T 4909.1-2009 Test methods for bare wires - Part 1. General

3 Test Equipment

3.1 solderability test device As shown in Figure 1. Design and manufacture of test equipment should be able to guarantee the thermal head temperature maintained at (235 ± 2) ℃.

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