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GB/T 42158-2023: Micro-electromechanical systems technology(MEMS) - Description and measurement methods for micro trench and pyramidal needle structures
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| Standard ID | Contents [version] | USD | STEP2 | [PDF] delivered in | Standard Title (Description) | Status | PDF |
| GB/T 42158-2023 | English | 474 |
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Micro-electromechanical systems technology(MEMS) - Description and measurement methods for micro trench and pyramidal needle structures
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GB/T 42158-2023
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Basic data | Standard ID | GB/T 42158-2023 (GB/T42158-2023) | | Description (Translated English) | Micro-electromechanical systems technology(MEMS) - Description and measurement methods for micro trench and pyramidal needle structures | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | L59 | | Classification of International Standard | 31.080.99 | | Word Count Estimation | 26,237 | | Date of Issue | 2023-03-17 | | Date of Implementation | 2023-07-01 | | Issuing agency(ies) | State Administration for Market Regulation, China National Standardization Administration | GB/T 42158-2023: Micro-electromechanical systems technology(MEMS) - Description and measurement methods for micro trench and pyramidal needle structures
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ICS31:080:99
CCSL59
National Standards of People's Republic of China
GB/T 42158-2023/IEC 62047-26:2016
microelectromechanical systems (MEMS) technology microgrooves and
Description and Measurement of Pyramidal Needle Structure
structures, IDT)
Released on 2023-03-17
2023-07-01 implementation
State Administration for Market Regulation
Released by the National Standardization Management Committee
table of contents
Preface III
1 Scope 1
2 Normative references 1
3 Terms and Definitions 1
4 Description of Microscale Trench Structure 1
4:1 Overview 1
4:2 Symbols and names 2
4:3 Description 3
5 Description of Micrometer-Scale Pyramidal Needle Structures3
5:1 Overview 3
5:2 Symbols and names 4
5:3 Description 5
6 Measurement method 5
Appendix A (Informative) Measurement Examples of Microscale Grooves and Pyramidal Needle Structures 6
Appendix B (informative) Dimensional measurement uncertainty 18
Reference 20
foreword
This document is in accordance with the provisions of GB/T 1:1-2020 "Guidelines for Standardization Work Part 1: Structure and Drafting Rules for Standardization Documents"
drafting:
This document is equivalent to IEC 62047-26:2016 "Micro-electromechanical devices for semiconductor devices - Part 26: Description of micro-trench and needle structures
Description and Measurement Methods":
The following minimal editorial changes have been made to this document:
--- In order to further clarify the scope of application of the standard, the "needle structure" is changed to "pyramidal needle structure": In order to coordinate with the existing standards, the standard
The quasi-name was changed to "Description and Measurement Methods of Micro-Groove and Pyramidal Needle Structures in Micro-Electro-Mechanical Systems (MEMS) Technology";
--- Corrected the error in the original text of IEC 62047-26:2016: In order to clearly show the cross-section of the sample, the "as in 4:2 in A:2:1:2
"As shown in Table 1" is changed to "as shown in Figure 1", and Table 1 of 4:2 does not give a cross-sectional view of the sample:
Please note that some contents of this document may refer to patents: The issuing agency of this document assumes no responsibility for identifying patents:
This document is proposed and managed by the National Micro-Electro-Mechanical Technology Standardization Technical Committee (SAC/TC336):
This document was drafted by: Suzhou Institute of Quality and Standardization, China Machine Productivity Promotion Center Co:, Ltd:, Suzhou Lanxin Micro-Nano Technology Co:, Ltd:
Company, Southeast University, Suzhou Standardization Association, Meimoxinsheng (Hangzhou) Microelectronics Co:, Ltd:, Shenzhen Zhongtu Instrument Co:, Ltd:,
Sichuan Fusheng Electric Co:, Ltd:, Shenzhen Meisi Advanced Electronics Co:, Ltd:, China National Accreditation Center for Conformity Assessment, Shenzhen Daoge
Special Technology Co:, Ltd:
The main drafters of this document: Zhang Shuo, Gu Feng, Li Genzi, Shen Junjie, Yu Xiao, Zhou Zaifa, Wang Minrui, Jia Jianguo, Xu Baihong, Xu Keyu,
Wang Zhiyuan, Liu Zhiguang:
microelectromechanical systems (MEMS) technology microgrooves and
Description and Measurement of Pyramidal Needle Structure
1 Scope
This document describes a microscale trench structure and a pyramidal needle structure and gives examples of measurements of the geometries of both structures: this document
The depth of the middle groove structure is 1 μm-100 μm, the groove width and the groove interval width are both 5 μm-150 μm, and the aspect ratio is 0:0067-20:
Pyramid needle structure has three or four faces, its height, lateral width and longitudinal width are 2 μm or more, and the outer contour size can include
Contained in a cube of side length 100 μm:
This document is applicable to the design of MEMS structures and the evaluation of the geometries after fabrication of MEMS structures:
2 Normative references
This document has no normative references:
3 Terms and Definitions
The following terms and definitions apply to this document:
3:1
Trench structure trenchstructure
Etching on the substrate forms one or more structures whose upper surface is rectangular and whose cross-section is consistent (identical) trapezoidal:
3:2
A pointed convex structure consisting of at least three faces on a planar base, the convex structure being on a vertical face of the planar base
have a plane of symmetry:
3:3
trench array walandtrench
A structure in which two or more trench structures are arranged in parallel at regular intervals:
3:4
corrugated structure scalop
In the deep reactive ion etching (DRIE) process of silicon, polymer passivation protection and bottom selective etching in the trench are repeated multiple times:
The irregular periodic undulating structure of the side wall formed by etching:
4 Description of Microscale Trench Structure
4:1 Overview
This document presents a method for characterizing the cross-sectional geometry of microscale trench structures: Figure 1 shows the cross-sectional view required for characterization: trench junction
The geometric shape of the cross-section of the structure is the cross-sectional shape at the straight line vertically intersecting the groove structure when viewed from the upper surface of the substrate, and the error is ±1° or
smaller:
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