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Printed circuit board materials - Part 5-4: Sectional specification set for conductive foils and films with or without coatings - Conductive pastes
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GB/T 45714.54-2025
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Basic data Standard ID | GB/T 45714.54-2025 (GB/T45714.54-2025) | Description (Translated English) | Printed circuit board materials - Part 5-4: Sectional specification set for conductive foils and films with or without coatings - Conductive pastes | Sector / Industry | National Standard (Recommended) | Classification of Chinese Standard | L30 | Classification of International Standard | 31.180 | Word Count Estimation | 22,281 | Date of Issue | 2025-05-30 | Date of Implementation | 2025-12-01 | Issuing agency(ies) | State Administration for Market Regulation, China National Standardization Administration |
GB/T 45714.54-2025: Printed circuit board materials - Part 5-4: Sectional specification set for conductive foils and films with or without coatings - Conductive pastes ---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
ICS 31.180
CCSL30
National Standard of the People's Republic of China
Printed circuit board materials Part 5-4.Coating or
Specification for conductive pastes for uncoated conductive foils and films
Released on 2025-05-30
2025-12-01 Implementation
State Administration for Market Regulation
The National Standardization Administration issued
Table of contents
Preface III
Introduction V
1 Scope 1
2 Normative references 1
3 Terms and Definitions 1
4 Requirement 2
4.1 Before curing 2
4.2 After curing 2
5 Test methods 4
5.1 Test conditions 4
5.2 Test methods 4
6 Quality Assurance 8
6.1 General 8
6.2 Inspection categories 8
6.3 Test conditions 8
6.4 Identification test 9
6.5 Quality consistency inspection 10
7 Packaging, transportation and storage 12
7.1 Packaging 12
7.2 Transportation 13
7.3 Storage 13
Appendix A (Normative) Comprehensive test diagram 14
Foreword
This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for standardization work Part 1.Structure and drafting rules for standardization documents"
Drafting.
This document is part 5-4 of GB/T 45714 "Printed Circuit Board Materials". GB/T 45714 has been published in the following parts.
--- Part 5-4.Conductive foils and films, coated or uncoated. Sectional specification for conductive pastes.
This document modifies IEC 61249-5-4.1996 "Interconnection structural materials - Part 5.Specifications for coated or uncoated conductive foils and films"
Section 4.Conductive Inks.
This document has made the following structural adjustments compared to IEC 61249-5-4.1996.
--- Chapter 4 and Chapter 5 correspond to Chapter 3 of IEC 61249-5-4.1996, adding 4.1, 4.1.3, 4.2.2.4, 4.2.3.4, 4.2.4,
4.2.6;
---Added Chapter 6 and Chapter 7.
The technical differences between this document and IEC 61249-5-4.1996 and their reasons are as follows.
--- Changed the scope (see Chapter 1) to adapt to the new requirements and technological developments in the current PCB manufacturing process;
--- Deleted the three normative references of IEC 61249-5-4.1996 because they were not cited in the text;
--- Added normative references to GB 190-2009 (see 7.1), GB/T 1725-2007 (see 5.2.4), GB/T 2036 (see
3), GB/T 2423.16-2022 (see 5.2.22), GB/T 4677-2002 (see 5.2.7, 5.2.10.1, 5.2.15, 5.2.17,
6.4.2), GB/T 5547-2007 (see 5.2.2), GB/T 6739-2022 (see 5.2.9), GB/T 1724-2019 (see
5.2.3), GB/T 13557-2017 (see 5.2.10.2), GB/T 21862.5-2008 (see 5.2.5), GB/T 22472-2008
(see 5.2.21), GB/T 26125-2011 (see 4.1.3, 5.2.6), SJ11171-2016 (see 5.2.14), to adapt to my country's
Technical conditions, close to current process needs and quality assurance requirements, increase operability;
--- Added the terms "conductive paste", "square resistance" and "through-hole resistance" and their definitions (see Chapter 3), clarified key terms, and ensured standard descriptions
Be clear and accurate;
--- Added requirements and test methods before curing, including appearance, physical properties, and restricted substance content (see Chapters 4 and 5).
Ensure that the initial state of the material during the curing process meets the requirements;
--- Added requirements and test methods after curing, including appearance, moisture resistance, through-hole resistance, temperature shock test and mildew resistance (see
Chapter 4 and Chapter 5), to meet the needs of the current market;
--- Added "test conditions" in "test methods" (see 5.1), supplemented and improved the inspection test methods for the items added in this document, and clarified
Determine the conditions and procedures for various tests;
--- Added the content of "Quality Assurance" (see Chapter 6), standardized the quality assurance process, and ensured that the products meet the standards;
--- Added the requirements for "packaging, transportation and storage" (see Chapter 7) and improved the material storage requirements;
--- Add Appendix "A" comprehensive test diagram, 6 area diagrams in the diagram are IEC standard Appendix A (normative) diagrams, and the remaining 6 areas are
The domain is an additional test graph (see Appendix A), which visually displays the performance indicators of the material to facilitate understanding and verification.
The following editorial changes were made to this document.
--- In order to coordinate with the existing standards, the name of the standard is changed to "Printed circuit board materials Part 5-4.Coated or uncoated conductive foil
Conductive paste and membrane specifications";
--- Deleted IEC 61249-5-4.1996 Appendix B (informative) and Appendix C (informative), the test methods and
GB/T 4677-2002 has some similar clauses. In order to be closer to the current process requirements and quality control requirements, the original appendix
The content is no longer used as a reference.
Please note that some of the contents of this document may involve patents. The issuing organization of this document does not assume the responsibility for identifying patents.
This document was proposed by the Ministry of Industry and Information Technology of the People's Republic of China.
This document is under the jurisdiction of the National Printed Circuit Standardization Technical Committee (SAC/TC47).
This document was drafted by. Jiangsu Guangxin Photosensitive New Materials Co., Ltd., Zhejiang Zhenyou Electronics Co., Ltd., Jiangnan University, Hangzhou
Lin'an Pengyu Electronics Co., Ltd., China Electronics Technology Standardization Institute.
The main drafters of this document are. Zhu Min, Liu Ren, Qing Yu, An Fenglei, Zha Xiaoying, Zhu Xiaodong, Cao Yi, and Zhan Sihan.
Introduction
Conductive paste products for coated or uncoated conductive foils and films are widely used in printed circuit boards for automotive, medical devices, consumer
This product is designed to analyze the various properties, test methods, quality assurance system and other aspects of the conductive paste in printed circuit board materials.
GB/T 45714 "Printed Circuit Board Materials" is planned to consist of one part.
--- Part 5-4.Sectional specification for coated or uncoated conductive foils and films Conductive pastes. The purpose is to specify coated or uncoated conductive foils and films.
Technical requirements, test methods, storage conditions, etc. of conductive pastes for conductive foils and films.
This document clarifies the performance indicators of conductive paste, formulates scientific and reasonable test procedures, and stipulates appropriate storage conditions.
Standardize the application of conductive paste in printed circuit board materials to ensure high consistency and reliability of product quality to meet different applications.
The release and implementation of this document will provide a solid and reliable basis for quality control for the entire industry chain and effectively promote the industry
The industry will continue to develop in a healthy, orderly and high-quality direction. At the same time, this document will also lay a foundation for technological innovation and product upgrades in related fields.
The foundation promotes the continuous improvement of industrial technology level.
Printed circuit board materials Part 5-4.Coating or
Specification for conductive pastes for uncoated conductive foils and films
1 Scope
This document specifies the performance requirements, test methods, quality assurance, packaging, transportation and storage of conductive pastes.
This document applies to conductive pastes for conductors, through-holes, membrane switches and connection ports of printed circuits.
2 Normative references
The contents of the following documents constitute essential clauses of this document through normative references in this document.
For referenced documents without a date, only the version corresponding to that date applies to this document; for referenced documents without a date, the latest version (including all amendments) applies to
This document.
GB 190-2009 Dangerous Goods Packaging Marking
GB/T 1724-2019 Paints, varnishes and printing inks - Determination of fineness of grind (ISO 1524.2013, MOD)
GB/T 1725-2007 Paints, varnishes and plastics - Determination of non-volatile matter content (ISO 3251.2003, IDT)
GB/T 2036 Terminology for printed circuits
GB/T 2423.16-2022 Environmental testing Part 2.Test methods Test J and guidance. Mildew growth (IEC 60068-2-10.
2018, IDT)
GB/T 4677-2002 Test methods for printed boards (eqvIEC 60326-2.1990)
GB/T 5547-2007 Determination of viscosity of resin finishing agents
GB/T 6739-2022 Paints and varnishes - Determination of film hardness by pencil method (ISO 15184.2020, IDT)
GB/T 13557-2017 Test methods for flexible copper clad materials for printed circuits
GB/T 21862.5-2008 Paints and varnishes - Determination of density - Part 5.Hydrometer method (NFT30-028.1989, IDT)
GB/T 22472-2008 Combustibility test of plastics for instrument and equipment parts (UL94.2001, MOD)
GB/T 26125-2011 Six restricted substances in electrical and electronic products (lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and polybrominated diphenyl ethers)
Determination of (IEC 62321.2008, IDT)
SJ11171-2016 Single-sided and double-sided carbon film printed circuit boards
3 Terms and definitions
The terms and definitions defined in GB/T 2036 and the following apply to this document.
3.1
Conductive paste conductivepastes
A kind of material suitable for screen printing, which is composed of metal powder or non-metallic conductive powder, high molecular organic polymer, organic solvent and additives.
A slurry that is printed or sprayed, applied to a substrate, conductor or hole, and becomes a conductive coating after curing.
3.2
Square resistance
The edge-to-edge resistance of a fully cured square coating of conductive paste of uniform thickness.
Note. Its value is related to the thickness of the coating and the composition of the conductive paste, and has nothing to do with the size of the square. It is expressed in Ω/□.
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