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GB/T 45723-2025 English PDF

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GB/T 45723-2025: Test method for printed board - Monitoring of single plated-through hole (PTH)resistance change during temperature cycling
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Basic data

Standard ID GB/T 45723-2025 (GB/T45723-2025)
Description (Translated English) Test method for printed board - Monitoring of single plated-through hole (PTH)resistance change during temperature cycling
Sector / Industry National Standard (Recommended)
Classification of Chinese Standard L30
Classification of International Standard 31.180
Word Count Estimation 10,136
Date of Issue 2025-05-30
Date of Implementation 2025-12-01
Issuing agency(ies) State Administration for Market Regulation, China National Standardization Administration

GB/T 45723-2025: Test method for printed board - Monitoring of single plated-through hole (PTH)resistance change during temperature cycling


---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
ICS 31.180 CCSL30 National Standard of the People's Republic of China Printed circuit board test method under temperature cycling condition Changes in resistance of a single plated-through hole Published on May 30, 2025, implemented on December 1, 2025 State Administration for Market Regulation The National Standardization Administration issued

Table of contents

Preface III 1 Scope 1 2 Normative references 1 3 Terms and Definitions 1 4 Sample 1 5 Equipment 2 5.1 Reflow soldering machine 2 5.2 Temperature cycle box 2 5.3 Resistance measurement and recording system 2 6 Procedure 3 6.1 Preprocessing 3 6.2 Temperature cycle test 4 6.3 Result determination 5 7 Report 5 8 Additional Information 5

Foreword

This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for standardization work Part 1.Structure and drafting rules for standardization documents" Drafting. This document modifies the IEC 61189-3-719.2016 Test methods for electronic materials, printed boards and other interconnect structures and assemblies Part 1 Part 3-719.Test method for interconnect structures (printed boards) to determine the change in resistance of a single plated hole under temperature cycling conditions. This document has made the following structural adjustments compared to IEC 61189-3-719.2016. ---5.3.1~5.3.3 correspond to 5.3 in IEC 61189-3-719.2016, and 5.3.4 is added; ---6.2.1~6.2.8 correspond to 6.2 in IEC 61189-3-719.2016; ---8.1 corresponds to the second paragraph of 5.3 in IEC 61189-3-719.2016; ---8.2 corresponds to Chapter 8 of IEC 61189-3-719.2016. The technical differences between this document and IEC 61189-3-719.2016 and their reasons are as follows. --- The normative reference documents have been adjusted to adapt to my country's technical conditions. The specific adjustments are as follows. ● GB/T 2036 replaced IEC 60194 (see Chapter 3); ● GB/T 2423.22 replaces IEC 60068-2-14 (see 5.2); ● The contents of IEC 60068-2-58.2015 shall be directly specified in the relevant specifications (see 6.1). --- Added 4-terminal wiring requirements (see Chapter 4), and clarified that the wiring of the measurement wires must comply with the 4-terminal resistance measurement requirements. --- Added low resistance tester (see 5.3.2), which can be used to replace constant current source and voltmeter for 4-terminal resistance test Measurement. --- Added high temperature resistant wire (see 5.3.4) and high temperature resistant wire welding steps (see 6.2.1). High temperature resistant wire is required in the test. Make electrical connections. --- The calculation formula for measuring current has been changed (see Chapter 8), and the calculation formula has been converted to the international system of units to comply with GB/T 1.1-2020 requirements. The following editorial changes were made to this document. ---The standard name has been changed in accordance with my country's printed circuit board professional standard system. Please note that some of the contents of this document may involve patents. The issuing organization of this document does not assume the responsibility for identifying patents. This document was proposed by the Ministry of Industry and Information Technology of the People's Republic of China. This document is under the jurisdiction of the National Printed Circuit Standardization Technical Committee (SAC/TC47). This document was drafted by. Microtek (Changzhou) Products and Services Co., Ltd., Wuxi Synchronous Electronic Technology Co., Ltd., Shengyi Electronics Co., Ltd., China Electronics Technology Standardization Institute, and Tianchang Jingfa Aluminum Co., Ltd. The main drafters of this document are. Zhang Panxin, He Yu, Tang Peng, Ren Yaoru, Cao Yi, and Yu Jinfa. Printed circuit board test method under temperature cycling condition Changes in resistance of a single plated-through hole

1 Scope

This document describes the test method for the resistance of plated-through holes in printed boards under temperature cycling conditions. Durability of plated-through holes under thermo-mechanical stress. This document applies to plated-through holes in printed boards and printed board assemblies.

2 Normative references

The contents of the following documents constitute essential clauses of this document through normative references in this document. For referenced documents without a date, only the version corresponding to that date applies to this document; for referenced documents without a date, the latest version (including all amendments) applies to This document. GB/T 2036 Terminology for printed circuits GB/T 2423.22 Environmental testing Part 2.Test method Test N. Temperature change (GB/T 2423.22-2012, IEC 60068-2-14.2009, IDT)

3 Terms and definitions

The terms and definitions defined in GB/T 2036 apply to this document. 4.Samples The test sample is a double-sided or multi-layer printed circuit board containing a test pattern. Figure 1 is an example of a local test pattern of a 6-layer printed circuit board. Note 1.Hole 1 on the left connects the top layer to the bottom layer (L1 to L6 for a 6-layer board). Note 2.Hole 2 on the left connects the inner layers (L2~L3). Note 3.The middle figure is a reference figure. Note 4.The right side is the measurement wire connection hole, which is connected to the external measurement equipment. Figure 1 Example of local test pattern of 6-layer printed circuit board sample If there are no special provisions in the relevant specifications, a specimen shall have the following characteristics. a) There are 4 single plated-through holes connecting the top layer to the bottom layer (L1~LN) of the printed board, and the corresponding markings are on the drawing.

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